JP6627973B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6627973B2 JP6627973B2 JP2018520741A JP2018520741A JP6627973B2 JP 6627973 B2 JP6627973 B2 JP 6627973B2 JP 2018520741 A JP2018520741 A JP 2018520741A JP 2018520741 A JP2018520741 A JP 2018520741A JP 6627973 B2 JP6627973 B2 JP 6627973B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor
- type
- layer
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 325
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 127
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 126
- 239000000758 substrate Substances 0.000 claims description 88
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 47
- 229920005591 polysilicon Polymers 0.000 claims description 47
- 239000012535 impurity Substances 0.000 claims description 15
- 230000003071 parasitic effect Effects 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 142
- 239000011229 interlayer Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000002955 isolation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7806—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a Schottky barrier diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
Description
本発明にかかる半導体装置は、ワイドバンドギャップ半導体を用いて構成される。実施の形態1においては、ワイドバンドギャップ半導体として例えば炭化珪素(SiC)を用いて作製された炭化珪素半導体装置について説明する。図1は、実施の形態1にかかる半導体装置の平面レイアウトの一例を示す平面図である。図1には、活性領域101とエッジ終端領域102との境界付近の一部を示す(図6においても同様)。活性領域101は、オン状態のときに電流が流れる領域である。エッジ終端領域102は、活性領域の周囲を囲むように配置され、ドリフト領域の基体おもて面側の電界を緩和し耐圧を保持する領域である。
次に、実施の形態2にかかる半導体装置の構造について説明する。図4,5は、実施の形態2にかかる半導体装置の断面構造を示す断面図である。実施の形態2にかかる半導体装置の電極パッドの平面レイアウトは、実施の形態1(図1参照)と同様である。図4には、図1の切断線A−A’における断面構造を示す。図5には、図1の切断線B−B’における断面構造を示す。実施の形態2にかかる半導体装置が実施の形態1にかかる半導体装置は、温度センス部20を炭化珪素基体100内の拡散領域で形成した点である。
次に、実施の形態3にかかる半導体装置の構造について説明する。図6は、実施の形態3にかかる半導体装置の平面レイアウトの一例を示す平面図である。図7は、図6の切断線C−C’における断面構造を示す断面図である。図8は、図6の切断線D−D’における断面構造を示す断面図である。図6には、電極パッドの平面レイアウトの他に、後述するp+型コンタクト領域66、p+型アノード領域71およびn+型カソード領域72の平面レイアウトを破線で示す。電極パッド(ソース電極9、アノード電極73およびカソード電極74)の平面レイアウトは、実施の形態1と同様である。
次に、実施の形態4にかかる半導体装置の構造について説明する。図9は、実施の形態4にかかる半導体装置の断面構造を示す断面図である。実施の形態4にかかる半導体装置の電極パッドの平面レイアウトは、実施の形態3(図6参照)と同様である。図9には、図6の切断線C−C’における断面構造を示す。図6の切断線D−D’における断面構造は、図8の活性領域101の構成を図9の活性領域101に代えたものである(不図示)。
次に、実施の形態5にかかる半導体装置の構造について説明する。図10は、実施の形態5にかかる半導体装置の断面構造を示す断面図である。実施の形態5にかかる半導体装置の電極パッドの平面レイアウトは、実施の形態3(図6参照)と同様である。図10には、図6の切断線C−C’における断面構造を示す。図6の切断線D−D’における断面構造は、図8の活性領域101の構成を図10の活性領域101に代えたものである(不図示)。
2 n-型炭化珪素層
3,3a,51,53,61,62,63,81,82,87 p型ベース領域
3b,13 最外p型ベース領域
4 n+型ソース領域
5,66 p+型コンタクト領域
6,84 ゲート絶縁膜
7,85 ゲート電極
8 層間絶縁膜
8a〜8d コンタクトホール
9 ソース電極
10 メイン半導体素子
10a メイン半導体素子の内蔵ダイオード
10b エッジ終端領域の寄生npnバイポーラトランジスタ
11 ドレイン電極
12 絶縁層
20 温度センス部
21 p型ポリシリコン層
22 n型ポリシリコン層
23,73 アノード電極
24,74 カソード電極
31〜34 電流
41,71 p+型アノード領域
42,72 n+型カソード領域
43 p型ベース領域
50 p型炭化珪素層
52 n型JFET領域
64 n型領域
65 n型分離領域
67 コンタクト電極
83 トレンチ
86 コンタクトトレンチ
100 炭化珪素基体
101 活性領域
102 エッジ終端領域
X 基体おもて面に平行な方向(第1方向)
Y 基体おもて面に平行な方向で、第1方向と直行する方向(第2方向)
Z 深さ方向
Claims (9)
- 第1導電型の半導体基板のおもて面側の部分である第1導電型の第1半導体層と、
前記第1半導体層の内部に選択的に設けられた第2導電型の第1半導体領域と、
前記第1半導体領域の内部に選択的に設けられた、第1導電型の第2半導体領域と、
前記第1半導体領域の、前記第1半導体層と前記第2半導体領域との間の領域に接して設けられたゲート絶縁膜と、
前記ゲート絶縁膜を挟んで前記第1半導体領域の反対側に設けられたゲート電極と、
前記半導体基板のおもて面に設けられ、前記第1半導体領域および前記第2半導体領域に接する第1電極層と、
