JP2019535138A5 - - Google Patents
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- JP2019535138A5 JP2019535138A5 JP2019516495A JP2019516495A JP2019535138A5 JP 2019535138 A5 JP2019535138 A5 JP 2019535138A5 JP 2019516495 A JP2019516495 A JP 2019516495A JP 2019516495 A JP2019516495 A JP 2019516495A JP 2019535138 A5 JP2019535138 A5 JP 2019535138A5
- Authority
- JP
- Japan
- Prior art keywords
- defect
- wafer
- embedded
- location
- positioning system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007547 defect Effects 0.000 claims 45
- 239000000463 material Substances 0.000 claims 15
- 238000007689 inspection Methods 0.000 claims 9
- 230000003287 optical effect Effects 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- 238000005286 illumination Methods 0.000 claims 3
- 238000010894 electron beam technology Methods 0.000 claims 2
- 238000012795 verification Methods 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 1
- 238000010884 ion-beam technique Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662400182P | 2016-09-27 | 2016-09-27 | |
| US62/400,182 | 2016-09-27 | ||
| US15/430,817 US10082470B2 (en) | 2016-09-27 | 2017-02-13 | Defect marking for semiconductor wafer inspection |
| US15/430,817 | 2017-02-13 | ||
| PCT/US2017/053540 WO2018064072A1 (en) | 2016-09-27 | 2017-09-26 | Defect marking for semiconductor wafer inspection |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019535138A JP2019535138A (ja) | 2019-12-05 |
| JP2019535138A5 true JP2019535138A5 (enExample) | 2020-11-12 |
| JP6918931B2 JP6918931B2 (ja) | 2021-08-11 |
Family
ID=61686085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019516495A Active JP6918931B2 (ja) | 2016-09-27 | 2017-09-26 | 半導体ウエハ検査のための欠陥マーキング |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10082470B2 (enExample) |
| JP (1) | JP6918931B2 (enExample) |
| KR (1) | KR102235580B1 (enExample) |
| CN (1) | CN109690748B (enExample) |
| SG (1) | SG11201900913VA (enExample) |
| TW (1) | TWI722246B (enExample) |
| WO (1) | WO2018064072A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10928740B2 (en) * | 2017-02-03 | 2021-02-23 | Kla Corporation | Three-dimensional calibration structures and methods for measuring buried defects on a three-dimensional semiconductor wafer |
| US20190096057A1 (en) | 2017-05-11 | 2019-03-28 | Jacob Nathaniel Allen | Object inspection system and method for inspecting an object |
| US11035804B2 (en) | 2017-06-28 | 2021-06-15 | Kla Corporation | System and method for x-ray imaging and classification of volume defects |
| KR102037748B1 (ko) * | 2017-12-06 | 2019-11-29 | 에스케이실트론 주식회사 | 웨이퍼의 결함 영역을 평가하는 방법 |
| US11054250B2 (en) * | 2018-04-11 | 2021-07-06 | International Business Machines Corporation | Multi-channel overlay metrology |
| TWI662250B (zh) * | 2018-05-24 | 2019-06-11 | 仲鈜科技股份有限公司 | 標記載體上的多個被動元件中的缺陷品的系統及其方法 |
| CN108760753B (zh) * | 2018-05-31 | 2023-12-12 | 永捷电子（始兴）有限公司 | Mark点检测装置及其检测方法 |
| JP7299219B2 (ja) * | 2018-07-30 | 2023-06-27 | 日本化薬株式会社 | マーキング装置、マーキング方法、偏光板の製造方法および偏光板 |
| TWI708041B (zh) * | 2018-10-17 | 2020-10-21 | 所羅門股份有限公司 | 檢測與標記瑕疵的方法 |
| US11231376B2 (en) * | 2019-08-29 | 2022-01-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for semiconductor wafer inspection and system thereof |
