CN109070537B - 载体释脱技术 - Google Patents

载体释脱技术 Download PDF

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CN109070537B
CN109070537B CN201780029194.XA CN201780029194A CN109070537B CN 109070537 B CN109070537 B CN 109070537B CN 201780029194 A CN201780029194 A CN 201780029194A CN 109070537 B CN109070537 B CN 109070537B
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assembly
adhesive
carrier
carriers
adhesive element
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CN109070537A (zh
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B·魏尔德
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Fleck Innabur Technology Co ltd
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Plastic Logic Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1262Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268Release layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/055 or more layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00Composition of foam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/304Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/31Heat sealable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/748Releasability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • B32B2309/022Temperature vs pressure profiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • B32B2309/025Temperature vs time profiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/14Semiconductor wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206Organic displays, e.g. OLED
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • General Physics & Mathematics (AREA)
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  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Optical Filters (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Led Device Packages (AREA)

Abstract

一种技术,其包含:提供一总成,该总成在其相对侧边上借由个别的黏着元件提供一暂时黏着在相对侧边上的总成至个别载体,该总成包括至少一塑料支撑薄片;加热该总成而同时在所述载体的间机械性地压缩该总成的同时,加热该总成,其中,在机械性压缩下加热该总成期间在机械性压缩下,所述黏着元件的其中的一者的黏着至该个别载体及/或至该总成的黏着强度是部分地降减低;以及其中,在部分地或是完全地减轻除该总成在该二载体间经被机械性压缩该总成的该压力以后,借由进一步地加热该黏着元件,该黏着元件黏着至该载体及/或至该总成的黏着强度是可进一步地减小低。

Description

载体释脱技术
技术领域
总成的加工可包含暂时地在可松开地黏着至该总成的二载体的间支撑该总成。
发明内容
本申请案的发明人已致力于技术上改良所述载体在该总成的加工后自该总成释脱。
兹提供一种方法其包含:借由个别的黏着元件提供一暂时黏着在相对侧边上的总成至个别载体,该总成包括至少一塑料支撑薄片;加热该总成而同时在所述载体的间机械性地压缩该总成,其中在加热该总成期间在机械性压缩下所述黏着元件的其中的一者的黏着至该个别载体及/或总成的黏着是强度部分地降低;以及其中在部分地或是完全地减轻该总成在二载体间经机械性压缩该总成的该压力以后借由进一步地加热该黏着元件,该黏着元件黏着至该载体及/或至该总成的黏着强度是可进一步地减小。
根据一具体实施例,该方法进一步包含:在部分地或是完全地减轻该总成在二载体间经机械性压缩该总成的该压力以后,进一步加热该黏着元件以进一步地减小该黏着元件黏着至该载体及/或该总成的黏着强度,以及将该黏着元件由该载体及/或该总成释脱。
根据一具体实施例,部分地减小该黏着元件黏着至该载体及/或该总成的黏着强度而同时机械性地于所述载体的间压缩该总成包含:在该黏着元件接触该载体及/或总成处产生气袋从而减小该黏着元件的固态材料与该载体及/或该总成的间的接触面积;以及其中进一步地减小该至少一黏着元件与该载体及/或该总成的间的黏着强度包含:让该黏着元件的固态材料热膨胀以切断所述气袋间的位置处介于该黏着元件的固态材料与该载体及/或该总成的间的接触。
根据一具体实施例,该方法进一步包含含有将该载体及该总成的其中的一者由该黏着元件释脱而未将该载体及该总成的另一者由该黏着元件释脱。
根据一具体实施例,该总成包含一液晶显示组件其包括二塑料支撑薄片及间隔件用于在该二塑料支撑薄片的间产生空间以接受液晶材料。
根据一具体实施例,该总成包含二塑料支撑薄片,以及所述载体是用于在将该二支撑薄片层叠在一起以形成该总成的加工期间支撑所述塑料支撑薄片的个别的塑料支撑薄片。
根据一具体实施例,位在该总成的至少一侧边上的该黏着元件包含一支撑薄片及该支撑薄片的所述相对侧边上所支撑的二黏着层。
根据一具体实施例,该总成包含一塑料支撑薄片支撑界定薄膜晶体管(TFTs)的主动矩阵阵列的导体、半导体及绝缘体层的一堆叠。
根据一具体实施例,该方法进一步包含:将所述载体的其中的一者由该总成释脱而未将所述载体的另一者由该总成释脱,以及在這以后将该总成由所述载体的另一者剥除。
根据一具体实施例,该加热作业以部分地减小黏着强度亦包含将该总成内包括的黏着剂固化。
根据一具体实施例,加热该黏着元件以部分地减小该黏着强度包含建立一涵盖该黏着元件及总成的温度梯度,其是较进一步加热该黏着元件以进一步减小该黏着强度期间所建立的涵盖该黏着元件及总成的最小温度梯度为小。
根据一具体实施例,该方法进一步包含︰在该加热而同时机械性地在所述载体的间压缩该总成以后,冷却该总成而同时持续机械性地在所述载体的间压缩该总成;其中在机械性压缩下该总成的该加热及/或冷却期间所述黏着元件的其中的一者黏着至该个别载体及/或至该总成的黏着强度是部分地减小;以及其中该黏着元件黏着至该载体及/或至该总成的黏着强度是可借由在部分地或是完全地减轻该总成在二载体间经机械性压缩的该压力以后进一步地加热该黏着元件而进一步地降低。
兹提供一方法,其包含:借由个别的黏着元件提供一暂时黏着在相对侧边上的总成至个别载体,该总成包括至少一塑料支撑薄片;在至少一黏着元件内产生气体的状况下加热该总成及所述黏着元件,同时在所述载体的间在该塑料支撑薄片因该加热而起皱纹的状况受到抑制的一压力下压缩该总成,同时于所述载体与该至少一黏着元件间该界面处及/或该总成与该至少一黏着元件间该界面处保持所产生的气袋。
