JP2020164877A5 - - Google Patents
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- JP2020164877A5 JP2020164877A5 JP2020107244A JP2020107244A JP2020164877A5 JP 2020164877 A5 JP2020164877 A5 JP 2020164877A5 JP 2020107244 A JP2020107244 A JP 2020107244A JP 2020107244 A JP2020107244 A JP 2020107244A JP 2020164877 A5 JP2020164877 A5 JP 2020164877A5
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- JP
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- Prior art keywords
- formula
- colloidal
- carbon atoms
- amino acid
- particles
- Prior art date
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- 125000004432 carbon atom Chemical group C* 0.000 claims 5
- 239000002245 particle Substances 0.000 claims 5
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N D-alpha-Ala Natural products CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000008119 colloidal silica Substances 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 229940024606 amino acid Drugs 0.000 claims 3
- 235000001014 amino acid Nutrition 0.000 claims 3
- 150000003862 amino acid derivatives Chemical class 0.000 claims 3
- 150000001413 amino acids Chemical class 0.000 claims 3
- 239000002738 chelating agent Substances 0.000 claims 3
- 239000002105 nanoparticle Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- QNAYBMKLOCPYGJ-UWTATZPHSA-N D-alanine Chemical compound C[C@@H](N)C(O)=O QNAYBMKLOCPYGJ-UWTATZPHSA-N 0.000 claims 2
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 2
- 239000003082 abrasive agent Substances 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 2
- 235000003704 aspartic acid Nutrition 0.000 claims 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 claims 2
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 claims 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 1
- 239000004475 Arginine Substances 0.000 claims 1
- 239000004381 Choline salt Substances 0.000 claims 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims 1
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Natural products NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 1
- 239000004471 Glycine Substances 0.000 claims 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 claims 1
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 claims 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 claims 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims 1
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 claims 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 claims 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 claims 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 claims 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 claims 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 claims 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 claims 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 claims 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 claims 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims 1
- 239000004472 Lysine Substances 0.000 claims 1
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 claims 1
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 claims 1
- 239000004473 Threonine Substances 0.000 claims 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 claims 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 229960003767 alanine Drugs 0.000 claims 1
- 125000000129 anionic group Chemical group 0.000 claims 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 claims 1
- 229940000635 beta-alanine Drugs 0.000 claims 1
- 230000002902 bimodal effect Effects 0.000 claims 1
- 230000003115 biocidal effect Effects 0.000 claims 1
- 239000003139 biocide Substances 0.000 claims 1
- KOPBYBDAPCDYFK-UHFFFAOYSA-N caesium oxide Chemical compound [O-2].[Cs+].[Cs+] KOPBYBDAPCDYFK-UHFFFAOYSA-N 0.000 claims 1
- 229910001942 caesium oxide Inorganic materials 0.000 claims 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 claims 1
- 229960001231 choline Drugs 0.000 claims 1
- 235000019417 choline salt Nutrition 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011246 composite particle Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 claims 1