| US11798153B2 (en) * | 2019-10-02 | 2023-10-24 | Kla Corporation | Frequency domain enhancement of low-SNR flat residue/stain defects for effective detection |
| WO2021257846A1 (en) | 2020-06-17 | 2021-12-23 | Inovision Software Solutions, Inc. | System and method for defect repair |
| CN114192440B (zh) * | 2020-09-18 | 2024-05-03 | 中国科学院微电子研究所 | 一种不合格晶圆的检出装置及检出方法、晶圆制造设备 |
| US11513079B2 (en) | 2020-10-09 | 2022-11-29 | Fei Company | Method and system for wafer defect inspection |
| US20220196723A1 (en) * | 2020-12-18 | 2022-06-23 | Kla Corporation | System and method for automatically identifying defect-based test coverage gaps in semiconductor devices |
| JP7528870B2 (ja) * | 2021-06-08 | 2024-08-06 | 信越半導体株式会社 | ウェーハマーキング方法及び窒化物半導体デバイスの製造方法並びに窒化物半導体基板 |
| US12293506B2 (en) | 2021-07-20 | 2025-05-06 | Inovision Software Solutions, Inc. | Method to locate defects in e-coat |
| CN113884502A (zh) * | 2021-12-07 | 2022-01-04 | 武汉华工激光工程有限责任公司 | 基于线阵相机的载板检测及激光标记系统和方法 |
| TWI858453B (zh) * | 2022-01-06 | 2024-10-11 | 日商捷進科技有限公司 | 半導體製造裝置、檢查裝置及半導體裝置的製造方法 |
| US20230260128A1 (en) * | 2022-02-15 | 2023-08-17 | Vitrox Technologies Sdn Bhd | Inspection system |
| CN118633147A (zh) * | 2022-02-18 | 2024-09-10 | 三菱电机株式会社 | 半导体芯片的标记方法、半导体芯片的制造方法以及半导体芯片 |
| US12118709B2 (en) | 2022-02-23 | 2024-10-15 | Nanya Technology Corporation | Method for identifying cause of manufacturing defects |
| TWI833390B (zh) * | 2022-02-23 | 2024-02-21 | 南亞科技股份有限公司 | 製造缺陷原因之識別系統以及非暫時性電腦可讀媒體 |
| US12175652B2 (en) | 2022-02-23 | 2024-12-24 | Nanya Technology Corporation | System and non-transitory computer-readable medium for identifying cause of manufacturing defects |
| TWI860523B (zh) * | 2022-05-31 | 2024-11-01 | 鴻海精密工業股份有限公司 | 瑕疵檢測方法、電子設備及計算機可讀存儲媒體 |
| CN117197025A (zh) * | 2022-05-31 | 2023-12-08 | 鸿海精密工业股份有限公司 | 瑕疵检测方法、电子设备及存储介质 |
| KR102734303B1 (ko) | 2022-09-30 | 2024-11-26 | 주식회사 에스에프에이 | Sem-fib 분석 시스템 및 sem-fib 분석 방법 |
| KR102813550B1 (ko) | 2022-11-30 | 2025-05-30 | 주식회사 에스에프에이 | 부도체 샘플의 sem 자동 검사를 위한 자동초점 조정방법 및 부도체 샘플의 sem 자동 검사 시스템 |
| CN116013800B (zh) * | 2022-12-30 | 2024-02-27 | 胜科纳米(苏州)股份有限公司 | 一种缺陷定位方法、装置、电子设备及存储介质 |
| CN116718602A (zh) * | 2023-06-28 | 2023-09-08 | 上海华力微电子有限公司 | 一种失效定位及失效分析方法 |
| CN117038491A (zh) * | 2023-08-29 | 2023-11-10 | 西安奕斯伟材料科技股份有限公司 | 一种硅片缺陷测量方法及装置 |
| US20250308902A1 (en) * | 2024-03-26 | 2025-10-02 | Tokyo Electron Limited | Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulation |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271916B1 (en) | 1994-03-24 | 2001-08-07 | Kla-Tencor Corporation | Process and assembly for non-destructive surface inspections |
| US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
| US5859424A (en) | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
| US6201601B1 (en) | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| KR100279962B1 (ko) * | 1997-12-29 | 2001-03-02 | 윤종용 | 반도체 웨이퍼의 벌크디펙트의 모폴로지 분석방법 및 표면디펙트의 모폴로지 분석방법 |
| US6208411B1 (en) | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
| US6429943B1 (en) | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
| JP2002340990A (ja) * | 2001-05-15 | 2002-11-27 | Jeol Ltd | 半導体デバイスの評価方法及び装置。 |
| US7130039B2 (en) | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