前記半導体基板の裏面側の部分であり、前記第1半導体層に接し、前記第1半導体層よりも不純物濃度の高い第1導電型の第2半導体層と、
前記第2半導体層に接する第2電極層と、を有する半導体素子と、
前記半導体基板に配置され、前記半導体素子の温度を検出するダイオードと、
前記半導体基板のおもて面に、前記第1電極層と離れて設けられ、前記ダイオードのアノード領域に接する第3電極層と、
を備え、
前記第3電極層は、前記半導体素子を構成する少なくとも1つの単位セルの前記第1半導体領域および前記第2半導体領域に接することを特徴とする半導体装置。 - 前記第1電極層は、前記第3電極層と対向する部分が凹んだ平面形状であり、
前記第3電極層は、前記第1電極層の凹部内に入り込むように設けられることを特徴とする請求項1に記載の半導体装置。 - 前記ダイオードは、
前記半導体基板のおもて面に設けられ、前記アノード領域となる第2導電型ポリシリコン層と、
前記半導体基板のおもて面に、前記第2導電型ポリシリコン層に接して設けられた第1導電型ポリシリコン層と、
前記第1半導体領域、前記第2半導体領域および前記第2導電型ポリシリコン層に接する前記第3電極層と、
前記第1導電型ポリシリコン層に接する第4電極層と、を有することを特徴とする請求項1または2に記載の半導体装置。 - 前記ダイオードは、
前記第1半導体層の内部に選択的に設けられた第2導電型の第3半導体領域と、
前記第3半導体領域の内部に選択的に設けられ前記アノード領域となる、前記第3半導体領域よりも不純物濃度の高い第2導電型の第4半導体領域と、
前記第3半導体領域の内部に選択的に設けられた第1導電型の第5半導体領域と、
前記第1半導体領域、前記第2半導体領域および前記第4半導体領域に接する前記第3電極層と、
前記第5半導体領域に接する第4電極層と、を有することを特徴とする請求項1または2に記載の半導体装置。 - 前記第3半導体領域と前記第4半導体領域および前記第5半導体領域との間に設けられた、前記第5半導体領域よりも不純物濃度の低い第1導電型の第6半導体領域をさらに備え、
前記第3半導体領域は、前記第1電極層と同電位に固定されていることを特徴とする請求項4に記載の半導体装置。 - 前記第6半導体領域、前記第3半導体領域および前記第1半導体層からなる寄生npnバイポーラトランジスタは、前記半導体素子の前記第1電極層と前記第2電極層との間にかかる電圧で駆動する電圧駆動型であることを特徴とする請求項5に記載の半導体装置。
- 前記ダイオードは、前記半導体素子のゲート電圧で駆動する電圧駆動型であることを特徴とする請求項1〜6のいずれか一つに記載の半導体装置。
- 前記半導体基板は、シリコンよりもバンドギャップの広い半導体からなることを特徴とする請求項1〜7のいずれか一つに記載の半導体装置。
- シリコンよりもバンドギャップの広い半導体は、炭化珪素であることを特徴とする請求項8に記載の半導体装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016111759 | 2016-06-03 | ||
JP2016111759 | 2016-06-03 | ||
PCT/JP2017/017427 WO2017208734A1 (ja) | 2016-06-03 | 2017-05-08 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017208734A1 JPWO2017208734A1 (ja) | 2018-09-27 |
JP6627973B2 true JP6627973B2 (ja) | 2020-01-08 |
Family
ID=60478340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018520741A Active JP6627973B2 (ja) | 2016-06-03 | 2017-05-08 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10504785B2 (ja) |
JP (1) | JP6627973B2 (ja) |
WO (1) | WO2017208734A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6678810B2 (ja) | 2017-02-24 | 2020-04-08 | 三菱電機株式会社 | 炭化珪素半導体装置および電力変換装置 |
KR102417362B1 (ko) * | 2017-12-14 | 2022-07-05 | 현대자동차 주식회사 | 반도체 소자 및 그 제조 방법 |
CN108336133B (zh) * | 2018-02-09 | 2020-08-28 | 电子科技大学 | 一种碳化硅绝缘栅双极型晶体管及其制作方法 |
CN112005381A (zh) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | 半导体装置以及电力转换装置 |
JP7135445B2 (ja) | 2018-05-29 | 2022-09-13 | 富士電機株式会社 | 半導体装置 |
GB2609343B (en) * | 2018-07-23 | 2023-06-07 | Ween Semiconductors Co Ltd | Power Semiconductor Device |
GB2575810A (en) * | 2018-07-23 | 2020-01-29 | Ween Semiconductors Tech Co Ltd | Power semiconductor device |
JP7080166B2 (ja) * | 2018-12-21 | 2022-06-03 | 三菱電機株式会社 | 半導体装置、および、半導体装置の製造方法 |
JP7127546B2 (ja) * | 2019-01-07 | 2022-08-30 | 株式会社デンソー | 半導体装置 |
FR3093598B1 (fr) * | 2019-03-05 | 2023-08-04 | St Microelectronics Srl | Dispositif de protection contre les surtensions |
US11164813B2 (en) * | 2019-04-11 | 2021-11-02 | Cree, Inc. | Transistor semiconductor die with increased active area |
JP7383917B2 (ja) * | 2019-07-11 | 2023-11-21 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP7467918B2 (ja) * | 2020-01-09 | 2024-04-16 | 富士電機株式会社 | 半導体装置 |
CN112349715B (zh) * | 2020-11-05 | 2024-03-26 | 宁波宝芯源功率半导体有限公司 | 具有温度及电压检测功能的功率半导体器件及制作方法 |
