JP2020177215A - 乱流構造を有するマスクケース - Google Patents
乱流構造を有するマスクケース Download PDFInfo
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- JP2020177215A JP2020177215A JP2019132962A JP2019132962A JP2020177215A JP 2020177215 A JP2020177215 A JP 2020177215A JP 2019132962 A JP2019132962 A JP 2019132962A JP 2019132962 A JP2019132962 A JP 2019132962A JP 2020177215 A JP2020177215 A JP 2020177215A
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- turbulent flow
- mask case
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Library & Information Science (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
図1及び図2を参照する。図1及び図2に示すように、本発明の一実施形態に係る乱流構造を有するマスクケース100は、少なくとも本体1及び蓋体2から構成されてなる。
図3を参照する。図3に示すように、本発明の第2実施形態に係る乱流構造を有するマスクケースは、第1実施形態と異なり、凹部31が本体1に設けられ、凸部32が蓋体2に設けられ、凹部31には、後退した側壁121が一側のみに設けられている。好ましくは、後退した側壁121の後退方向は、気流方向と同じである(矢印で示す)。
また、図4に示すように、本発明の第3実施形態に係る乱流構造を有するマスクケースは、第1実施形態と異なり、凹部31aが蓋体2に設けられ、凸部32aが本体1に設けられている。本体1に設けられた凸部32aの一側には、後退した側壁121aが設けられている。好ましくは、後退した側壁121aの後退方向は、気流方向と同じである(矢印で示す)。
また、図5に示すように、本発明の第4実施形態に係る乱流構造を有するマスクケースは、第3実施形態と異なり、パーティクル収集及び気流攪乱効果を高めるために、凸部32aの両側に後退した側壁121aがそれぞれ設けられてもよい。
図6に示すように、本発明の第5実施形態に係る乱流構造を有するマスクケースの凸部32bの断面は円弧形状であるが、本発明はこれだけに限定されず、凸部の断面は如何なる形状でもよい。
2 蓋体
3 乱流構造
11 フォトマスク配置エリア
12 縁辺領域
22 縁辺領域
31 凹部
31a 凹部
32 凸部
32a 凸部
32b 凸部
33 乱流流路
100 乱流構造を有するマスクケース
121 後退した側壁
121a 後退した側壁
R フォトマスク
S 集塵空間
Claims (9)
- 本体及び蓋体を備え、
前記本体の中央領域には、フォトマスク配置エリアが設けられ、
前記蓋体は、前記本体を閉じ、前記蓋体の縁辺領域と前記本体の縁辺領域とは、凸部及び凹部を介して組み合わされ、前記凹部と前記凸部とが組み立てられると、前記フォトマスク配置エリアを取り囲むように乱流構造が形成され、
前記乱流構造は、前記凹部と前記凸部との間に形成された乱流流路を有し、前記本体は、前記乱流流路が形成された表面上に、少なくとも1つの後退した側壁を有し、もって集塵空間が形成されることを特徴とする、乱流構造を有するマスクケース。 - 前記凹部は、前記本体に設けられ、
前記凸部は、前記蓋体に設けられ、
前記凹部の一側部に、前記後退した側壁が設けられていることを特徴とする請求項1に記載の乱流構造を有するマスクケース。 - 前記凹部の両側部に、前記後退した側壁が設けられていることを特徴とする請求項2に記載の乱流構造を有するマスクケース。
- 前記凹部は、前記蓋体に設けられ、
前記凸部は、前記本体に設けられ、
前記凸部の一側部に、前記後退した側壁が設けられていることを特徴とする請求項1に記載の乱流構造を有するマスクケース。 - 前記凸部の両側部に、前記後退した側壁が設けられていることを特徴とする請求項4に記載の乱流構造を有するマスクケース。
- 前記凸部の断面は矩形状であることを特徴とする請求項1に記載の乱流構造を有するマスクケース。
- 前記凸部の断面は円弧形状であることを特徴とする請求項1に記載の乱流構造を有するマスクケース。
- 前記後退した側壁は、鋭角部を有することを特徴とする請求項1に記載の乱流構造を有するマスクケース。
- 前記後退した側壁は、アールを有することを特徴とする請求項1に記載の乱流構造を有するマスクケース。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108113242 | 2019-04-16 | ||
TW108113242A TWI687760B (zh) | 2019-04-16 | 2019-04-16 | 具有擾流結構的光罩盒 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6757999B1 JP6757999B1 (ja) | 2020-09-23 |
JP2020177215A true JP2020177215A (ja) | 2020-10-29 |
Family
ID=70767219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019132962A Active JP6757999B1 (ja) | 2019-04-16 | 2019-07-18 | 乱流構造を有するマスクケース |
Country Status (5)
Country | Link |
---|---|
US (1) | US11854847B2 (ja) |
JP (1) | JP6757999B1 (ja) |
KR (1) | KR102338455B1 (ja) |
CN (1) | CN111830782A (ja) |
TW (1) | TWI687760B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021173986A (ja) * | 2020-04-24 | 2021-11-01 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
US11249392B2 (en) | 2017-01-25 | 2022-02-15 | Gudeng Precision Industrial Co., Ltd | EUV reticle pod |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI755795B (zh) * | 2020-07-23 | 2022-02-21 | 家登精密工業股份有限公司 | 具有導位構件的光罩盒 |
KR102243065B1 (ko) * | 2020-10-13 | 2021-04-21 | 박종민 | 휴대용 케이스 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007210655A (ja) * | 2006-02-10 | 2007-08-23 | Fujitsu Ltd | 収納ケース |
JP2018120221A (ja) * | 2017-01-25 | 2018-08-02 | 家登精密工業股▲ふん▼有限公司 | 極紫外線フォトマスクポッド |
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-
2019
- 2019-04-16 TW TW108113242A patent/TWI687760B/zh active
- 2019-07-18 JP JP2019132962A patent/JP6757999B1/ja active Active
- 2019-09-06 US US16/562,513 patent/US11854847B2/en active Active
- 2019-11-12 KR KR1020190144551A patent/KR102338455B1/ko active IP Right Grant
- 2019-11-20 CN CN201911141711.XA patent/CN111830782A/zh active Pending
Patent Citations (2)
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JP2007210655A (ja) * | 2006-02-10 | 2007-08-23 | Fujitsu Ltd | 収納ケース |
JP2018120221A (ja) * | 2017-01-25 | 2018-08-02 | 家登精密工業股▲ふん▼有限公司 | 極紫外線フォトマスクポッド |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US11249392B2 (en) | 2017-01-25 | 2022-02-15 | Gudeng Precision Industrial Co., Ltd | EUV reticle pod |
JP2021173986A (ja) * | 2020-04-24 | 2021-11-01 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
JP7176165B2 (ja) | 2020-04-24 | 2022-11-22 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
Also Published As
Publication number | Publication date |
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JP6757999B1 (ja) | 2020-09-23 |
KR20200122213A (ko) | 2020-10-27 |
US20200335371A1 (en) | 2020-10-22 |
US11854847B2 (en) | 2023-12-26 |
KR102338455B1 (ko) | 2021-12-13 |
CN111830782A (zh) | 2020-10-27 |
TW202040263A (zh) | 2020-11-01 |
TWI687760B (zh) | 2020-03-11 |
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