JP2020037181A - ウェハの高精度加工装置 - Google Patents

ウェハの高精度加工装置 Download PDF

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Publication number
JP2020037181A
JP2020037181A JP2019201238A JP2019201238A JP2020037181A JP 2020037181 A JP2020037181 A JP 2020037181A JP 2019201238 A JP2019201238 A JP 2019201238A JP 2019201238 A JP2019201238 A JP 2019201238A JP 2020037181 A JP2020037181 A JP 2020037181A
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Japan
Prior art keywords
wafer
water
grinding
chuck table
chuck
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Pending
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JP2019201238A
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English (en)
Japanese (ja)
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JP2020037181A5 (enExample
Inventor
八木　隆行
Takayuki Yagi
隆行 八木
創士 山田
Soji Yamada
創士 山田
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Priority to JP2019201238A priority Critical patent/JP2020037181A/ja
Publication of JP2020037181A publication Critical patent/JP2020037181A/ja
Publication of JP2020037181A5 publication Critical patent/JP2020037181A5/ja
Pending legal-status Critical Current

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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019201238A 2019-11-06 2019-11-06 ウェハの高精度加工装置 Pending JP2020037181A (ja)

Priority Applications (1)

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JP2019201238A JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

Applications Claiming Priority (1)

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JP2019201238A JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

Related Parent Applications (1)

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JP2015194464A Division JP2017069429A (ja) 2015-09-30 2015-09-30 ウェハの高精度加工装置

Publications (2)

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JP2020037181A true JP2020037181A (ja) 2020-03-12
JP2020037181A5 JP2020037181A5 (enExample) 2020-11-05

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JP2019201238A Pending JP2020037181A (ja) 2019-11-06 2019-11-06 ウェハの高精度加工装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116810627A (zh) * 2022-03-28 2023-09-29 株式会社东京精密 圆晶加工装置
JP2024069068A (ja) * 2022-11-09 2024-05-21 株式会社ディスコ 加工装置及び保持テーブルの温度調整方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002540611A (ja) * 1999-03-29 2002-11-26 ラム リサーチ コーポレイション 化学機械研磨中の処理温度を安定させる方法及び装置
JP2002373875A (ja) * 2001-06-13 2002-12-26 Hitachi Ltd 半導体装置の製造方法および化学的機械研磨装置
JP2012166274A (ja) * 2011-02-10 2012-09-06 Disco Corp 研磨装置
JP2014237200A (ja) * 2013-06-10 2014-12-18 株式会社ディスコ チャックテーブル及び研削研磨装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002540611A (ja) * 1999-03-29 2002-11-26 ラム リサーチ コーポレイション 化学機械研磨中の処理温度を安定させる方法及び装置
JP2002373875A (ja) * 2001-06-13 2002-12-26 Hitachi Ltd 半導体装置の製造方法および化学的機械研磨装置
JP2012166274A (ja) * 2011-02-10 2012-09-06 Disco Corp 研磨装置
JP2014237200A (ja) * 2013-06-10 2014-12-18 株式会社ディスコ チャックテーブル及び研削研磨装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116810627A (zh) * 2022-03-28 2023-09-29 株式会社东京精密 圆晶加工装置
KR20230139771A (ko) * 2022-03-28 2023-10-05 가부시키가이샤 토쿄 세이미쯔 웨이퍼 가공 장치
TWI823656B (zh) * 2022-03-28 2023-11-21 日商日本東京精密股份有限公司 晶圓加工裝置
KR102926627B1 (ko) * 2022-03-28 2026-02-11 가부시키가이샤 토쿄 세이미쯔 웨이퍼 가공 장치
CN116810627B (zh) * 2022-03-28 2026-06-02 株式会社东京精密 圆晶加工装置
JP2024069068A (ja) * 2022-11-09 2024-05-21 株式会社ディスコ 加工装置及び保持テーブルの温度調整方法

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