JP2020141148A - 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法 - Google Patents
物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
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- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract
Description
以下、第1の実施形態について、図1〜図21(b)を用いて説明する。
次に、第2の実施形態に係る液晶露光装置ついて、図23〜図25を用いて説明する。第2の実施形態に係る液晶露光装置の構成は、基板交換装置の一部の構成及び動作が異なる点を除き、上記第1の実施形態と同じであるので、以下、相違点についてのみ説明し、上記第1の実施形態と同じ構成及び機能を有する要素については、上記第1の実施形態と同じ符号を付してその説明を省略する。
次に、第3の実施形態に係る液晶露光装置ついて、図26〜図29(b)を用いて説明する。第3の実施形態に係る液晶露光装置の構成は、基板交換装置の一部の構成及び動作が異なる点を除き、上記第1の実施形態と同じであるので、以下、相違点についてのみ説明し、上記第1の実施形態と同じ構成及び機能を有する要素については、上記第1の実施形態と同じ符号を付してその説明を省略する。
Claims (1)
- 所定の2次元平面に平行な載置面を有する保持部材の前記載置面に、物体を搬送する物体搬送方法であって、
前記保持部材を所定位置に位置させることと、
前記物体を、前記所定位置に位置した前記保持部材の上方に、搬送装置を用いて搬送することと、
前記搬送装置によって搬送された前記物体の前記2次元平面に平行な方向の位置を、前記所定受渡位置に位置した前記保持部材の上方でアシスト装置を用いて拘束することと、
前記搬送装置を制御することによって前記物体を自重により下方に移動させて、前記載置面に前記物体を支持させることと、
前記アシスト装置を前記物体を拘束した状態で前記物体とともに下方に移動させることと、を含む物体搬送方法。
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JP2015069015 | 2015-03-30 | ||
JP2015069015 | 2015-03-30 |
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JP2017510091A Division JP6712411B2 (ja) | 2015-03-30 | 2016-03-30 | 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法 |
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JP2020094197A Pending JP2020141148A (ja) | 2015-03-30 | 2020-05-29 | 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法 |
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US (1) | US10752449B2 (ja) |
JP (2) | JP6712411B2 (ja) |
KR (1) | KR102569618B1 (ja) |
CN (1) | CN107466381B (ja) |
TW (1) | TWI735438B (ja) |
WO (1) | WO2016159062A1 (ja) |
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KR102295115B1 (ko) * | 2016-09-30 | 2021-08-27 | 가부시키가이샤 니콘 | 반송 장치, 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 반송 방법 |
JP6842689B2 (ja) * | 2016-12-05 | 2021-03-17 | 三星ダイヤモンド工業株式会社 | 搬送装置およびスクライブシステム |
EP3577525A1 (en) * | 2017-02-03 | 2019-12-11 | ASML Netherlands B.V. | Exposure apparatus |
CN108502543B (zh) * | 2017-02-28 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 一种基板传输装置及方法 |
TWI621853B (zh) * | 2017-04-28 | 2018-04-21 | Main Science Machinery Company Ltd | Wafer inspection positioning device |
TWI654704B (zh) | 2017-08-07 | 2019-03-21 | 煜峰投資顧問有限公司 | 一種基板輸送系統及使用該系統輸送基板之方法 |
CN111033715A (zh) * | 2017-08-25 | 2020-04-17 | 株式会社日本制钢所 | 激光照射装置 |
CN116520649A (zh) * | 2017-09-29 | 2023-08-01 | 株式会社尼康 | 基板搬运、曝光装置、方法、平板显示器及元件制造方法 |
CN111149059B (zh) * | 2017-09-29 | 2022-08-26 | 株式会社尼康 | 基板搬运、曝光装置、方法、平板显示器及元件制造方法 |
WO2019064585A1 (ja) * | 2017-09-29 | 2019-04-04 | 株式会社ニコン | 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法 |
WO2019064577A1 (ja) * | 2017-09-29 | 2019-04-04 | 株式会社ニコン | 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法 |
JP7196734B2 (ja) * | 2019-03-29 | 2022-12-27 | 株式会社ニコン | 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法 |
CN111547504B (zh) * | 2020-05-15 | 2021-09-03 | 苏州精濑光电有限公司 | 一种产品双面全检设备及其检测方法 |
TWI749802B (zh) * | 2020-10-08 | 2021-12-11 | 南亞科技股份有限公司 | 輸送裝置 |
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