TW201743116A - 載體釋脫技術 - Google Patents

載體釋脫技術 Download PDF

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TW201743116A
TW201743116A TW106115469A TW106115469A TW201743116A TW 201743116 A TW201743116 A TW 201743116A TW 106115469 A TW106115469 A TW 106115469A TW 106115469 A TW106115469 A TW 106115469A TW 201743116 A TW201743116 A TW 201743116A
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assembly
adhesive
carrier
heating
carriers
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TW106115469A
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TWI739827B (zh
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Barry Wild
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Flexenable Ltd
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    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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Abstract

一種方法，其包含：提供一總成，該總成在其相對側邊上藉由個別的黏著元件提供一暫時黏著在相對側邊上的總成至個別載體，該總成包括至少一塑膠支撐薄片； 加熱該總成而同時在該等載體之間機械性地壓縮該總成之同時，加熱該總成，其中，在機械性壓縮下加熱該總成期間在機械性壓縮下，該等黏著元件的其中之一者之黏著至該個別載體及/或至該總成的黏著強度係部分地降減低；以及其中，在部分地或是完全地減輕除該總成在該二載體間經被機械性壓縮該總成的該壓力之後，藉由進一步地加熱該黏著元件，該黏著元件黏著至該載體及/或至該總成的黏著強度係可進一步地減小低。

Description

載體釋脫技術
發明領域 總成之加工可包含暫時地在可鬆開地黏著至該總成的二載體之間支撐該總成。
發明背景 以往提供自一總成釋脫載體的手段。
發明概要 本申請案之發明人已致力於技術上改良該等載體在該總成之加工後自該總成釋脫。
茲提供一種方法其包含︰藉由個別的黏著元件提供一暫時黏著在相對側邊上的總成至個別載體，該總成包括至少一塑膠支撐薄片；加熱該總成而同時在該等載體之間機械性地壓縮該總成，其中在加熱該總成期間在機械性壓縮下該等黏著元件的其中之一者之黏著至該個別載體及/或總成的黏著強度係部分地降低；以及其中在部分地或是完全地減輕該總成在二載體間經機械性壓縮該總成的該壓力之後藉由進一步地加熱該黏著元件，該黏著元件黏著至該載體及/或至該總成的黏著強度係可進一步地減小。
根據一具體實施例，該方法進一步包含：在部分地或是完全地減輕該總成在二載體間經機械性壓縮該總成的該壓力之後，進一步加熱該黏著元件以進一步地減小該黏著元件黏著至該載體及/或該總成的黏著強度，以及將該黏著元件由該載體及/或該總成釋脫。