| US7027142B2 (en) * | 2002-05-06 | 2006-04-11 | Applied Materials, Israel, Ltd. | Optical technique for detecting buried defects in opaque films |
| US7295303B1 (en) | 2004-03-25 | 2007-11-13 | Kla-Tencor Technologies Corporation | Methods and apparatus for inspecting a sample |
| US7478019B2 (en) | 2005-01-26 | 2009-01-13 | Kla-Tencor Corporation | Multiple tool and structure analysis |
| US7567351B2 (en) | 2006-02-02 | 2009-07-28 | Kla-Tencor Corporation | High resolution monitoring of CD variations |
| US7664608B2 (en) * | 2006-07-14 | 2010-02-16 | Hitachi High-Technologies Corporation | Defect inspection method and apparatus |
| JP2009014510A (ja) | 2007-07-04 | 2009-01-22 | Hitachi High-Technologies Corp | 検査方法及び検査装置 |
| JP5873227B2 (ja) | 2007-12-06 | 2016-03-01 | エフ・イ−・アイ・カンパニー | デコレーションを用いたスライス・アンド・ビュー |
| JP5425593B2 (ja) | 2009-11-13 | 2014-02-26 | ルネサスエレクトロニクス株式会社 | Ｅｕｖマスクの欠陥検査方法、ｅｕｖマスクの製造方法、ｅｕｖマスク検査装置、および、半導体装置の製造方法 |
| JP5560921B2 (ja) * | 2010-06-08 | 2014-07-30 | 新日鐵住金株式会社 | 欠陥識別マーカー付き基板の製造方法 |
| JP5659086B2 (ja) * | 2011-05-30 | 2015-01-28 | 株式会社東芝 | 反射型マスクの欠陥修正方法 |
| DE102011079382B4 (de) | 2011-07-19 | 2020-11-12 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Analysieren und zum Beseitigen eines Defekts einer EUV Maske |
| JP5712079B2 (ja) * | 2011-07-29 | 2015-05-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置および欠陥検査方法 |
| US9053390B2 (en) * | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
| US9581430B2 (en) | 2012-10-19 | 2017-02-28 | Kla-Tencor Corporation | Phase characterization of targets |
| US8912495B2 (en) | 2012-11-21 | 2014-12-16 | Kla-Tencor Corp. | Multi-spectral defect inspection for 3D wafers |
| US9075027B2 (en) * | 2012-11-21 | 2015-07-07 | Kla-Tencor Corporation | Apparatus and methods for detecting defects in vertical memory |
| US10769320B2 (en) | 2012-12-18 | 2020-09-08 | Kla-Tencor Corporation | Integrated use of model-based metrology and a process model |
| US9291554B2 (en) | 2013-02-05 | 2016-03-22 | Kla-Tencor Corporation | Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection |
| US9389349B2 (en) | 2013-03-15 | 2016-07-12 | Kla-Tencor Corporation | System and method to determine depth for optical wafer inspection |
| US9696264B2 (en) * | 2013-04-03 | 2017-07-04 | Kla-Tencor Corporation | Apparatus and methods for determining defect depths in vertical stack memory |
| US9734422B2 (en) * | 2014-11-12 | 2017-08-15 | Kla-Tencor Corporation | System and method for enhanced defect detection with a digital matched filter |
| US10747830B2 (en) * | 2014-11-21 | 2020-08-18 | Mesh Labs Inc. | Method and system for displaying electronic information |
| US9599573B2 (en) * | 2014-12-02 | 2017-03-21 | Kla-Tencor Corporation | Inspection systems and techniques with enhanced detection |
-
2017
- 2017-02-13 US US15/430,817 patent/US10082470B2/en not_active Expired - Fee Related
- 2017-09-26 JP JP2019516495A patent/JP6918931B2/ja active Active
- 2017-09-26 WO PCT/US2017/053540 patent/WO2018064072A1/en not_active Ceased
- 2017-09-26 CN CN201780055520.4A patent/CN109690748B/zh active Active
- 2017-09-26 SG SG11201900913VA patent/SG11201900913VA/en unknown
- 2017-09-26 KR KR1020197011898A patent/KR102235580B1/ko active Active
- 2017-09-27 TW TW106133040A patent/TWI722246B/zh active
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