- 235000018417 cysteine Nutrition 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229950010030 dl-alanine Drugs 0.000 claims 1
- 235000013922 glutamic acid Nutrition 0.000 claims 1
- 239000004220 glutamic acid Substances 0.000 claims 1
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 claims 1
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 claims 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 claims 1
- 229960000310 isoleucine Drugs 0.000 claims 1
- 229960003136 leucine Drugs 0.000 claims 1
- 229930182817 methionine Natural products 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims 1
- 150000003248 quinolines Chemical class 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- -1 titanium dioxide Cesium oxide Chemical compound 0.000 claims 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 claims 1
- 239000004474 valine Substances 0.000 claims 1
- 229960004295 valine Drugs 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762546914P | 2017-08-17 | 2017-08-17 | |
| US62/546,914 | 2017-08-17 | ||
| US16/101,869 US11401441B2 (en) | 2017-08-17 | 2018-08-13 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications |
| US16/101,869 | 2018-08-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018153625A Division JP6995716B2 (ja) | 2017-08-17 | 2018-08-17 | 銅及びシリカ貫通電極（ｔｓｖ）用途のための化学機械平坦化（ｃｍｐ）組成物並びにその方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020164877A JP2020164877A (ja) | 2020-10-08 |
| JP2020164877A5 true JP2020164877A5 (enExample) | 2021-09-30 |
Family
ID=63311834
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018153625A Active JP6995716B2 (ja) | 2017-08-17 | 2018-08-17 | 銅及びシリカ貫通電極（ｔｓｖ）用途のための化学機械平坦化（ｃｍｐ）組成物並びにその方法 |
| JP2020107244A Withdrawn JP2020164877A (ja) | 2017-08-17 | 2020-06-22 | 銅及びシリカ貫通電極（ｔｓｖ）用途のための化学機械平坦化（ｃｍｐ）組成物並びにその方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018153625A Active JP6995716B2 (ja) | 2017-08-17 | 2018-08-17 | 銅及びシリカ貫通電極（ｔｓｖ）用途のための化学機械平坦化（ｃｍｐ）組成物並びにその方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11401441B2 (enExample) |
| EP (1) | EP3444309B1 (enExample) |
| JP (2) | JP6995716B2 (enExample) |
| KR (2) | KR102323303B1 (enExample) |
| CN (1) | CN109401631A (enExample) |
| IL (1) | IL261161B2 (enExample) |
| SG (1) | SG10201806977YA (enExample) |
| TW (2) | TW202003732A (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200277514A1 (en) * | 2019-02-28 | 2020-09-03 | Versum Materials Us, Llc | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications |
| US20220332978A1 (en) * | 2019-09-30 | 2022-10-20 | Versum Materials Us, Llc | Low Dishing Copper Chemical Mechanical Planarization |
| EP4189026A4 (en) * | 2020-07-29 | 2024-07-31 | Versum Materials US, LLC | BUFFER-IN-BOTTLE (PIB) TECHNOLOGY FOR CHEMICAL-MECHANICAL PLANARIZATION (CMP) OF COPPER AND THROUGH-SILICON VIA (TSV) |
| WO2022093688A1 (en) * | 2020-10-29 | 2022-05-05 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using the same |
| CN116745375A (zh) * | 2020-12-14 | 2023-09-12 | 弗萨姆材料美国有限责任公司 | 用于铜和硅通孔(tsv)的化学机械平面化(cmp) |
| KR102410845B1 (ko) * | 2021-01-08 | 2022-06-22 | 에스케이씨솔믹스 주식회사 | 반도체 공정용 조성물 및 이를 이용한 반도체 소자 제조방법 |
| JP7596928B2 (ja) * | 2021-05-24 | 2024-12-10 | 信越化学工業株式会社 | 研磨用組成物 |
| CN113789127B (zh) * | 2021-10-20 | 2023-07-28 | 博力思(天津)电子科技有限公司 | 一种硅通孔铜膜抛光液 |
| KR102867479B1 (ko) * | 2022-09-06 | 2025-10-14 | 한국전자기술연구원 | 선택적 연마특성이 향상된 실리콘관통전극의 구리 연마용 슬러리 조성물 |
| WO2025111136A1 (en) | 2023-11-21 | 2025-05-30 | Versum Materials Us, Llc | Eco-friendly biocides for chemical mechanical planarization (cmp) polishing compositions |
| WO2025111138A1 (en) | 2023-11-22 | 2025-05-30 | Versum Materials Us, Llc | Biocides for chemical mechanical planarization (cmp) polishing compositions |
| WO2025122389A1 (en) | 2023-12-07 | 2025-06-12 | Versum Materials Us, Llc | Chemical additives for chemical mechanical planarization (cmp) polishing compositions |
| WO2025175199A1 (en) | 2024-02-16 | 2025-08-21 | Versum Materials Us, Llc | Corrosion inhibitors for metal chemical mechanical planarization (cmp) polishing compositions |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4264781B2 (ja) * | 1999-09-20 | 2009-05-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| SG144688A1 (en) | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| US8003587B2 (en) | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| JP2004071674A (ja) * | 2002-08-02 | 2004-03-04 | Nec Electronics Corp | 半導体装置の製造方法 |
