JP2020097774A - 電力半導体接合用焼結ペースト組成物 - Google Patents
電力半導体接合用焼結ペースト組成物 Download PDFInfo
- Publication number
- JP2020097774A JP2020097774A JP2019142961A JP2019142961A JP2020097774A JP 2020097774 A JP2020097774 A JP 2020097774A JP 2019142961 A JP2019142961 A JP 2019142961A JP 2019142961 A JP2019142961 A JP 2019142961A JP 2020097774 A JP2020097774 A JP 2020097774A
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- Prior art keywords
- power semiconductor
- paste composition
- sintered paste
- metal powder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
Description
特許文献2:日本国特許 第6323587号(2018.04.20. 登録)
特許文献3:日本国特許 第6380792号(2018.08.10. 登録)
特許文献4:日本国公開特許 第2017-103180号(2017.06.08. 公開)
特許文献5:韓国特許 第10-1381249号(2014.03.28. 登録)
<焼結ペースト製造>
溶媒にバインダー、還元剤及び極少量の接着増進剤を混合し、インペラで3時間の間、攪拌して溶媒を製造した。以後、銅(Cu)(第1金属粉末)と、SAC305, Sn coated Cu(第2金属粉末)及びTiN(ナノセラミック粉末)を混合して、高速分散器を用いて溶媒に1次的に分散した。最後に、1次的に製造された金属ペーストをRoll Millを用いて2次分散して焼結ペーストを製造した。
製造された焼結ペーストをDBC基板に塗布してSiC chipをマウントし、150Nで加圧して炭化炉を用いて350℃で約1時間の間焼結させた後、空冷して接合強度試片を製造した。焼結は350℃まで10℃/minの条件で不活性雰囲気で進行し、150℃以下の温度で空冷した。参考として、図1には、このような接合強度試片の模式図を示した。
<焼結ペースト電力駆動試片の製造>
実施例1で製造された焼結ペーストを、TO−247パッケージ形態のCu フレームに塗布した後、SiC Chipを実施例1と同一に制作した。以後、図2に示すように、SiC Chip2が取り付けられたフレームを15milのAl ワイヤ3でボンディング(Bonding)した後、エポキシモールディング4をしてダイオード形態のパッケージ1を製造した。
<銀(Ag)ペースト接合強度試片の製造>
銀ペーストをDBC基板に塗布してSiC chipをマウントし、約100Nで加圧し、炭化炉を用いて350℃で約1時間の間維持させた後、空冷して接合強度試片を製造した。焼結は、350℃まで10℃/minの条件で不活性雰囲気で進行し、150℃以下の温度で空冷した。
<銀(Ag)ペースト電力駆動試片の製造>
銀ペーストを用いて実施例2と同一の方法でダイオード形態のパッケージを製造した。
<銅(Cu)ペースト電力駆動試片の製造>
銅ペーストをDBC基板に塗布してSiC chipをマウントし、約300Nで加圧し、炭化炉を用いて350℃で約1時間の間焼結させた後、空冷して接合強度試片を製造した。焼結は、350℃まで10℃/minの条件で不活性雰囲気で進行し、150℃以下の温度で空冷した。
<銅(Cu)ペースト電力駆動試片の製造>
銅ペーストを用いて実施例2と同一の方法でダイオード形態のパッケージを製造した。
<TLPs接合素材の接合強度試片の製造>
TLPs接合素材をDBC基板に塗布してSiC chipをマウントし、リフロー(Reflow)炉を用いて250℃で約10分間接合して接合強度試片を製造した。接合は、250℃まで80℃/minの条件で不活性雰囲気で進行した。
<TLPs接合素材の電力駆動試片の製造>
TLPs接合素材を用いて実施例2と同一の方法でダイオード形態のパッケージを製造した。
実施例1と比較例1、3、5に基づいて製造された試片のDBC基板とSiC Chipの接合部を比較するために、ポリシング後、注射電子顕微鏡(SEM)を用いて微細組織を撮影し、その結果を図3に示した。図3から銅ペーストと銀ペーストの場合、接合部に大きなボイドが存在するが、TPLs接合素材と焼結ペーストの場合には、ボイドが微細なことを確認できる。これは、図4のせん断強度評価結果と関連あり、接合部のボイドが大きいほど接合性が低いことがわかる。