根據一具體實施例，部分地減小該黏著元件黏著至該載體及/或該總成的黏著強度而同時機械性地於該等載體之間壓縮該總成包含：在該黏著元件接觸該載體及/或總成處產生氣袋從而減小該黏著元件之固態材料與該載體及/或該總成之間的接觸面積；以及其中進一步地減小該至少一黏著元件與該載體及/或該總成之間的黏著強度包含：讓該黏著元件之固態材料熱膨脹以切斷該等氣袋間的位置處介於該黏著元件之固態材料與該載體及/或該總成之間的接觸。
根據一具體實施例，該方法進一步包含含有將該載體及該總成的其中之一者由該黏著元件釋脫而未將該載體及該總成的另一者由該黏著元件釋脫。
根據一具體實施例，該總成包含一液晶顯示組件其包括二塑膠支撐薄片及間隔件用於在該二塑膠支撐薄片之間產生空間以接受液晶材料。
根據一具體實施例，該總成包含二塑膠支撐薄片，以及該等載體係用於在將該二支撐薄片層疊在一起以形成該總成之加工期間支撐該等塑膠支撐薄片之個別的塑膠支撐薄片。
根據一具體實施例，位在該總成之至少一側邊上的該黏著元件包含一支撐薄片及該支撐薄片之該等相對側邊上所支撐的二黏著層。
根據一具體實施例，該總成包含一塑膠支撐薄片支撐界定薄膜電晶體(TFTs)之主動矩陣陣列的導體、半導體及絕緣體層的一堆疊。
根據一具體實施例，該方法進一步包含：將該等載體的其中之一者由該總成釋脫而未將該等載體的另一者由該總成釋脫，以及之後將該總成由該等載體之另一者剝除。
根據一具體實施例，該加熱作業以部分地減小黏著強度亦包含將該總成內包括的黏著劑固化。
根據一具體實施例，加熱該黏著元件以部分地減小該黏著強度包含建立一涵蓋該黏著元件及總成的溫度梯度，其係較進一步加熱該黏著元件以進一步減小該黏著強度期間所建立之涵蓋該黏著元件及總成的最小溫度梯度為小。
根據一具體實施例，該方法進一步包含︰在該加熱而同時機械性地在該等載體之間壓縮該總成之後，冷卻該總成而同時持續機械性地在該等載體之間壓縮該總成；其中在機械性壓縮下該總成之該加熱及/或冷卻期間該等黏著元件的其中之一者黏著至該個別載體及/或至該總成的黏著強度係部分地減小；以及其中該黏著元件黏著至該載體及/或至該總成的黏著強度係可藉由在部分地或是完全地減輕該總成在二載體間經機械性壓縮的該壓力之後進一步地加熱該黏著元件而進一步地降低。
茲提供一方法，其包含︰藉由個別的黏著元件提供一暫時黏著在相對側邊上的總成至個別載體，該總成包括至少一塑膠支撐薄片；在至少一黏著元件內產生氣體的狀況下加熱該總成及該等黏著元件，同時在該等載體之間在該塑膠支撐薄片因該加熱而起皺紋之狀況受到抑制的一壓力下壓縮該總成，同時於該等載體與該至少一黏著元件間該界面處及/或該總成與該至少一黏著元件間該界面處保持所產生之氣袋。
根據一具體實施例，該加熱係在用於將該總成內包括的一黏著劑固化的狀況下完成，以及當該黏著劑之固化完成時在該(等)界面處保持該等氣袋。
根據一具體實施例，該方法進一步包含︰在至少部分地減輕該總成在該二載體間經壓縮的該壓力之後，進一步地加熱該至少一黏著元件以減小以下二者之間的黏著強度(i)該載體及/或總成與(ii)位於環繞該等氣袋之位置中該至少一黏著元件之固態材料。
根據一具體實施例，該方法進一步包含含有冷卻該總成及黏著元件，在至少部分地減輕該總成在該二載體間經機械性地壓縮的該壓力以及進一步加熱該至少一黏著元件以進一步減小該載體及/或總成與位於環繞該等氣袋之位置中該至少一黏著元件之固態材料間黏著強度之前，同時持續地在該二載體之間機械性地壓縮該總成。
茲亦提供一方法，其包含：藉由個別的黏著元件提供一暫時黏著在相對側邊上的總成至個別載體，該總成包括至少一塑膠支撐薄片；加熱該總成以完全地將包括於該總成內的一黏著劑固化，其中該至少一黏著元件黏著至該相鄰載體及/或總成的黏著強度在該加熱期間係部分地減小，並且在完全地將該總成內包括的該黏著劑固化之後藉由進一步加熱而可進一步地減小。
根據一具體實施例，首先藉由冷卻並接著在完全地將包括於該總成內的該黏著劑固化之後進一步加熱，該至少一黏著元件黏著至該相鄰載體及/或總成的該黏著強度可進一步地減小。
根據一具體實施例，包括於該總成內的該黏著劑將二組件於該總成內牢固在一起。
