JP2013140876A - 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 - Google Patents
電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 Download PDFInfo
- Publication number
- JP2013140876A JP2013140876A JP2012000502A JP2012000502A JP2013140876A JP 2013140876 A JP2013140876 A JP 2013140876A JP 2012000502 A JP2012000502 A JP 2012000502A JP 2012000502 A JP2012000502 A JP 2012000502A JP 2013140876 A JP2013140876 A JP 2013140876A
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- Prior art keywords
- metal lid
- electronic device
- metallized layer
- ceramic substrate
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 239000002184 metal Substances 0.000 claims abstract description 97
- 229910052751 metal Inorganic materials 0.000 claims abstract description 97
- 239000000463 material Substances 0.000 claims abstract description 85
- 230000002093 peripheral effect Effects 0.000 claims abstract description 45
- 230000001678 irradiating effect Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 79
- 239000010931 gold Substances 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 88
- 238000005219 brazing Methods 0.000 abstract description 40
- 238000005304 joining Methods 0.000 description 43
- 238000000034 method Methods 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 239000010408 film Substances 0.000 description 20
- 229910052759 nickel Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000013078 crystal Substances 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 229910000833 kovar Inorganic materials 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 244000273256 Phragmites communis Species 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000502A JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000502A JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013140876A true JP2013140876A (ja) | 2013-07-18 |
| JP2013140876A5 JP2013140876A5 (enExample) | 2015-01-29 |
Family
ID=49038081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000502A Withdrawn JP2013140876A (ja) | 2012-01-05 | 2012-01-05 | 電子デバイスの製造方法、電子デバイス、圧電発振器、及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013140876A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113716A (ja) * | 2018-03-12 | 2018-07-19 | セイコーエプソン株式会社 | 電子デバイス、電子デバイス用回路基板、電子機器、移動体 |
| JP2020036179A (ja) * | 2018-08-30 | 2020-03-05 | 日本電波工業株式会社 | 圧電デバイス |
| JP7652160B2 (ja) | 2022-09-08 | 2025-03-27 | 株式会社村田製作所 | 電子部品パッケージ及び電子部品パッケージの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179373A (ja) * | 2002-11-27 | 2004-06-24 | Kinseki Ltd | 電子部品パッケ−ジとその封止方法 |
| JP2011066651A (ja) * | 2009-09-17 | 2011-03-31 | Kyocera Kinseki Corp | 圧電デバイス |
-
2012
- 2012-01-05 JP JP2012000502A patent/JP2013140876A/ja not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179373A (ja) * | 2002-11-27 | 2004-06-24 | Kinseki Ltd | 電子部品パッケ−ジとその封止方法 |
| JP2011066651A (ja) * | 2009-09-17 | 2011-03-31 | Kyocera Kinseki Corp | 圧電デバイス |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113716A (ja) * | 2018-03-12 | 2018-07-19 | セイコーエプソン株式会社 | 電子デバイス、電子デバイス用回路基板、電子機器、移動体 |
| JP2020036179A (ja) * | 2018-08-30 | 2020-03-05 | 日本電波工業株式会社 | 圧電デバイス |
| JP7652160B2 (ja) | 2022-09-08 | 2025-03-27 | 株式会社村田製作所 | 電子部品パッケージ及び電子部品パッケージの製造方法 |
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