根据一具体实施例,该加热是在用于将该总成内包括的一黏着剂固化的状况下完成,以及当该黏着剂的固化完成时在所述界面(interface(s))处保持所述气袋。
根据一具体实施例,该方法进一步包含:在至少部分地减轻该总成在该二载体间经压缩的该压力以后,进一步地加热该至少一黏着元件以减小以下二者的间的黏着强度(i)该载体及/或总成与(ii)位于环绕所述气袋的位置中该至少一黏着元件的固态材料。
根据一具体实施例,该方法进一步包含含有冷却该总成及黏着元件,在至少部分地减轻该总成在该二载体间经机械性地压缩的该压力以及进一步加热该至少一黏着元件以进一步减小该载体及/或总成与位于环绕所述气袋的位置中该至少一黏着元件的固态材料间黏着强度的前,同时持续地在该二载体的间机械性地压缩该总成。
兹亦提供一方法,其包含:借由个别的黏着元件提供一暂时黏着在相对侧边上的总成至个别载体,该总成包括至少一塑料支撑薄片;加热该总成以完全地将包括于该总成内的一黏着剂固化,其中该至少一黏着元件黏着至该相邻载体及/或总成的黏着强度在该加热期间是部分地减小,并且在完全地将该总成内包括的该黏着剂固化以后借由进一步加热而可进一步地减小。
根据一具体实施例,首先借由冷却并接着在完全地将包括于该总成内的该黏着剂固化以后进一步加热,该至少一黏着元件黏着至该相邻载体及/或总成的该黏着强度可进一步地减小。
根据一具体实施例,包括于该总成内的该黏着剂将二组件于该总成内牢固在一起。
附图说明
本发明的具体实施例是于下文,仅经由实例,参考所述伴随的图示加以说明,其中:
图1图示根据本发明的一具体实施例的一技术的一实例;以及
图2图示将一黏着层由易载体释脱的一制程的实例。
具体实施方式
以下的说明是针对将二薄片组件层叠以形成一提供液晶显示(LCD)装置的一侧向阵列的总成的实例,但相同的技术是同样地适用于组件层叠以形成一总成提供一单一LCD装置或是一或更多其他型式的装置,诸如,例如,一或更多的囊封有机发光装置(OLED)显示器包含有机光发射材料的像素,其的光发射是受一主动矩阵阵列控制。
参考图1,一第一挠曲组件8是经由一黏着元件6可松开地牢固至一刚性的载体4,在该总成的加工期间其的黏着至该刚性的载体4与挠曲组件二者的黏着强度是足够高以抵挡该第一挠曲组件8的过度的热膨胀,但其(i)不会太高以防止在加工后该黏着元件6自至少该总成剥离或(ii)能够在该总成的加工后减小以有助于该黏着元件6自至少该总成释脱。例如,此黏着元件6可为一单一的压敏性黏着剂层,或是一单一的黏着剂层其的黏着至该第一挠曲组件8与刚性的载体4的其中的一或更多者的黏着强度能够借由增加温度(热释脱)、借由降低温度(冷释脱)或借由暴露至紫外光(UV)辐射(UV释脱)而减小。该黏着元件6亦可包含二黏着剂层位在一支撑薄膜的相对侧边上,其中该二层,例如,可包含一压敏性黏着剂、一热释脱黏着剂、冷释脱黏着剂及UV释脱黏着剂的任一结合。
于此实例中,该第一挠曲组件8包含一塑料支撑薄膜其支撑一对准薄膜用于控制紧邻该对准薄膜的部分液晶材料中所述液晶分子的定向,并亦可支撑一或更多另外的组件诸如(LCD)装置的该阵列所用的一共用电极,假若所述LCD装置是为以位在该液晶材料的相对侧边上的电极借于该液晶材料中产生一电场而作动的一型式。
第二挠曲组件12是经由一双侧黏着单元14可松开地牢固至另一刚性的载体16,该双侧黏着单元包含一支撑薄膜14b支撑与该载体16相邻的一热释脱黏着剂层14c以及与该第二挠曲组件12相邻的一第二黏着剂层14a。于此实例中,于该总成的加工期间该第二黏着剂层14a其的黏着至该第二挠曲组件12的黏着强度是足够高以抵挡该总成的过度的热膨胀,但其(i)不会太高以防止在加工后该黏着元件自该总成剥离或(ii)能够在该总成的加工后减小以有助于该第二黏着剂层14a自该总成释脱。该第二黏着剂层14a可,例如,包含(a)一压敏性黏着剂,(b)一热释脱黏着剂层其具有一高于该第一黏着剂层14c的释脱温度,(c)一冷释脱黏着剂层,或(d)一UV释脱黏着剂层。该第二挠曲组件12可包含一塑料支撑薄膜支撑:(i)导体、半导体及绝缘体/介电层的一堆叠,其界定供LCD装置所用的个别组的主动矩阵电路用于控制该液晶介质内该电场,以及(ii)间隔件结构10用于在该第一挠曲组件8与第二挠曲组件12之间产生一空间以接受供LCD装置的该阵列所用的液晶材料。在形成上述提及的主动矩阵层堆叠与位在该塑料支撑薄膜上的间隔件结构的前,该第二挠曲组件12的该塑料支撑薄膜可松开地牢固至该载体16。易言的,在该塑料支撑薄膜上形成所述组件期间该载体16可用以支撑该塑料支撑薄膜以产生该第二挠曲组件12,以及该双侧黏着单元14接着发挥作用以在用于在该塑料支撑薄膜上形成所述组件的所述加热步骤期间抵挡该塑料支撑薄膜的过度的热扭曲;及/或当该塑料支撑薄膜在一加热步骤后经冷却时将该塑料支撑薄膜恢复至其的位在该载体16上的原始位置。