較佳實施例之詳細說明 以下的說明係針對將二薄片組件層疊以形成一提供液晶顯示(LCD)裝置之一側向陣列之總成之實例，但相同的技術係同樣地適用於組件層疊以形成一總成提供一單一LCD裝置或是一或更多其他型式之裝置，諸如，例如，一或更多的囊封有機發光裝置(OLED)顯示器包含有機光發射材料之像素，其之光發射係受一主動矩陣陣列控制。
參考圖1，一第一撓曲組件8係經由一黏著元件6可鬆開地牢固至一剛性載體4，在該總成之加工期間其之黏著至該剛性載體4與撓曲組件二者的黏著強度係足夠高以抵擋該撓曲組件8之過度的熱膨脹，但其(i)不會太高以防止在加工後該黏著元件6自至少該總成剝離或(ii)能夠在該總成之加工後減小以有助於該黏著元件6自至少該總成釋脫。例如，此黏著元件6可為一單一的壓敏性黏著劑層，或是一單一的黏著劑層其之黏著至該第一撓曲組件8與剛性載體4的其中之一或更多者的黏著強度能夠藉由增加溫度(熱釋脫)、藉由降低溫度(冷釋脫)或藉由暴露至紫外光(UV)輻射(UV釋脫)而減小。該黏著元件6亦可包含二黏著劑層位在一支撐薄膜的相對側邊上，其中該二層，例如，可包含一壓敏性黏著劑、一熱釋脫黏著劑、冷釋脫黏著劑及UV釋脫黏著劑之任一結合。
於此實例中，該第一撓曲組件8包含一塑膠支撐薄膜其支撐一對準薄膜用於控制緊鄰該對準薄膜的部分液晶材料中該等液晶分子之定向，並亦可支撐一或更多另外的組件諸如(LCD)裝置之該陣列所用的一共用電極，假若該等LCD裝置係為以位在該液晶材料之相對側邊上的電極藉於該液晶材料中產生一電場而作動的一型式。
第二撓曲組件12係經由一雙側黏著單元14可鬆開地牢固至另一剛性載體16，該雙側黏著單元包含一支撐薄膜14b支撐與該載體16相鄰的一熱釋脫黏著劑層14c以及與該第二撓曲組件12相鄰的一第二黏著劑層14a。於此實例中，於該總成之加工期間該第二黏著劑層14a其之黏著至該第二撓曲組件12的黏著強度係足夠高以抵擋該總成之過度的熱膨脹，但其(i)不會太高以防止在加工後該黏著元件自該總成剝離或(ii)能夠在該總成之加工後減小以有助於該黏著元件14a自該總成釋脫。該第二黏著劑層14a可，例如，包含(a)一壓敏性黏著劑，(b)一熱釋脫黏著劑層其具有一高於該第一黏著劑層14c的釋脫溫度，(c)一冷釋脫黏著劑層，或(d)一UV釋脫黏著劑層。該第二撓曲組件12可包含一塑膠支撐薄膜支撐：(i)導體、半導體及絕緣體/介電層的一堆疊，其界定供LCD裝置所用的個別組之主動矩陣電路用於控制該液晶介質內該電場，以及(ii)間隔件結構10用於在該第一與第二撓曲組件8、12之間產生一空間以接受供LCD裝置之該陣列所用之液晶材料。在形成上述提及的主動矩陣層堆疊與位在該塑膠支撐薄膜上的間隔件結構之前，該第二撓曲組件12之該塑膠支撐薄膜可鬆開地牢固至該載體16。易言之，在該塑膠支撐薄膜上形成該等組件期間該載體16可用以支撐該塑膠支撐薄膜以產生該第二撓曲組件12，以及該黏著元件14接著發揮作用以在用於在該塑膠支撐薄膜上形成該等組件的該等加熱步驟期間抵擋該塑膠支撐薄膜之過度的熱扭曲；及/或當該塑膠支撐薄膜在一加熱步驟後經冷卻時將該塑膠支撐薄膜恢復至其之位在該載體16上的原始位置。
於此實例中，該等撓曲組件8、12的至少之一者係配置具有一可熱固化黏著劑用於將該二撓曲組件牢固在一起。該二撓曲組件8、12接著相互對準(例如，包括對準標誌之構件作為該第二撓曲組件的一部分並可由上方經由該透光載體(例如，玻璃)4、透光的黏著元件6、以及透光的第一撓曲組件8觀測)並於該等載體4,16之間機械地壓縮在一起(圖1B)。儘管承受機械性壓縮，總成(以及載體4、16)係於一烘烤爐中在該總成之該二撓曲組件8、12之間該黏著劑變得完全地固化的狀況下均勻地加熱(俾以建立一涵蓋該總成的零溫度梯度)。無論介於該二撓曲組件之間該黏著劑是否完全地固化，例如，能夠藉由讓該總成接受一剝離強度測試並將該量測的剝離強度與針對所使用之該特定黏著劑的一已知或是預定最大剝離強度比較而判定。同時，其中該二撓曲組件之間該總成內包含的該黏著劑之未固化形式對，例如，液晶材料具有損壞影響，未固化黏著劑之存在(亦即，無法完全地將該黏著劑固化)本身顯現該液晶顯示裝置之性能退化。
