JP2020037181A5 - - Google Patents

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Publication number
JP2020037181A5
JP2020037181A5 JP2019201238A JP2019201238A JP2020037181A5 JP 2020037181 A5 JP2020037181 A5 JP 2020037181A5 JP 2019201238 A JP2019201238 A JP 2019201238A JP 2019201238 A JP2019201238 A JP 2019201238A JP 2020037181 A5 JP2020037181 A5 JP 2020037181A5
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JP
Japan
Prior art keywords
rotary
rotary chuck
chuck table
chuck
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019201238A
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English (en)
Japanese (ja)
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JP2020037181A (ja
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Publication date
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Priority to JP2019201238A priority Critical patent/JP2020037181A/ja
Priority claimed from JP2019201238A external-priority patent/JP2020037181A/ja
Publication of JP2020037181A publication Critical patent/JP2020037181A/ja
Publication of JP2020037181A5 publication Critical patent/JP2020037181A5/ja
Pending legal-status Critical Current

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JP2019201238A 2019-11-06 2019-11-06 ウェハの高精度加工装置 Pending JP2020037181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019201238A JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019201238A JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015194464A Division JP2017069429A (ja) 2015-09-30 2015-09-30 ウェハの高精度加工装置

Publications (2)

Publication Number Publication Date
JP2020037181A JP2020037181A (ja) 2020-03-12
JP2020037181A5 true JP2020037181A5 (enExample) 2020-11-05

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ID=69737296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019201238A Pending JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

Country Status (1)

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JP (1) JP2020037181A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7770971B2 (ja) * 2022-03-28 2025-11-17 株式会社東京精密 ウエハ加工装置
JP2024069068A (ja) * 2022-11-09 2024-05-21 株式会社ディスコ 加工装置及び保持テーブルの温度調整方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224461B1 (en) * 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
JP2002373875A (ja) * 2001-06-13 2002-12-26 Hitachi Ltd 半導体装置の製造方法および化学的機械研磨装置
JP5722065B2 (ja) * 2011-02-10 2015-05-20 株式会社ディスコ 研磨装置
JP6166958B2 (ja) * 2013-06-10 2017-07-19 株式会社ディスコ チャックテーブル及び研磨装置

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