JP2020096202A - 炭化珪素半導体装置および電力変換装置 - Google Patents
炭化珪素半導体装置および電力変換装置 Download PDFInfo
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- JP2020096202A JP2020096202A JP2020046320A JP2020046320A JP2020096202A JP 2020096202 A JP2020096202 A JP 2020096202A JP 2020046320 A JP2020046320 A JP 2020046320A JP 2020046320 A JP2020046320 A JP 2020046320A JP 2020096202 A JP2020096202 A JP 2020096202A
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Abstract
Description
まず、本発明の実施の形態1にかかる炭化珪素半導体装置の構成を説明する。
実施の形態1では、第2ウェル領域31上に直接接するように導電性層47が設けられた炭化珪素半導体装置の例を示したが、本実施の形態の炭化珪素半導体装置では、第2ウェル領域31上に絶縁層53を介して導電性層47が設けられている。その他の点については、実施の形態1と同様であるので、詳しい説明は省略する。
実施の形態1では、第2ウェル領域31上に導電性層47が設けられる例を示したが、本実施の形態の炭化珪素半導体装置では、炭化珪素材料の第2導電型の第2ウェル領域31の上層部を低抵抗の第1導電型にして、その層と第2ウェル領域31との間にpn接合を形成する。ここでは、そのn型の層が導電性層47と同様の働きをする。その他の点については、実施の形態1と同様であるので、詳しい説明は省略する。
実施の形態3では、第2ウェル領域31の上層部に低抵抗で第1導電型の炭化珪素導電性層45を形成した例を説明したが、炭化珪素導電性層45は、第2ウェル領域31内に埋め込んで形成してもよい。その他の点については、実施の形態3と同様であるので、詳しい説明は省略する。
実施の形態3では、第2ウェル領域31の上層部に低抵抗で第1導電型の炭化珪素導電性層45を形成した例を説明したが、炭化珪素導電性層45の下面に凹凸があってもよいその他の点については、実施の形態3と同様であるので、詳しい説明は省略する。
実施の形態1〜5の炭化珪素半導体装置の終端領域では、第2ウェル領域31にソース電極80に対してオーミックコンタクトを設けず、第2ウェル領域31にショットキ接続またはpn接続、または絶縁膜を介して容量性結合する領域を設け、この領域に対してソース電極80をオーミック接続させていた。これに加えて、活性領域の第1ウェル領域30と同様に、第2ウェル領域31の平面方向の内部に第1導電型の離間領域を形成し、その離間領域に対してショットキ接続する電極を設けてもよい。その他の点については、実施の形態1〜5と同様であるので、詳しい説明は省略する。
実施の形態1〜6の炭化珪素半導体装置の終端領域では、第2ウェル領域31の平面横方向の不純物濃度については、特に説明しなかったが、第2ウェル領域31のうち、その上部にゲート絶縁膜50を介してゲート電極60を備える箇所の上層部に、他の第2ウェル領域31の不純物濃度より不純物濃度が低い第2導電型の電界緩和層33を備えたことを特徴とする。その他の点については、実施の形態1〜6と同様であるので、詳しい説明は省略する。
実施の形態1〜7の炭化珪素半導体装置の終端領域では、原則として活性領域内の第1ウェル領域30と終端構造の第2ウェル領域31とは離間していて、第2ウェル領域31はソース電極80とオーミック接続されていなものについて主に説明したが、本実施の形態では、終端構造の第2ウェル領域31が補助接続領域34を経由して第1ウェル領域30の一部と接続している。その他の構成については、実施の形態1〜7と同様であるので、詳しい説明は省略する。
実施の形態1〜8では、MOSFET終端領域に形成された第2ウェル領域31が導電性層コンタクトホール91を有することを特徴としていたが、本発明の効果を享受するには、第2ウェル領域31上に導電性層コンタクトホール91が無い場合であっても、第2ウェル領域31近傍に形成された導電性層47がいずれかの箇所でソース電極80とオーミック接続されており、かつ、第2ウェル領域31がソース電極80からみて高抵抗で接続されていればよい。ここで、導電性層47は、ゲートパッド81の下部にある第2ウェル領域31の面積の半分以上の面積を占めるものとする。その他の点は、実施の形態1等と同様であるので、詳しい説明は省略する。
実施の形態1〜9では、MOSFET終端領域に形成された第2ウェル領域31上の導電性層47または炭化珪素導電性層45は、ドリフト層20とは直接接触していなかったが、本実施の形態の炭化珪素半導体装置においては、第2ウェル領域31の一部にn型の離間領域があり、その離間領域がその上に形成されている導電性層47とショットキ接続するものである。その他の点は、上記実施の形態と同様であるので、詳しい説明を省略する。