于此实例中,所述第一挠曲组件8与第二挠曲组件12的至少的一者是配置具有一可热固化黏着剂用于将该二挠曲组件牢固在一起。该第一挠曲组件8与第二挠曲组件12接着相互对准(例如,包括对准标志的构件作为该第二挠曲组件的一部分并可由上方经由该透光载体(例如,玻璃)4、透光的黏着元件6、以及透光的第一挠曲组件8观测)并于所述载体4、16的间机械地压缩在一起(图1B)。尽管承受机械性压缩,总成(以及载体4、16)是于一烘烤炉中在该总成的该第一挠曲组件8与第二挠曲组件12之间该黏着剂变得完全地固化的状况下均匀地加热(俾以建立一涵盖该总成的零温度梯度)。无论介于该二挠曲组件的间该黏着剂是否完全地固化,例如,能够借由让该总成接受一剥离强度测试并将该量测的剥离强度与针对所使用的该特定黏着剂的一已知或是预定最大剥离强度比较而判定。同时,其中该二挠曲组件的间该总成内包含的该黏着剂的未固化形式对,例如,液晶材料具有损坏影响,未固化黏着剂的存在(亦即,无法完全地将该黏着剂固化)本身显现该液晶显示设备的性能退化。
此加热作业可包含于一系列的步骤中升高该烘烤炉的温度,并维持该烘烤炉于每一步骤温度下持续一个别的时段。将该黏着剂固化所需的该加热作业包含将该总成的该温度升高至一该总成内所述塑料支撑薄膜倾向于出现皱纹的温度,但如以下讨论,所述载体的间机械性地压缩该总成的该压力是足够高以实质上防止任何显著的起皱纹。
在已执行充分的加热以完全地将该第一挠曲组件8与第二挠曲组件12之间该黏着剂固化以后,该烘烤炉的该温度是降低并且该烘烤炉内侧的该总成及载体是容许冷却,同时持续地压缩介于该二载体的间该总成以防止在该冷却制程期间所述塑料薄膜的起皱纹。于此实例中,该黏着元件6所用的所述黏着剂(介于该第一挠曲组件与该刚性的载体4的间)以及第二黏着剂层14a所用的该黏着剂于该加热制程期间皆保持其的黏着至该总成/载体的黏着强度以完全地将该第一挠曲组件8与第二挠曲组件12之间该黏着剂固化。另一方面,供热释脱黏着剂层14c所用的该热释脱黏着剂是为一材料其在加热该总成的该制程期间产生气体以固化介于该第一挠曲组件8与第二挠曲组件12之间该黏着剂。如以下说明,该产生的气体于该热释脱黏着剂层14c与该刚性的载体16的界面处形成气袋,并且所述气袋的形成用以部分地减小该热释脱黏着剂层14c与该载体16的间的黏着强度。于该载体4、16的间压缩该总成的该压力是(i)足够低以保持该热释脱黏着剂层14c中产生的气体作为介于该热释脱黏着剂层14c与该载体16的间的的间该界面处的气袋(亦即,防止该热释脱黏着剂层14c内产生的气体侧向地从该热释脱黏着剂层14c与该载体16的间排出),但(ii)足够高以防止在加热该总成以将介于该二挠曲组件的间该黏着剂固化的该制程期间该总成内所述塑料支撑薄膜的起皱纹(平面外扭曲)。
该热释脱黏着剂层14c内气体的产生以及产生的气体保持在该热释脱黏着剂层14c与该载体16的界面处能够借由以下方式探测:于一真空下执行该加热作业并监测该真空室内压力的变化;及/或远程分析,例如,借由光谱法,介于该热释脱黏着剂层14c与该载体16的间该界面。
将该总成冷却至该总成内所述塑料支撑薄膜不再倾向起皱纹的一温度(于该冷却作业期间,所述气袋持续地保持在该热释脱黏着剂层14c与该刚性的载体16的该界面处)以后,结束于所述载体间机械性地压缩该总成,以及总成与所述载体4、16的结合是安置在一热板上让该载体16与该热释脱黏着剂层14c相邻最接近该热板的该表面,以致建立涵盖双侧黏着单元14与总成的该结合的一温度梯度。无机械性地压缩介于所述载体4、16的间该总成,该热板是用于升高该热释脱黏着剂层14c的温度至,在无机械压缩下,该热释脱黏着剂层14c热膨胀至一范围足以进一步降低该热释脱黏着剂层14c与该刚性的载体16的间该黏着强度的一温度。