JP2019517936A5 - - Google Patents

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Publication number
JP2019517936A5
JP2019517936A5 JP2018559261A JP2018559261A JP2019517936A5 JP 2019517936 A5 JP2019517936 A5 JP 2019517936A5 JP 2018559261 A JP2018559261 A JP 2018559261A JP 2018559261 A JP2018559261 A JP 2018559261A JP 2019517936 A5 JP2019517936 A5 JP 2019517936A5
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JP
Japan
Prior art keywords
assembly
adhesive
adhesive element
carrier
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018559261A
Other languages
English (en)
Japanese (ja)
Other versions
JP7030063B2 (ja
JP2019517936A (ja
Filing date
Publication date
Priority claimed from GB1608279.4A external-priority patent/GB2554040B/en
Application filed filed Critical
Publication of JP2019517936A publication Critical patent/JP2019517936A/ja
Publication of JP2019517936A5 publication Critical patent/JP2019517936A5/ja
Priority to JP2022023847A priority Critical patent/JP2022069475A/ja
Application granted granted Critical
Publication of JP7030063B2 publication Critical patent/JP7030063B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018559261A 2016-05-11 2017-05-11 担体の剥離 Active JP7030063B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022023847A JP2022069475A (ja) 2016-05-11 2022-02-18 担体の剥離

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1608279.4A GB2554040B (en) 2016-05-11 2016-05-11 Carrier release
GB1608279.4 2016-05-11
PCT/EP2017/061319 WO2017194672A1 (en) 2016-05-11 2017-05-11 Carrier release

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022023847A Division JP2022069475A (ja) 2016-05-11 2022-02-18 担体の剥離

Publications (3)

Publication Number Publication Date
JP2019517936A JP2019517936A (ja) 2019-06-27
JP2019517936A5 true JP2019517936A5 (enExample) 2020-06-18
JP7030063B2 JP7030063B2 (ja) 2022-03-04

Family

ID=56297533

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018559261A Active JP7030063B2 (ja) 2016-05-11 2017-05-11 担体の剥離
JP2022023847A Pending JP2022069475A (ja) 2016-05-11 2022-02-18 担体の剥離

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022023847A Pending JP2022069475A (ja) 2016-05-11 2022-02-18 担体の剥離

Country Status (8)

Country Link
US (2) US10658401B2 (enExample)
JP (2) JP7030063B2 (enExample)
KR (2) KR102577280B1 (enExample)
CN (2) CN109070537B (enExample)
GB (2) GB2607246B (enExample)
RU (1) RU2763361C2 (enExample)
TW (2) TWI792502B (enExample)
WO (1) WO2017194672A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2607246B (en) * 2016-05-11 2023-03-22 Flexenable Ltd Carrier release
GB2568240B (en) * 2017-11-03 2023-01-25 Flexenable Ltd Method of producing liquid crystal devices comprising a polariser component between two lc cells
US10964582B2 (en) * 2019-06-24 2021-03-30 Palo Alto Research Center Incorporated Transfer substrate utilizing selectable surface adhesion transfer elements
GB2593418B (en) 2019-10-10 2023-12-13 Flexenable Tech Limited Liquid crystal devices

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722440A (ja) * 1993-07-06 1995-01-24 Toshiba Chem Corp 半導体素子の取付け方法
JPH0850282A (ja) * 1994-05-30 1996-02-20 Sanyo Electric Co Ltd 表示装置の製造方法
JP2000241823A (ja) * 1999-02-17 2000-09-08 Seiko Epson Corp 液晶パネルの製造方法
JP2000241822A (ja) * 1999-02-17 2000-09-08 Seiko Epson Corp 液晶パネルの製造方法
JP2000248243A (ja) * 1999-03-03 2000-09-12 Seiko Epson Corp 接着シート及び液晶パネルの製造方法
JP2000351947A (ja) * 1999-06-14 2000-12-19 Nitto Denko Corp 加熱剥離型粘着シート
DE10297455T5 (de) * 2001-11-15 2004-09-23 Sekisui Chemical Co., Ltd. Kleber, Verfahren zum Ablösen eines Klebers von seinem Haftgrund, und druckreaktives Klebeband
JP4220766B2 (ja) * 2002-12-02 2009-02-04 積水化学工業株式会社 離型シート及びセラミックグリーンシートの転写方法
CN102290422A (zh) * 2003-01-15 2011-12-21 株式会社半导体能源研究所 显示装置及其制造方法、剥离方法及发光装置的制造方法
JP2005255829A (ja) * 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2009040930A (ja) * 2007-08-10 2009-02-26 Nitto Denko Corp 被着体の剥離方法、及び、該被着体の剥離方法に使用される加熱剥離型粘着シート
JP5173672B2 (ja) * 2008-08-21 2013-04-03 協立化学産業株式会社 接着剤により貼り合された複数の光学機能性部材の剥離方法
GB2481187B (en) * 2010-06-04 2014-10-29 Plastic Logic Ltd Processing substrates
JP2012149181A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法
JP2012186315A (ja) * 2011-03-04 2012-09-27 Nitto Denko Corp 薄膜基板の製造方法
JP6002135B2 (ja) * 2011-08-05 2016-10-05 パナソニック株式会社 フレキシブルデバイスの製造方法
KR101773651B1 (ko) * 2013-04-09 2017-08-31 주식회사 엘지화학 적층체 및 이를 이용하여 제조된 기판을 포함하는 소자
SG11201601300TA (en) * 2013-08-29 2016-03-30 Mitsui Chemicals Tohcello Inc Adhesive film and method for manufacturing semiconductor device
GB2607246B (en) * 2016-05-11 2023-03-22 Flexenable Ltd Carrier release

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