| US7300601B2 (en) | 2002-12-10 | 2007-11-27 | Advanced Technology Materials, Inc. | Passivative chemical mechanical polishing composition for copper film planarization |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| JP2005082791A (ja) * | 2003-09-11 | 2005-03-31 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| US7514363B2 (en) * | 2003-10-23 | 2009-04-07 | Dupont Air Products Nanomaterials Llc | Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use |
| CN1906333A (zh) * | 2004-01-29 | 2007-01-31 | 应用材料公司 | 用于抛光衬底的方法和组合物 |
| KR100614773B1 (ko) * | 2004-12-28 | 2006-08-22 | 삼성전자주식회사 | 화학 기계적 연마 방법 |
| TWI385226B (zh) | 2005-09-08 | 2013-02-11 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 用於移除聚合物阻障之研磨漿液 |
| US8772214B2 (en) | 2005-10-14 | 2014-07-08 | Air Products And Chemicals, Inc. | Aqueous cleaning composition for removing residues and method using same |
| KR101260597B1 (ko) | 2005-12-27 | 2013-05-06 | 히타치가세이가부시끼가이샤 | 금속용 연마액 및 피연마막의 연마 방법 |
| JP2008270584A (ja) * | 2007-04-23 | 2008-11-06 | Nippon Chem Ind Co Ltd | 半導体ウエハ研磨用組成物及び研磨加工方法 |
| KR20100049626A (ko) | 2007-09-03 | 2010-05-12 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 그의 제조 방법, 화학 기계 연마용 수계 분산체를 제조하기 위한 키트, 및 반도체 장치의 화학 기계 연마 방법 |
| US8435421B2 (en) | 2007-11-27 | 2013-05-07 | Cabot Microelectronics Corporation | Metal-passivating CMP compositions and methods |
| US7955520B2 (en) | 2007-11-27 | 2011-06-07 | Cabot Microelectronics Corporation | Copper-passivating CMP compositions and methods |
| WO2009098951A1 (ja) * | 2008-02-07 | 2009-08-13 | Jsr Corporation | 化学機械研磨用水系分散体、および該分散体を調製するためのキット、該キットを用いた化学機械研磨用水系分散体の調製方法、ならびに半導体装置の化学機械研磨方法 |
| JP5625044B2 (ja) | 2009-04-22 | 2014-11-12 | エルジー・ケム・リミテッド | 化学的機械的研磨用スラリー |
| EP2427523B1 (en) | 2009-05-06 | 2015-10-28 | Basf Se | An aqueous metal polishing agent comprising a polymeric abrasive containing pendant functional groups and its use in a cmp process |
| CN103003405B (zh) | 2010-07-19 | 2016-04-13 | 巴斯夫欧洲公司 | 含水碱性清洁组合物及其应用方法 |
| US8980122B2 (en) | 2011-07-08 | 2015-03-17 | General Engineering & Research, L.L.C. | Contact release capsule useful for chemical mechanical planarization slurry |
| US9057004B2 (en) | 2011-09-23 | 2015-06-16 | International Business Machines Corporation | Slurry for chemical-mechanical polishing of metals and use thereof |
| US8734665B2 (en) | 2011-10-12 | 2014-05-27 | International Business Machines Corporation | Slurry for chemical-mechanical polishing of copper and use thereof |
| JPWO2014112418A1 (ja) * | 2013-01-16 | 2017-01-19 | 日立化成株式会社 | 金属用研磨液及び研磨方法 |
| US8974692B2 (en) * | 2013-06-27 | 2015-03-10 | Air Products And Chemicals, Inc. | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications |
| JP6250454B2 (ja) * | 2014-03-27 | 2017-12-20 | 株式会社フジミインコーポレーテッド | シリコン材料研磨用組成物 |
| US10217645B2 (en) | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| CN106929858A (zh) * | 2015-12-31 | 2017-07-07 | 安集微电子科技(上海)有限公司 | 金属化学机械抛光浆料 |
| US10465096B2 (en) * | 2017-08-24 | 2019-11-05 | Versum Materials Us, Llc | Metal chemical mechanical planarization (CMP) composition and methods therefore |
-
2018
- 2018-08-13 US US16/101,869 patent/US11401441B2/en active Active
- 2018-08-15 IL IL261161A patent/IL261161B2/en unknown
- 2018-08-17 TW TW108139403A patent/TW202003732A/zh unknown
- 2018-08-17 CN CN201810940445.6A patent/CN109401631A/zh active Pending
- 2018-08-17 EP EP18189581.4A patent/EP3444309B1/en active Active
- 2018-08-17 SG SG10201806977YA patent/SG10201806977YA/en unknown
- 2018-08-17 KR KR1020180096362A patent/KR102323303B1/ko active Active
- 2018-08-17 TW TW107128768A patent/TWI678402B/zh active
- 2018-08-17 JP JP2018153625A patent/JP6995716B2/ja active Active
-
2020
- 2020-06-22 JP JP2020107244A patent/JP2020164877A/ja not_active Withdrawn
- 2020-10-28 KR KR1020200141157A patent/KR20200125564A/ko not_active Withdrawn
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