本実施の形態は、上述した実施の形態1〜10にかかる炭化珪素半導体装置を電力変換装置に適用したものである。本発明は特定の電力変換装置に限定されるものではないが、以下、実施の形態11として、三相のインバータに本発明を適用した場合について説明する。
Claims (9)
- 第1導電型の炭化珪素の半導体基板と、
前記半導体基板上に形成された第1導電型のドリフト層と、
ソース電極に接続された第1導電型のソース領域を有するMOSFETが前記ドリフト層に周期的に配置される活性領域と、
前記活性領域とは別に前記ドリフト層に設けられる終端領域と、
前記終端領域における前記ドリフト層の表層に設けられる、第2導電型の第2ウェル領域と、
前記第2ウェル領域の底面より上部に前記第2ウェル領域とオーミック接続しないように形成された、前記第2ウェル領域よりシート抵抗が低い導電性層と、
前記導電性層と前記ソース電極とをオーミック接続させ、前記導電性層と前記第2ウェル領域とをオーミック接続させない導電性層コンタクトホールと
を備えたことを特徴とする炭化珪素半導体装置。 - 第1導電型の炭化珪素の半導体基板と、
前記半導体基板上に形成された第1導電型のドリフト層と、
第1導電型のソース領域および第2導電型の第1ウェル領域を有し、前記第1ウェル領域とオーミック接続するオーミック電極を備えるMOSFETが前記ドリフト層に周期的に配置される活性領域と、
前記活性領域とは別に前記ドリフト層に設けられる終端領域と、
前記MOSFET内の第2導電型の前記第1ウェル領域の少なくとも1つと接続され、かつ、前記終端領域における前記ドリフト層の表層に設けられる、第2導電型の第2ウェル領域と、
前記第1ウェル領域上の絶縁膜上、および、前記第2ウェル領域上の絶縁膜上に形成されるゲート電極と、
前記第2ウェル領域の上方に形成され、かつ、前記ゲート電極に接続されるゲートパッドと、
前記第2ウェル領域の底面よりも上部に前記第2ウェル領域とオーミック接続しないように形成され、前記ゲートパッドの下部に形成された前記第2ウェル領域の半分以上の面積を有し、かつ、前記第2ウェル領域よりもシート抵抗が低い導電性層と、
前記オーミック電極および前記導電性層とに接続されるソース電極とを備え、
前記第2ウェル領域は、前記第1ウェル領域上の第1ウェル領域コンタクトホールを介して前記ソース電極とオーミック接続する、
ことを特徴とする炭化珪素半導体装置。 - 前記MOSFETは、第2導電型の前記第2ウェル領域と第1導電型の前記ドリフト層とから形成されるpnダイオードの動作電圧よりも低い立ち上がり電圧のユニポーラ型のダイオードを備える、
請求項1または2に記載の炭化珪素半導体装置。 - 前記ユニポーラ型のダイオードは、前記第1ウェル領域上に形成された第1導電型の層である、
請求項3に記載の炭化珪素半導体装置。 - 前記ユニポーラ型のダイオードは、前記活性領域に形成されたショットキーバリアダイオードである、
請求項3に記載の炭化珪素半導体装置。 - 前記導電性層は、前記第2ウェル領域の断面横方向の幅の半分以上の幅に渡って形成されていることを特徴とする、
請求項1から5のいずれか1項に記載の炭化珪素半導体装置。 - 前記導電性層が、前記第2ウェル領域上の表層部に形成された第1導電型の炭化珪素からなる炭化珪素導電性層であることを特徴とする、
請求項1から6のいずれか1項に記載の炭化珪素半導体装置。 - 前記導電性層が、多結晶シリコンからなることを特徴とする、
請求項1から6のいずれか1項に記載の炭化珪素半導体装置。 - 請求項1から8のいずれか1項に記載の炭化珪素半導体装置を有し、入力される電力を変換して出力する主変換回路と、
前記炭化珪素半導体装置を駆動する駆動信号を前記炭化珪素半導体装置に出力する駆動回路と、
前記駆動回路を制御する制御信号を前記駆動回路に出力する制御回路と、を備えた電力変換装置。
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JP2017027977A (ja) * | 2015-07-16 | 2017-02-02 | 富士電機株式会社 | 半導体装置 |
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US20190371936A1 (en) | 2019-12-05 |
US10991822B2 (en) | 2021-04-27 |
CN115274855A (zh) | 2022-11-01 |
JPWO2018155566A1 (ja) | 2019-06-27 |
US11646369B2 (en) | 2023-05-09 |
US20210226052A1 (en) | 2021-07-22 |
CN110337725A (zh) | 2019-10-15 |
DE112018001001T5 (de) | 2019-11-14 |
CN110337725B (zh) | 2022-08-05 |
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WO2018155566A1 (ja) | 2018-08-30 |
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