此进一步加热该热释脱黏着剂层14c是在无增加该总成的温度至该总成内所述塑料支撑薄膜倾向显著地起皱纹的一温度下完成。于一实例中,该热释脱黏着剂层14c所上升的该温度可高于在用于固化介于该第一挠曲组件8与第二挠曲组件12之间该黏着剂的该加热制程期间其所抵达的该最大温度。然而,于此第二加热阶段期间该载体16的释脱亦能够在较低的温度下达成。于此第二加热阶段期间该黏着层14的该热膨胀减小介于该载体16与该热释脱黏着剂层14c的间该界面处环绕所述气袋的所述接触面积中该黏着材料与该载体16的间的黏着强度;以及如此进一步减小该载体与该热释脱黏着剂层14c的间该黏着强度容许未施加机械力或是仅施加极微小的力量将该载体从该总成释脱(图1C)。
释脱一刚性的载体16有助于该整个双侧黏着单元14从该总成剥离(图1D)以及该接续地将该总成从黏着元件6剥离(图1D)。
供液晶装置的该侧向阵列所用的该液晶材料可在该第一挠曲组件8与第二挠曲组件12的层叠前分配在该第二挠曲组件12上,或是其可在层叠及该第一挠曲组件8与第二挠曲组件12之间该黏着剂的固化后射出进入借由该间隔件结构产生的该空间中。
经由实例:在以上说明的该技术中其中的一双侧黏着单元14所使用的一黏着剂产品是由Nitto Denko公司所取得以及产品名称为RAU-5HD1.SS;以及在以上说明的该技术中另一黏着元件6所使用的一黏着剂产品是由Nitta公司所取得以及产品名称为CX2325CA3。该产品名称为RAU-5HD1.SS的黏着剂产品包含一热释脱黏着剂及一UV释脱黏着剂位在一挠曲支撑薄膜的相对侧边上,以及该产品名称为CX2325CA3的黏着剂产品包含一冷释脱黏着剂以及一压敏性黏着剂是经支撑位在一挠曲支撑薄膜的相对侧边上。
于以上说明的实例中,与该载体相邻的该热释脱黏着剂层14c其的黏合至一相邻组件的该黏合强度是于用以将介于该二载体的间该黏着剂固化的该加热制程期间在机械性压缩作用下部分地减小,以及在完成用于将介于二载体的间该黏着剂固化的该加热制程以后进一步地减小(无机械性压缩)。然而,于一可交替的实例中,此层可为该双侧黏着单元14中与该总成相邻的该第二黏着剂层14a(借此该双侧黏着单元14是首先从该总成释脱),或是此层可为与该总成及该载体二者接触的一单一黏着层。
于以上说明的该实例中,一种可热固化黏着剂是用以将该二挠曲组件牢固在一起,但(a)一种可借由暴露至,例如,紫外光辐射而固化的黏着剂(UV-可固化黏着剂),(b)压敏性黏着剂,或(c)一种可借由雷射固化的黏着剂,是为可用于将该二挠曲组件牢固在一起的黏着剂的其他实例。甚至当不需施力即可将该二挠曲组件牢固在一起时,加热该总成至该总成内所述塑料支撑薄膜倾向于出现皱纹的一温度可用于其他的目的;以及该以上说明的技术在所述情况下同样地有用。
于以上说明的该实例中,该技术是用在制造液晶显示设备的一阵列,但相同的技术能够用在制造其他的装置,诸如,例如,制造主动矩阵式有机发光二极管(OLED)显示器供将该有机发光元件需囊封在湿气与氧阻挡元件的间所用。
以上说明的技术能够用以制造一总成不致发生任一挠曲组件的所述塑料支撑薄膜起显著的皱纹,甚至当所述挠曲组件具有一相对大的面积。
除了以上明确地提及的任何修改外,熟知此技艺的人士将为显而易见的是可对该说明的具体实施例作其他不同的修改而仍涵盖在本发明的范畴内。

Claims (17)

1.一种处理方法,其包含:
提供一总成,该总成在其相对侧边上借由相应的黏着元件暂时黏着至相应载体,该总成包括至少一塑料支撑薄片;
在机械性压缩在所述载体之间的该总成的同时,加热该总成,其中,在机械性压缩下加热该总成期间,所述黏着元件中的一者的黏着至该相应载体和/或该总成的黏着强度部分地减低;以及其中,在部分地或完全地减除该总成在两个载体之间被机械性压缩的压力以后,借由进一步加热该黏着元件,该黏着元件黏着至该载体和/或该总成的黏着强度能够进一步减低。
2.根据权利要求1所述的方法,所述方法进一步包含:在部分地或完全地减除该总成在该两个载体之间被机械性压缩的压力以后,进一步加热该黏着元件以进一步减低该黏着元件黏着至该载体和/或该总成的黏着强度,以及将该黏着元件从该载体和/或该总成释脱。