此加熱作業可包含於一系列的步驟中升高該烘烤爐之溫度，並維持該烘烤爐於每一步驟溫度下持續一個別的時段。將該黏著劑固化所需的該加熱作業包含將該總成之該溫度升高至一該總成內該等塑膠支撐薄膜傾向於出現皺紋的溫度，但如以下討論，該等載體之間機械性地壓縮該總成的該壓力係足夠高以實質上防止任何顯著的起皺紋。
在已執行充分的加熱以完全地將該二撓曲組件8、12之間該黏著劑固化之後，該烘烤爐之該溫度係降低並且該烘烤爐內側的該總成及載體係容許冷卻，同時持續地壓縮介於該二載體之間該總成以防止在該冷卻製程期間該等塑膠薄膜之起皺紋。於此實例中，該黏著元件6所用的該等黏著劑(介於該第一撓曲組件與該剛性載體4之間)以及黏著層14a所用的該黏著劑於該加熱製程期間皆保持其之黏著至該總成/載體的黏著強度以完全地將該二撓曲組件8、12之間該黏著劑固化。另一方面，供黏著層14c所用的該熱釋脫黏著劑係為一材料其在加熱該總成之該製程期間產生氣體以固化介於該二撓曲組件8、12之間該黏著劑。如以下說明，該產生的氣體於該黏著層14c與該剛性載體16之界面處形成氣袋，並且該等氣袋之形成用以部分地減小該黏著層14c與該載體16之間的黏著強度。於該二載體4、16之間壓縮該總成之該壓力係(i)足夠低以保持該黏著層14c中產生的氣體作為介於該黏著層14c與該載體16之間的之間該界面處之氣袋(亦即，防止該黏著層14c內產生的氣體側向地從該黏著層14c與該載體16之間排出)，但(ii)足夠高以防止在加熱該總成以將介於該二撓曲組件之間該黏著劑固化之該製程期間該總成內該等塑膠支撐薄膜之起皺紋(平面外扭曲)。
該黏著層14c內氣體的產生以及產生的氣體保持在該黏著層14c與該載體16之界面處能夠藉由以下方式探測：於一真空下執行該加熱作業並監測該真空室內壓力的變化；及/或遠程分析，例如，藉由光譜法，介於該黏著層14c與該載體16之間該界面。
將該總成冷卻至該總成內該等塑膠支撐薄膜不再傾向起皺紋的一溫度(於該冷卻作業期間，該等氣袋持續地保持在該黏著層14c與該剛性載體16之該界面處)之後，結束於該等載體間機械性地壓縮該總成，以及總成與該等載體4、16之結合係安置在一熱板上讓該載體16與該黏著層14c相鄰最接近該熱板之該表面，以致建立涵蓋黏著元件14與總成之該結合的一溫度梯度。無機械性地壓縮介於該等載體4、16之間該總成，該熱板係用於升高該黏著層14c之溫度至，在無機械壓縮下，該黏著層14c熱膨脹至一範圍足以進一步降低該黏著層14c與該剛性載體16之間該黏著強度的一溫度。此進一步加熱該黏著層14c係在無增加該總成之溫度至該總成內該等塑膠支撐薄膜傾向顯著地起皺紋的一溫度下完成。於一實例中，該黏著層14c所上升的該溫度可高於在用於固化介於該二撓曲組件8、12之間該黏著劑的該加熱製程期間其所抵達之該最大溫度。然而，於此第二加熱階段期間該載體16之釋脫亦能夠在較低的溫度下達成。於此第二加熱階段期間該黏著層14之該熱膨脹減小介於該載體16與該黏著層14c之間該界面處環繞該等氣袋的該等接觸面積中該黏著材料與該載體16之間的黏著強度；以及如此進一步減小該載體與該黏著層14c之間該黏著強度容許未施加機械力或是僅施加極微小的力量將該載體從該總成釋脫(圖1C)。
釋脫一剛性載體16有助於該整個黏著單元14從該總成剝離(圖1D)以及該接續地將該總成從黏著單元6剝離(圖1D)。
供液晶裝置之該側向陣列所用的該液晶材料可在該二撓曲組件8、12之層疊前分配在該下可撓曲組件12上，或是其可在層疊及該二撓曲組件8、12之間該黏著劑之固化後射出進入藉由該間隔件結構產生的該空間中。
經由實例︰在以上說明的該技術中其中之一黏著單元14所使用的一黏著劑產品係由Nitto Denko公司所取得以及產品名稱為RAU-5HD1.SS；以及在以上說明的該技術中另一黏著單元6所使用的一黏著劑產品係由Nitta公司所取得以及產品名稱為CX2325CA3。該產品名稱為RAU-5HD1.SS的黏著劑產品包含一熱釋脫黏著劑及一UV釋脫黏著劑位在一撓曲支撐薄膜的相對側邊上，以及該產品名稱為CX2325CA3的黏著劑產品包含一冷釋脫黏著劑以及一壓敏性黏著劑係經支撐位在一撓曲支撐薄膜的相對側邊上。
