JP5144279B2 - アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品 - Google Patents
アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品 Download PDFInfo
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- JP5144279B2 JP5144279B2 JP2007553840A JP2007553840A JP5144279B2 JP 5144279 B2 JP5144279 B2 JP 5144279B2 JP 2007553840 A JP2007553840 A JP 2007553840A JP 2007553840 A JP2007553840 A JP 2007553840A JP 5144279 B2 JP5144279 B2 JP 5144279B2
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- aluminum
- base plate
- silicon carbide
- composite
- power module
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- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 108
- 239000002131 composite material Substances 0.000 title claims description 94
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 title claims description 66
- 230000017525 heat dissipation Effects 0.000 title description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 53
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 53
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 42
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- 238000000227 grinding Methods 0.000 claims description 15
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- 238000005304 joining Methods 0.000 claims description 4
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- 229910000838 Al alloy Inorganic materials 0.000 description 26
- 238000000137 annealing Methods 0.000 description 20
- 238000012545 processing Methods 0.000 description 14
- 238000005470 impregnation Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 239000010432 diamond Substances 0.000 description 9
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
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- 239000010949 copper Substances 0.000 description 5
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- 239000010703 silicon Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
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- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- 238000005238 degreasing Methods 0.000 description 1
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- 238000007772 electroless plating Methods 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
2 アルミニウム合金、
3 貫通穴、
4 表面アルミニウム層、
5 皿穴
6 タップネジ穴、
原料である炭化珪素粉末(必要に応じて例えばシリカ等の結合材を添加する)を、成形、焼成してプリフォームを作製する。このプリフォームを積層して一つのブロックとする方法は特に限定されるものではないが、例えば、次の方法が挙げられる。前記プリフォームを、離型剤を塗布した離型板で挟み積層して一つのブロックとする方法、前記プリフォームの片面または両面に、アルミナまたはシリカを主成分とする繊維、及び、球状または破砕形状の粒子を直接接するように配置し、離型板で挟み、一つのブロックとする方法、更には、前記プリフォームを型枠内に収める際に、片面または両面にアルミナまたはシリカを主成分とする繊維、及び/又は、球状または破砕形状の粒子を直接接するように配置した後、型枠内に収め、離型板で挟み積層して一つのブロックとする方法である。
炭化珪素粉末A(太平洋ランダム社製:NG−220、平均粒径:60μm)210g、炭化珪素粉末B(屋久島電工社製:GC−1000F、平均粒径:10μm)90g、及びシリカゾル(日産化学社製:スノーテックス)30gを秤取し、攪拌混合機で30分間混合した後、190mm×140mm×5.8mmの寸法の平板状に圧力10MPaでプレス成形した。
得られた成形体を、温度120℃で2時間乾燥後、大気中、温度900℃で2時間焼成して、相対密度が65%のSiCプリフォームを得た。得られたSiCプリフォームは、平面研削盤でダイヤモンド製の砥石を用いて、表1に示す厚みに面加工した後、マシニングセンターで図2の1に示す形状に外周部を加工した。なお、図2はアルミニウム−炭化珪素質複合体を横断面(A−A断面のB−B’部)で模式的に示したものである。図1及び図3〜5も同様である。