3.根据权利要求1所述的方法,其中,在机械性压缩在所述载体之间的该总成的同时、部分地减低该黏着元件黏着至该载体和/或该总成的黏着强度包括:在该黏着元件接触该载体和/或总成处产生气袋,从而减少该黏着元件的固态材料与该载体和/或该总成之间的接触面积;以及其中,进一步减低该至少一黏着元件与该载体和/或该总成之间的黏着强度包括:热膨胀该黏着元件的固态材料以切断在所述气袋之间的位置中、在该黏着元件的固态材料与该载体和/或该总成之间的接触。
4.根据权利要求2所述的方法,其中,在机械性压缩在所述载体之间的该总成的同时、部分地减低该黏着元件黏着至该载体和/或该总成的黏着强度包括:在该黏着元件接触该载体和/或总成处产生气袋,从而减少该黏着元件的固态材料与该载体和/或该总成之间的接触面积;以及其中,进一步减低该至少一黏着元件与该载体和/或该总成之间的黏着强度包括:热膨胀该黏着元件的固态材料以切断在所述气袋之间的位置中、在该黏着元件的固态材料与该载体和/或该总成之间的接触。
5.根据权利要求1所述的方法,所述方法包括:将该载体及该总成中的一者从该黏着元件释脱而未将该载体及该总成中的另一者从该黏着元件释脱。
6.根据权利要求1-5中任一项所述的方法,其中,该总成包括一液晶显示组件,该液晶显示组件包括间隔件和两个塑料支撑薄片,该间隔件用于产生空间以在该两个塑料支撑薄片之间接收液晶材料。
7.根据权利要求1-5中任一项所述的方法,其中,该总成包括两个塑料支撑薄片,所述载体是在将该两个塑料支撑薄片重叠在一起以形成该总成的加工期间用于支撑所述塑料支撑薄片中的相应塑料支撑薄片。
8.根据权利要求1-5中任一项所述的方法,其中,位于该总成的至少一侧边上的该黏着元件包括一支撑薄片和在该支撑薄片的相对侧边上所支撑的两个黏着层。
9.根据权利要求1-5中任一项所述的方法,其中,该总成包括一塑料支撑薄片,该塑料支撑薄片支撑界定薄膜晶体管的主动矩阵阵列的导体层、半导体层和绝缘体层的一堆叠。
10.根据权利要求1-5中任一项所述的方法,所述方法进一步包括:将所述载体中的一者从该总成释脱而未将所述载体中的另一者从该总成释脱,以及此后将该总成从所述载体中的另一者剥除。
11.根据权利要求1-5中任一项所述的方法,其中,加热以部分地减低黏着强度还包括:将包含在该总成内的黏着剂固化。
12.根据权利要求1-5中任一项所述的方法,其中,加热该黏着元件以部分地减低该黏着强度包括:建立一涵盖该黏着元件及总成的温度梯度,该温度梯度比进一步加热该黏着元件以进一步减低该黏着强度期间所建立的涵盖该黏着元件及总成的最小温度梯度还小。
13.根据权利要求1-5中任一项所述的方法,其包含:在加热及同时机械性压缩在所述载体之间的该总成以后,冷却该总成及同时持续机械性压缩在所述载体之间的该总成;其中在加热和/或冷却在机械压缩下的该总成的期间,所述黏着元件中的一者黏着至相应载体和/或该总成的黏着强度部分地减低;以及其中在部分地或完全地减除该总成在该两个载体之间被机械性压缩的压力以后,该黏着元件黏着至该相应载体和/或该总成的黏着强度借由进一步加热该黏着元件而能够进一步减低。
14.一种处理方法,所述方法包含:
提供一总成,该总成在其相对侧边上借由相应的黏着元件暂时黏着至相应载体,该总成包括至少一塑料支撑薄片;
在至少一黏着元件内产生气体的状况下加热该总成及所述黏着元件,同时在一可防止该塑料支撑薄片因加热而起皱纹的压力下压缩在所述载体之间的该总成,同时在所述载体与该至少一黏着元件之间的界面处和/或该总成与该至少一黏着元件之间的界面处保持所产生的气袋。
15.根据权利要求14所述的方法,其中,该加热是在用以将包含在该总成内的一黏着剂固化下完成,并且当该黏着剂的固化完成时在所述界面处保持所述气袋。
16.根据权利要求14或15所述的方法,所述方法进一步包括:在至少部分地减除该总成在该两个载体之间被压缩的压力以后,进一步加热该至少一黏着元件以减低介于(i)该载体和/或总成与(ii)在环绕所述气袋的位置中该至少一黏着元件的固态材料之间的黏着强度。
17.根据权利要求16所述的方法,所述方法包括:在持续地机械性压缩在该两个载体之间的该总成的同时冷却该总成及黏着元件,之后进行至少部分地减除该总成在该两个载体之间被机械性压缩的压力以及进一步加热该至少一黏着元件以进一步减低该载体和/或总成与位于环绕所述气袋的位置中该至少一黏着元件的固态材料之间的黏着强度。
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