EP4309204A2 (en) * | 2021-03-15 | 2024-01-24 | Wolfspeed, Inc. | Wide bandgap semiconductor device with sensor element |
EP4170728A1 (en) * | 2021-10-21 | 2023-04-26 | Nexperia B.V. | A trench gate metal oxide semiconductor field effect transistor, mosfet, as well as a corresponding method of manufacture |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07153920A (ja) * | 1993-11-30 | 1995-06-16 | Nec Corp | 半導体装置 |
GB9513420D0 (en) * | 1995-06-30 | 1995-09-06 | Philips Electronics Uk Ltd | Power semiconductor devices |
JP2005175357A (ja) | 2003-12-15 | 2005-06-30 | Nissan Motor Co Ltd | 半導体装置とその製造方法 |
US20050012143A1 (en) * | 2003-06-24 | 2005-01-20 | Hideaki Tanaka | Semiconductor device and method of manufacturing the same |
JP5365019B2 (ja) * | 2008-02-08 | 2013-12-11 | 富士電機株式会社 | 半導体装置 |
US8089134B2 (en) * | 2008-02-06 | 2012-01-03 | Fuji Electric Sytems Co., Ltd. | Semiconductor device |
JP5742668B2 (ja) | 2011-10-31 | 2015-07-01 | 三菱電機株式会社 | 炭化珪素半導体装置 |
JP2013105932A (ja) | 2011-11-15 | 2013-05-30 | Toyota Motor Corp | 半導体装置 |
JP2013201357A (ja) * | 2012-03-26 | 2013-10-03 | Mitsubishi Electric Corp | 炭化珪素半導体装置とその製造方法 |
-
2017
- 2017-05-08 JP JP2018520741A patent/JP6627973B2/ja active Active
- 2017-05-08 WO PCT/JP2017/017427 patent/WO2017208734A1/ja active Application Filing
-
2018
- 2018-05-25 US US15/989,337 patent/US10504785B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2017208734A1 (ja) | 2018-09-27 |
WO2017208734A1 (ja) | 2017-12-07 |
US20180277437A1 (en) | 2018-09-27 |
US10504785B2 (en) | 2019-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6627973B2 (ja) | 半導体装置 | |
CN107251233B (zh) | 半导体装置 | |
JP7087280B2 (ja) | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 | |
US20070221953A1 (en) | Semiconductor device | |
JP2017092355A (ja) | 半導体装置および半導体装置の製造方法 | |
JP7467918B2 (ja) | 半導体装置 | |
JP2024019464A (ja) | 半導体装置 | |
US20200258991A1 (en) | Semiconductor device and method of manufacturing semiconductor device | |
JP7383917B2 (ja) | 半導体装置および半導体装置の製造方法 | |
WO2017208735A1 (ja) | 半導体装置 | |
JP7172216B2 (ja) | 半導体装置および半導体回路装置 | |
US11575040B2 (en) | Semiconductor device | |
US11133385B2 (en) | Semiconductor device | |
US11107913B2 (en) | Semiconductor device | |
US20210074845A1 (en) | Semiconductor device | |
JP2017092364A (ja) | 半導体装置および半導体装置の製造方法 | |
US11276776B2 (en) | Semiconductor device and method of manufacturing semiconductor device | |
JP7318226B2 (ja) | 半導体装置および半導体装置の製造方法 | |
US11177360B2 (en) | Semiconductor device | |
US11121221B2 (en) | Semiconductor device | |
US11296217B2 (en) | Semiconductor device | |
US11721756B2 (en) | Semiconductor device | |
JP2022180233A (ja) | 炭化珪素半導体装置 | |
JP2023102946A (ja) | 炭化珪素半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180601 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180601 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190709 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190905 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191105 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191118 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6627973 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |