RU2763361C2 - Отделение опорных пластин - Google Patents

Отделение опорных пластин Download PDF

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Publication number
RU2763361C2
RU2763361C2 RU2018141323A RU2018141323A RU2763361C2 RU 2763361 C2 RU2763361 C2 RU 2763361C2 RU 2018141323 A RU2018141323 A RU 2018141323A RU 2018141323 A RU2018141323 A RU 2018141323A RU 2763361 C2 RU2763361 C2 RU 2763361C2
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Russia
Prior art keywords
adhesive
prefabricated product
specified
adhesive element
assembly
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RU2018141323A
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English (en)
Russian (ru)
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RU2018141323A3 (enExample
RU2018141323A (ru
Inventor
Барри УАЙЛД
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Флексенэбл Лимитед
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    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
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    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
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    • H10D86/021—Manufacture or treatment of multiple TFTs
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    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
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    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Quality & Reliability (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Filters (AREA)
  • Led Device Packages (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
RU2018141323A 2016-05-11 2017-05-11 Отделение опорных пластин RU2763361C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1608279.4A GB2554040B (en) 2016-05-11 2016-05-11 Carrier release
GB1608279.4 2016-05-11
PCT/EP2017/061319 WO2017194672A1 (en) 2016-05-11 2017-05-11 Carrier release

Publications (3)

Publication Number Publication Date
RU2018141323A RU2018141323A (ru) 2020-06-11
RU2018141323A3 RU2018141323A3 (enExample) 2020-09-03
RU2763361C2 true RU2763361C2 (ru) 2021-12-28

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Application Number Title Priority Date Filing Date
RU2018141323A RU2763361C2 (ru) 2016-05-11 2017-05-11 Отделение опорных пластин

Country Status (8)

Country Link
US (2) US10658401B2 (enExample)
JP (2) JP7030063B2 (enExample)
KR (2) KR102577280B1 (enExample)
CN (2) CN114013119B (enExample)
GB (2) GB2554040B (enExample)
RU (1) RU2763361C2 (enExample)
TW (2) TWI792502B (enExample)
WO (1) WO2017194672A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2554040B (en) * 2016-05-11 2023-01-25 Flexenable Ltd Carrier release
GB2568240B (en) * 2017-11-03 2023-01-25 Flexenable Ltd Method of producing liquid crystal devices comprising a polariser component between two lc cells
US10964582B2 (en) * 2019-06-24 2021-03-30 Palo Alto Research Center Incorporated Transfer substrate utilizing selectable surface adhesion transfer elements
GB2593418B (en) 2019-10-10 2023-12-13 Flexenable Tech Limited Liquid crystal devices

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US20050173051A1 (en) * 2001-11-15 2005-08-11 Munehiro Hatai Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape
US20130306231A1 (en) * 2011-08-05 2013-11-21 Panasonic Corporation Method for manufacturing flexible device
US20160035764A1 (en) * 2010-06-04 2016-02-04 Plastic Logic Limited Processing substrates using a temporary carrier

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JPH0850282A (ja) * 1994-05-30 1996-02-20 Sanyo Electric Co Ltd 表示装置の製造方法
JP2000241822A (ja) * 1999-02-17 2000-09-08 Seiko Epson Corp 液晶パネルの製造方法
JP2000241823A (ja) * 1999-02-17 2000-09-08 Seiko Epson Corp 液晶パネルの製造方法
JP2000248243A (ja) * 1999-03-03 2000-09-12 Seiko Epson Corp 接着シート及び液晶パネルの製造方法
JP2000351947A (ja) * 1999-06-14 2000-12-19 Nitto Denko Corp 加熱剥離型粘着シート
JP4220766B2 (ja) * 2002-12-02 2009-02-04 積水化学工業株式会社 離型シート及びセラミックグリーンシートの転写方法
WO2004064018A1 (ja) * 2003-01-15 2004-07-29 Semiconductor Energy Laboratory Co., Ltd. 剥離方法及びその剥離方法を用いた表示装置の作製方法
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