次に、得られた加工体は、加工時の歪み除去のために、電気炉で530℃の温度で1時間アニール処理を行った。次いで、圧力0.4MPa、搬送速度1.0m/minの条件でアルミナ砥粒にてブラスト処理を行い清浄化した後、無電解Ni−P及びNi−Bめっきを行った。これにより、複合体表面に8μm厚(Ni−P:6μm+Ni−B:2μm)のめっき層を形成した。
炭化珪素粉末C(太平洋ランダム社製:NG−150、平均粒径:100μm)195g、炭化珪素粉末B(屋久島電工社製:GC−1000F、平均粒径:10μm)105g、及びシリカゾル(日産化学社製:スノーテックス)30gを原料として用いた以外は、実施例1と同様の方法で相対密度が66%のSiCプリフォームを得た。得られたSiCプリフォームは、平面研削盤でダイヤモンド製の砥石を用いて、表3の厚みに面加工した後、マシニングセンターで図3の1に示す形状に外周部及び穴部を加工した。
SiCプリフォーム形状を190×140×5.3mmとした以外は、実施例5と同様の方法でアルミニウム−炭化珪素質複合体を作製した。得られた複合体は、平面研削盤にてダイヤモンド製の砥石を用いて片面を0.3mm研削加工した後、縁周部8カ所に直径7mmの貫通穴3、4カ所に直径4mmのタップネジ穴6を加工し、外周部をウォ−タ−ジェット加工機にて187×137mm(コーナー部はR7mm)に加工した(図4参照)。次に、加工時の歪み除去のために、電気炉で530℃の温度で1時間アニール処理を行った。次いで、圧力0.4MPa、搬送速度1.0m/minの条件でアルミナ砥粒にてブラスト処理を行い清浄化した後、無電解Ni−P及びNi−Bめっきを行った。複合体表面に8μm厚(Ni−P:6μm+Ni−B:2μm)のめっき層を形成した。得られた複合体について実施例1と同様の評価を行った。結果を表5に示す。
実施例5のSiCプリフォーム形状を190×140×5.3mmとし、穴加工を行わずに用いる以外は、実施例5と同様の方法でアルミニウム−炭化珪素質複合体を作製した。得られた複合体は、平面研削盤にてダイヤモンド製の砥石を用いて片面0.3mm研削加工した後、ウォータージェット加工機にて縁周部8カ所に直径7mmの貫通穴3を形成し、外周部を187×137mm(コーナー部はR7mm)に加工した。(図5参照)次いで、実施例5と同様の方法で、アニール処理、ブラスト処理、めっき処理を行った。得られた複合体について実施例1と同様の評価を行った。結果を表6に示す。
実施例5のSiCプリフォーム形状を180×110×5.3mm(図1参照)に変更した以外は、実施例5と同様の方法でアルミニウム−炭化珪素質複合体を作製し、機械加工、めっき処理を行った。得られた複合体について実施例1と同様の評価を行い、その結果を表7に示す。
実施例1のアルミニウム−炭化珪素質複合体を、穴加工、湯口切断、平面加工した後に、該複合体に反りを付与するため、カーボン製で曲率半径が10000mmの球面を有する凹型及び凸型を準備した。この凹型及び凸型を熱プレス機に装着し、加熱して型の表面温度を510℃とした。この凹型と凸型の間に前記複合体を配置し40KPaでプレスした。この際、複合体の側面に熱電対を接触させ測温した。複合体の温度が500℃になった時点から3分間保持後、加圧を解除し、50℃まで自然冷却した。得られた複合体の凸面側(研削加工面)の反りを測定した結果、長さ10cm当たりの反り量が140μmであった。
実施例1のアルミニウム−炭化珪素質複合体を、穴加工、湯口切断後に、ダイヤモンド製の砥石を用いて、その片面をマシニングセンターで曲率半径15000mmの凸面に研削加工した。次に、加工時の歪み除去のために、電気炉で530℃の温度で1時間アニール処理を行った。得られた複合体の凸面側(研削加工面)の反りを測定した結果、長さ10cm当たりの反り量が120μmであった。
なお、2006年1月13日に出願された日本特許出願2006−005475号の明細書、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。
Claims (10)
- 平板状の炭化珪素質多孔体にアルミニウムを主成分とする金属を含浸してなるアルミニウム−炭化珪素質複合体であって、一主面にのみアルミニウムを主成分とする金属からなるアルミニウム層を有し、該アルミニウム層の平均厚みが1〜500μmであり、他の主面である裏面はアルミニウム層の研削加工によりアルミニウム−炭化珪素質複合体が露出しており、露出しているアルミニウム−炭化珪素質複合体の形状が長方形又は長方形に外周部の穴部を取り囲む部分が付加された形状であり、かつ、裏面の反り量が長さ10cmあたり0〜200μmであることを特徴とするパワーモジュール用ベース板。
- 外周部が、アルミニウムを主成分とする金属層、或いは、セラミックス繊維、セラミックス粒子及びアルミニウムを主成分とする金属との複合体からなる請求項1に記載のパワーモジュール用ベース板。
- 外周部が、アルミニウムを主成分とする金属層、或いは、セラミックス繊維、セラミックス粒子及びアルミニウムを主成分とする金属との複合体からなり、該外周部に穴部が設けられている請求項2に記載のパワーモジュール用ベース板。
- 外周部は、アルミニウム−炭化珪素質複合体が露出している請求項1に記載のパワーモジュール用ベース板。
- 裏面の窪み深さが50μm以下である請求項1〜4のいずれか1項に記載のパワーモジュール用ベース板。
- 前記アルミニウム層の平均厚みが1〜100μmであり、かつ、厚みの最大値と最小値の差が80μm以下である請求項1〜5のいずれか1項に記載のパワーモジュール用ベース板。
- 熱伝導率が180W/mK以上、及び、熱膨張係数が10×10−6/K以下である請求項1〜6のいずれか1項に記載のパワーモジュール用ベース板。
- アルミニウム−炭化珪素質複合体が高圧鍛造法で製造されることを特徴とする請求項1〜7のいずれか1項に記載のパワーモジュール用ベース板。
- 前記炭化珪素質多孔体のベース板面内に占める面積がベース板の面積の70%以上である請求項1〜8のいずれか1項に記載のパワーモジュール用ベース板。
- 請求項1〜9のいずれか1項に記載のパワーモジュール用ベース板表面にNiめっき処理を施して厚さ1〜20μmのめっき皮膜を形成し、該めっき皮膜が形成されたベース板に半導体搭載用セラミックス基板を接合してなる放熱部品。
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US8025962B2 (en) | 2011-09-27 |
EP1973157B1 (en) | 2017-06-21 |
CN101361184A (zh) | 2009-02-04 |
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