JP2019524959A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019524959A5 JP2019524959A5 JP2019507191A JP2019507191A JP2019524959A5 JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5 JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- sio
- group
- composition according
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 19
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims 8
- 125000003118 aryl group Chemical group 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- -1 siloxane unit Chemical group 0.000 claims 3
- 229910004283 SiO 4 Inorganic materials 0.000 claims 2
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 claims 1
- 125000006710 (C2-C12) alkenyl group Chemical group 0.000 claims 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000007809 chemical reaction catalyst Substances 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 238000006459 hydrosilylation reaction Methods 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 238000001542 size-exclusion chromatography Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2016/069244 WO2018028792A1 (en) | 2016-08-12 | 2016-08-12 | Curable organopolysiloxane composition, encapsulant and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019524959A JP2019524959A (ja) | 2019-09-05 |
| JP2019524959A5 true JP2019524959A5 (OSRAM) | 2020-08-13 |
Family
ID=56682127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019507191A Pending JP2019524959A (ja) | 2016-08-12 | 2016-08-12 | 硬化性有機ポリシロキサン組成物、封止剤、および半導体デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11028266B2 (OSRAM) |
| EP (1) | EP3497160B1 (OSRAM) |
| JP (1) | JP2019524959A (OSRAM) |
| KR (1) | KR102165826B1 (OSRAM) |
| CN (1) | CN109563312B (OSRAM) |
| TW (1) | TWI654257B (OSRAM) |
| WO (1) | WO2018028792A1 (OSRAM) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020043313A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Curable organopolysiloxane composition, encapsulant and semiconductor device |
| WO2020043312A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Thermosetting silicone resin composition for reflector of led, reflector of led and semiconductor device using the same |
| US12215226B2 (en) | 2018-10-30 | 2025-02-04 | Dow Toray Co., Ltd. | Curable reactive silicone composition, cured product thereof and uses of composition and cured product |
| WO2020138408A1 (ja) | 2018-12-27 | 2020-07-02 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
| JP7513365B2 (ja) | 2018-12-27 | 2024-07-09 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| US12173157B2 (en) | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and method for producing same |
| US12480027B2 (en) | 2019-03-29 | 2025-11-25 | Dow Toray Co., Ltd. | Curable silicone composition, cured product of same, and method for producing same |
| KR20210148205A (ko) | 2019-03-29 | 2021-12-07 | 다우 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법 |
| EP3954739A4 (en) * | 2019-03-29 | 2022-12-28 | Dow Toray Co., Ltd. | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF |
| WO2021132710A1 (ja) | 2019-12-27 | 2021-07-01 | ダウ・東レ株式会社 | 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体 |
| KR20230135676A (ko) | 2021-03-08 | 2023-09-25 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 경화성 실리콘 조성물, 봉지재 및 광반도체 장치 |
| CN119317683A (zh) * | 2022-06-29 | 2025-01-14 | 陶氏东丽株式会社 | 可uv固化的有机聚硅氧烷组合物及其应用 |