実施例2と比較例2、4、6に基づいて製造された試片の高温における長期信頼性を評価するために、−45℃で150℃まで1000cycle、1500cycle、2000cycleの条件で 熱衝撃試験評価を進行し、その結果を下記の表1に表れた。
2 SiC Chip
3 アルミニウムワイヤ
4 エポキシモールディング
5 銅
6 アルミナ
7 接合素材
Claims (14)
- 第1金属粉末、第2金属粉末及びナノセラミック粉末の混合粉末を含み、前記混合粉末の比表面積が0.1m2/g以上10m2/g以下であることを特徴とする、電力半導体接合用焼結ペースト組成物。
- 前記第1金属粉末は、Cu(銅)、Ag(銀)、Au(金)の中から選ばれるいずれか1種または2種以上の混合物から成ることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記第1金属粉末は、10nm以上300nm以下のナノ粒子を含むことを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記第2金属粉末は、Pt(白金)、Ni(ニッケル)、Sn(鈴)、Al(アルミニウム)、Ag(銀)、Zn(亜鉛)、Bi(ビスマス)、P(リン)、B(ボロン)、In(インジウム)、無鉛ソルダー合金、アルミウム合金、及びこれらの金属のいずれか1つがコーティングされたCu(銅)の中から選ばれるいずれか1種または2種以上の混合物から成ることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記第2金属粉末は、0.1μm以上50μm以下のマイクロ粒子を含むことを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記ナノセラミック粉末は、B(ボロン)、V(バナジウム)、Cr(クロム)、Mn(マンガン)、Fe(鉄)、Co(コバルト)、Ni(ニッケル)、Zr(ジルコニウム)、Nb(ニオブ)、Mo(モリブデン)、Y(イットリウム)、La(ランタン)、Sn(鈴)、Si(シリコン)、Ag(銀)、Bi(ビスマス)、Cu(銅)、Au(金)、Mg(マグネシウム)、Pd(パラジウム)、Pt(白金)、Zn(亜鉛)、Al(アルミウム)の中のいずれか1つから成る酸化物、窒化物及び炭化物の中から選ばれるいずれか1種または2種の混合物から成ることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記ナノセラミック粉末は、0.005wt%以上10wt%以下が含まれることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 前記ナノセラミック粉末の大きさは、30nm以上300nm以下であることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物
- 前記電力半導体接合用焼結ペースト組成物は、150℃以上600℃以下の焼結温度で使用可能であることを特徴とする、請求項1に記載の電力半導体接合用焼結ペースト組成物。
- 請求項1乃至第9項のいずれか1項に記載の焼結ペースト組成物と、溶媒と、バインダーと、分散剤及び還元剤と、を含む電力半導体接合用焼結ペースト。
- 前記溶媒は、アルコール類、グリコール類、アルキル系の中で沸点が300℃以下の群から選ばれるいずれか1種または2種以上の混合物であることを特徴とする、請求項10に記載の電力半導体接合用焼結ペースト。
- 前記バインダーは、エポキシ樹脂、フェノール樹脂、ポリウレタン樹脂、ポリアミド樹脂、アクリル樹脂、ウレア/メラミン樹脂、シリコン樹脂の中から選ばれるいずれか1種または2種以上の混合物であることを特徴とする、請求項10に記載の電力半導体接合用焼結ペースト。
- 前記分散剤は、ステアリン酸、 オレイン酸、高級脂肪酸、脂肪酸アミド、脂肪酸金属塩、リン酸エーテル、スルホン酸エーテル、アルキルアミン、カルボン酸アミド、アミノカルボン酸の中から選ばれるいずれか1種または2種以上の混合物であることを特徴とする、請求項10に記載の電力半導体接合用焼結ペースト。
- 前記還元剤は、脂肪酸、カルボン酸、アミン系化合物、ブロム系化合物、水素化ホウ素化合物、水素化アルミウム化合物、アルキルアミンボラン、ヒドラジン化合物、アルデヒド化合物、亜リン酸化合物、茶亜リン酸化合物の中から選ばれるいずれか1種または2種以上の混合物であることを特徴とする、請求項10に記載の電力半導体接合用焼結ペースト。
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