JP2020123639A5 - - Google Patents
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- Publication number
- JP2020123639A5 JP2020123639A5 JP2019013765A JP2019013765A JP2020123639A5 JP 2020123639 A5 JP2020123639 A5 JP 2020123639A5 JP 2019013765 A JP2019013765 A JP 2019013765A JP 2019013765 A JP2019013765 A JP 2019013765A JP 2020123639 A5 JP2020123639 A5 JP 2020123639A5
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- radiating member
- heat
- main surface
- curve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 14
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019013765A JP7116690B2 (ja) | 2019-01-30 | 2019-01-30 | 放熱部材およびその製造方法 |
| CN202080006007.8A CN112997300B (zh) | 2019-01-30 | 2020-01-29 | 散热构件及其制造方法 |
| PCT/JP2020/003090 WO2020158775A1 (ja) | 2019-01-30 | 2020-01-29 | 放熱部材およびその製造方法 |
| EP20747772.0A EP3920214B1 (en) | 2019-01-30 | 2020-01-29 | Heat-dissipating member and manufacturing method for same |
| US17/425,541 US12069837B2 (en) | 2019-01-30 | 2020-01-29 | Heat dissipation member and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019013765A JP7116690B2 (ja) | 2019-01-30 | 2019-01-30 | 放熱部材およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019105349A Division JP6591114B1 (ja) | 2019-06-05 | 2019-06-05 | 放熱部材およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020123639A JP2020123639A (ja) | 2020-08-13 |
| JP2020123639A5 true JP2020123639A5 (https=) | 2022-03-01 |
| JP7116690B2 JP7116690B2 (ja) | 2022-08-10 |
Family
ID=71841807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019013765A Active JP7116690B2 (ja) | 2019-01-30 | 2019-01-30 | 放熱部材およびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12069837B2 (https=) |
| EP (1) | EP3920214B1 (https=) |
| JP (1) | JP7116690B2 (https=) |
| CN (1) | CN112997300B (https=) |
| WO (1) | WO2020158775A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12236571B2 (en) | 2021-10-05 | 2025-02-25 | Raytheon Company | Integrated Dewar assembly with compliant endcap cooling |
| US12306455B2 (en) | 2021-10-05 | 2025-05-20 | Raytheon Company | Multiaxial thermal dissipation and structurally-compliant device |
| WO2023058598A1 (ja) * | 2021-10-06 | 2023-04-13 | デンカ株式会社 | 放熱部材 |
| CN114851352B (zh) * | 2022-05-23 | 2023-11-28 | 松山湖材料实验室 | 电阻加热元件及其制造方法 |
| EP4654259A1 (en) | 2023-02-27 | 2025-11-26 | Denka Company Limited | Ceramic plate, package, ceramic plate manufacturing method, module, and electric/electronic component |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS468358B1 (https=) | 1967-01-27 | 1971-03-02 | ||
| JP3468358B2 (ja) | 1998-11-12 | 2003-11-17 | 電気化学工業株式会社 | 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品 |
| JP2002246515A (ja) | 2001-02-20 | 2002-08-30 | Mitsubishi Electric Corp | 半導体装置 |
| JP4267947B2 (ja) * | 2003-03-19 | 2009-05-27 | 日本碍子株式会社 | ハニカム構造体 |
| JP3907620B2 (ja) | 2003-11-14 | 2007-04-18 | 電気化学工業株式会社 | セラミックス回路基板一体型アルミニウム−炭化珪素質複合体及びその製造方法 |
| JP5144279B2 (ja) * | 2006-01-13 | 2013-02-13 | 電気化学工業株式会社 | アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品 |
| CN101427367B (zh) | 2006-04-26 | 2010-06-02 | 电气化学工业株式会社 | 铝-碳化硅复合体和使用该复合体的散热零件 |
| JP4864593B2 (ja) | 2006-08-08 | 2012-02-01 | 電気化学工業株式会社 | アルミニウム−炭化珪素質複合体の製造方法 |
| EP1930061B1 (en) * | 2006-12-07 | 2018-10-03 | NGK Insulators, Ltd. | Bonding material composition and method for manufacturing the same, and joined body and method for manufacturing the same |
| JP2010227755A (ja) * | 2009-03-26 | 2010-10-14 | Ngk Insulators Ltd | セラミックハニカム構造体 |
| US8865607B2 (en) * | 2010-11-22 | 2014-10-21 | Saint-Gobain Ceramics & Plastics, Inc. | Infiltrated silicon carbide bodies and methods of making |
| KR102232098B1 (ko) * | 2013-10-10 | 2021-03-24 | 미쓰비시 마테리알 가부시키가이샤 | 히트 싱크가 부착된 파워 모듈용 기판 및 그 제조 방법 |
| EP3104406B1 (en) | 2014-02-03 | 2019-04-03 | Denka Company Limited | Power module |
| US11296008B2 (en) | 2014-07-31 | 2022-04-05 | Denka Company Limited | Aluminum-silicon carbide composite and production method therefor |
| JP6645966B2 (ja) | 2014-08-06 | 2020-02-14 | デンカ株式会社 | 放熱部品及びその製造方法 |
| CN115172290B (zh) | 2016-07-14 | 2024-12-13 | 株式会社东芝 | 陶瓷电路基板及半导体模块 |
| US11147156B2 (en) * | 2016-12-06 | 2021-10-12 | Sumitomo Electric Industries, Ltd. | Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member |
| JP6717238B2 (ja) | 2017-03-07 | 2020-07-01 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板 |
| US11094648B2 (en) | 2017-08-04 | 2021-08-17 | Denka Company Limited | Power module |
| JP6646116B2 (ja) | 2018-08-09 | 2020-02-14 | 株式会社カプコン | 映像音声処理プログラム及びゲーム装置 |
| JP7199988B2 (ja) * | 2019-02-08 | 2023-01-06 | 日本碍子株式会社 | ハニカム構造体の製造方法 |
| FR3094039B1 (fr) * | 2019-03-21 | 2021-03-19 | Faurecia Systemes Dechappement | Organe de chauffage durable pour dispositif de purification des gaz d’échappement d’un véhicule |
| JP6591114B1 (ja) | 2019-06-05 | 2019-10-16 | デンカ株式会社 | 放熱部材およびその製造方法 |
-
2019
- 2019-01-30 JP JP2019013765A patent/JP7116690B2/ja active Active
-
2020
- 2020-01-29 US US17/425,541 patent/US12069837B2/en active Active
- 2020-01-29 CN CN202080006007.8A patent/CN112997300B/zh active Active
- 2020-01-29 WO PCT/JP2020/003090 patent/WO2020158775A1/ja not_active Ceased
- 2020-01-29 EP EP20747772.0A patent/EP3920214B1/en active Active
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