| KR20240013993A (ko) * | 2022-07-22 | 2024-01-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| WO2025039213A1 (en) | 2023-08-23 | 2025-02-27 | Dupont Toray Specialty Materials Kabushiki Kaisha | Process for manufacturing silicone encapsulants |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10062181A1 (de) * | 2000-12-14 | 2002-07-04 | Wacker Chemie Gmbh | Härtbare Organopolysiloxanmassen |
| JP4409160B2 (ja) | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| WO2007100445A2 (en) | 2006-02-24 | 2007-09-07 | Dow Corning Corporation | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
| DE102006016753A1 (de) * | 2006-04-10 | 2007-10-11 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
| DE102006031107A1 (de) * | 2006-07-05 | 2008-01-10 | Wacker Chemie Ag | Härtbare Organopolysiloxanmassen |
| JP5972512B2 (ja) * | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
| JP5505436B2 (ja) | 2011-04-21 | 2014-05-28 | Ｊｓｒ株式会社 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
| KR101882052B1 (ko) * | 2011-09-01 | 2018-07-25 | 도아고세이가부시키가이샤 | 내열충격성 경화물 및 그의 제조 방법 |
| JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
| JP5912600B2 (ja) | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP5545601B2 (ja) * | 2011-11-07 | 2014-07-09 | 信越化学工業株式会社 | 蛍光体高充填波長変換シート、それを用いた発光半導体装置の製造方法、及び該発光半導体装置 |
| JP2013159671A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP2013159670A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| US9447277B2 (en) * | 2012-05-25 | 2016-09-20 | Daicel Corporation | Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device |
| US9346954B2 (en) | 2012-09-14 | 2016-05-24 | The Yokohama Rubber Co., Ltd. | Curable resin composition |
| CN105473664A (zh) * | 2013-08-30 | 2016-04-06 | 道康宁东丽株式会社 | 单部分可固化有机硅组合物以及光学半导体器件 |
| TWI653295B (zh) | 2014-02-04 | 2019-03-11 | 日商道康寧東麗股份有限公司 | 硬化性聚矽氧組合物、其硬化物及光半導體裝置 |
-
2016
- 2016-08-12 WO PCT/EP2016/069244 patent/WO2018028792A1/en not_active Ceased
- 2016-08-12 KR KR1020197003795A patent/KR102165826B1/ko active Active
- 2016-08-12 US US16/322,415 patent/US11028266B2/en active Active
- 2016-08-12 EP EP16750454.7A patent/EP3497160B1/en active Active
- 2016-08-12 CN CN201680088199.5A patent/CN109563312B/zh active Active
- 2016-08-12 JP JP2019507191A patent/JP2019524959A/ja active Pending
-
2017
- 2017-07-24 TW TW106124790A patent/TWI654257B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019524959A5 (OSRAM) | ||
| TWI654257B (zh) | 可固化有機聚矽氧烷組合物、密封劑和半導體裝置 | |
| JP2014051606A5 (OSRAM) | ||
| CN103562321B (zh) | 半导体密封用有机硅组合物 | |
| JP2012012434A5 (OSRAM) | ||
| EP3107965A1 (en) | Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition | |
| TW201124477A (en) | Polysiloxane composition and cured article thereof | |
| CN108350275A (zh) | 加成固化型硅酮树脂组合物、所述组合物的制造方法以及光学半导体装置 | |
| JP2003026925A5 (OSRAM) | ||
| JP4644129B2 (ja) | 硬化性シリコーンゴム組成物及びその硬化物 | |
| TWI776851B (zh) | 可室溫固化聚矽氧組成物及電氣/電子設備 | |
| JP2005179681A (ja) | 付加架橋性シリコーン樹脂組成物、これからなる成形体および前記組成物の使用 | |
| JP2016514179A (ja) | 光学素子封止用樹脂組成物 | |
| CN103619958B (zh) | 用于led封装的可固化的硅树脂 | |
| WO2019129131A1 (en) | Single-component addition-type polysiloxane composition | |
| JP2012246482A5 (OSRAM) | ||
| TW201544548A (zh) | 硬化性樹脂組成物及其硬化物 | |
| JPWO2015136820A1 (ja) | 硬化性樹脂組成物 | |
| JP7158100B2 (ja) | 架橋性オルガノポリシロキサン組成物、その硬化物及びｌｅｄ装置 | |
| EP0492828A1 (en) | Mixture of adhesion additives useful in UV curable compositions and compositions containing same | |
| JP2019505645A5 (OSRAM) | ||
| WO2015194159A1 (ja) | オルガノポリシロキサンおよびその製造方法 | |
| JP2018172447A (ja) | 架橋性オルガノポリシロキサン組成物およびその硬化物 | |
| JP5913537B2 (ja) | 硬化性オルガノポリシロキサン組成物の製造方法 | |
| KR101856788B1 (ko) | 경화성 오르가노폴리실록산 조성물 |