於以上說明的實例中，與該載體相鄰的該黏著層14c其之黏合至一相鄰元件的該黏合強度係於用以將介於該二載體之間該黏著劑固化的該加熱製程期間在機械性壓縮作用下部分地減小，以及在完成用於將介於二載體之間該黏著劑固化的該加熱製程之後進一步地減小(無機械性壓縮)。然而，於一可交替的實例中，此層可為該黏著單元14中與該總成相鄰的該黏著劑層14a(藉此該黏著單元14係首先從該總成釋脫)，或是此層可為與該總成及該載體二者接觸的一單一黏著層。
於以上說明的該實例中，一種可熱固化黏著劑係用以將該二撓曲組件牢固在一起，但(a)一種可藉由暴露至，例如，紫外光輻射而固化的黏著劑(UV-可固化黏著劑)，(b)壓敏性黏著劑，或(c)一種可藉由雷射固化的黏著劑，係為可用於將該二撓曲組件牢固在一起之黏著劑的其他實例。甚至當不需施力即可將該二撓曲組件牢固在一起時，加熱該總成至該總成內該等塑膠支撐薄膜傾向於出現皺紋的一溫度可用於其他的目的；以及該以上說明的技術在該等情況下同樣地有用。
於以上說明的該實例中，該技術係用在製造液晶顯示裝置之一陣列，但相同的技術能夠用在製造其他的裝置，諸如，例如，製造主動矩陣式有機發光二極體(OLED)顯示器供將該有機發光元件需囊封在濕氣與氧阻擋元件之間所用。
以上說明的技術能夠用以製造一總成不致發生任一撓曲組件之該等塑膠支撐薄膜起顯著的皺紋，甚至當該等撓曲組件具有一相對大的面積。
除了以上明確地提及的任何修改外，熟知此技藝之人士將為顯而易見的是可對該說明的具體實施例作其他不同的修改而仍涵蓋在本發明之範疇內。
4,16‧‧‧剛性載體 6‧‧‧黏著元件 8‧‧‧第一撓曲組件 10‧‧‧間隔件結構 12‧‧‧第二撓曲組件 14‧‧‧雙側黏著單元 14a‧‧‧第二黏著劑層 14b‧‧‧支撐薄膜 14c‧‧‧熱釋脫黏著劑層 16‧‧‧載體
本發明之具體實施例係於之後，僅經由實例，參考該等伴隨的圖式加以說明，其中： 圖1圖示根據本發明之一具體實施例之一技術的一實例；以及 圖2圖示將一黏著層由一載體釋脫的一製程之一實例。
4,16‧‧‧剛性載體
6‧‧‧黏著元件
8‧‧‧第一撓曲組件
10‧‧‧間隔件結構
12‧‧‧第二撓曲組件
14‧‧‧雙側黏著單元
14a‧‧‧第二黏著劑層
14b‧‧‧支撐薄膜
14c‧‧‧熱釋脫黏著劑層
16‧‧‧載體

Claims (19)

  1. 一種方法，其包含： 提供一總成，該總成在其相對側邊上藉由個別的黏著元件暫時黏著至個別載體，該總成包括至少一塑膠支撐薄片； 機械性地壓縮在該等載體間之該總成之同時，加熱該總成，其中，在機械性壓縮下加熱該總成期間，該等黏著元件中之一者之黏著至該個別載體及/或至該總成的黏著強度係部分地減低；以及其中，在部分地或是完全地減除該總成在該二載體間被機械性壓縮的壓力之後，藉由進一步加熱該黏著元件，該黏著元件黏著至該載體及/或至該總成的黏著強度係可進一步地減低。
  2. 如請求項1之方法，其進一步包含：在部分地或是完全地減除該總成在該二載體間被機械性壓縮的壓力之後，進一步加熱該黏著元件以進一步減低該黏著元件黏著至該載體及/或該總成的黏著強度，以及將該黏著元件由該載體及/或該總成釋脫。
  3. 如請求項1或2之方法，其中機械性地壓縮在該等載體間之該總成之同時、部分地減低該黏著元件黏著至該載體及/或至該總成的黏著強度係包含：在該黏著元件接觸該載體及/或總成處產生氣袋，從而減少該黏著元件之固態材料與該載體及/或該總成之間的接觸面積；以及其中進一步減低該至少一黏著元件與該載體及/或該總成之間的黏著強度係包含：熱膨脹該黏著元件之固態材料以切斷位在該等氣袋之間介於該黏著元件之固態材料與該載體及/或該總成之間的接觸。
  4. 如請求項1之方法，係包含將該載體及該總成中之一者由該黏著元件釋脫而未將該載體及該總成中的另一者由該黏著元件釋脫。
  5. 如前述任一請求項之方法，其中該總成包含一液晶顯示組件，其包括二塑膠支撐薄片及間隔件用於在該二塑膠支撐薄片之間產生空間以接受液晶材料。
  6. 如前述任一請求項之方法，其中該總成包含二塑膠支撐薄片，以及該等載體係在將該二支撐薄片層疊在一起以形成該總成之加工期間用於支撐該等塑膠支撐薄片中之個別的塑膠支撐薄片。
  7. 如前述任一請求項之方法，其中位在該總成之至少一側邊上的該黏著元件包含一支撐薄片及該支撐薄片之該等相對側邊上所支撐的二黏著層。
  8. 如前述任一請求項之方法，其中該總成包含一塑膠支撐薄片，其支撐界定薄膜電晶體(TFTs)之主動矩陣陣列的導體、半導體及絕緣體層的一堆疊。
  9. 如前述任一請求項之方法，係進一步包含：將該等載體中之一者由該總成釋脫而未將該等載體中的另一者由該總成釋脫，以及之後將該總成由該等載體中之另一者剝除。
  10. 如前述任一請求項之方法，其中加熱以部分地減低黏著強度亦包含將該總成內包括的黏著劑固化。
  11. 如前述任一請求項之方法，其中加熱該黏著元件以部分地減低該黏著強度包含建立一涵蓋該黏著元件及總成的溫度梯度，其係比進一步加熱該黏著元件以進一步減低該黏著強度期間所建立之涵蓋該黏著元件及總成的最小溫度梯度還小。
  12. 一種方法，其包含： 提供一總成，該總成在其相對側邊上藉由個別的黏著元件暫時黏著至個別載體，該總成包括至少一塑膠支撐薄片； 在至少一黏著元件內產生氣體的狀況下加熱該總成及該等黏著元件，同時在一可防止該塑膠支撐薄片因加熱而起皺紋的壓力下壓縮在該等載體之間的該總成，同時於該等載體與該至少一黏著元件之間的界面處及/或該總成與該至少一黏著元件之間的界面處保持所產生之氣袋。
  13. 如請求項12之方法，其中該加熱係在用以將該總成內包括的一黏著劑固化下完成，以及當該黏著劑之固化完成時在該(等)界面處保持該等氣袋。
  14. 如請求項12或13之方法，係進一步包含︰在至少部分地減除該總成在該二載體間被壓縮的壓力之後，進一步加熱該至少一黏著元件以減低介於(i)該載體及/或總成及(ii)位於環繞該等氣袋之位置中該至少一黏著元件之固態材料之間的黏著強度。
  15. 如請求項14之方法，係包含，在持續地機械性壓縮在該二載體間之該總成的同時，冷卻該總成及黏著元件，其係在，在至少部分地減除該總成在該二載體間被機械性壓縮的壓力以及進一步加熱該至少一黏著元件以進一步減低該載體及/或總成與位於環繞該等氣袋之位置中該至少一黏著元件之固態材料之間的黏著強度之前，進行。
  16. 一種方法，其包含︰ 提供一總成，該總成在其相對側邊上藉由個別的黏著元件暫時黏著至個別載體，該總成包括至少一塑膠支撐薄片； 加熱該總成以完全地將包括於該總成內的一黏著劑固化，其中該至少一黏著元件黏著至該相鄰載體及/或總成的黏著強度在該加熱期間係部分地減低，並且在完全地將該總成內包括的該黏著劑固化之後藉由進一步加熱而可進一步地減低。
  17. 如請求項16之方法，其中藉由先冷卻並接著在完全地將包括於該總成內的該黏著劑固化之後進一步加熱，該至少一黏著元件黏著至該相鄰載體及/或總成的該黏著強度可進一步減低。
  18. 如請求項16或17之方法，其中包括於該總成內的該黏著劑將該總成內的二組件牢固在一起。
  19. 如請求項1至11中任一項之方法，其包含︰在加熱及同時機械性壓縮於該等載體之間之該總成之後，冷卻該總成及同時持續機械性壓縮於該等載體之間之該總成；其中在加熱及/或冷卻在機械壓縮下之該總成的期間，該等黏著元件中之一者黏著至個別載體及/或至該總成的黏著強度係部分地減低；以及其中在部分地或是完全地減除該總成在該二載體間被機械性壓縮的壓力之後，該黏著元件黏著至該個別載體及/或至該總成的黏著強度係藉由進一步加熱該黏著元件而可進一步地減低。
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