JP2019504503A5 - - Google Patents
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- JP2019504503A5 JP2019504503A5 JP2018537774A JP2018537774A JP2019504503A5 JP 2019504503 A5 JP2019504503 A5 JP 2019504503A5 JP 2018537774 A JP2018537774 A JP 2018537774A JP 2018537774 A JP2018537774 A JP 2018537774A JP 2019504503 A5 JP2019504503 A5 JP 2019504503A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- layer
- exposing
- metal
- metal seed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662281470P | 2016-01-21 | 2016-01-21 | |
| US62/281,470 | 2016-01-21 | ||
| PCT/US2016/067571 WO2017127197A1 (en) | 2016-01-21 | 2016-12-19 | Process and chemistry of plating of through silicon vias |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019504503A JP2019504503A (ja) | 2019-02-14 |
| JP2019504503A5 true JP2019504503A5 (https=) | 2020-02-06 |
| JP6903061B2 JP6903061B2 (ja) | 2021-07-14 |
Family
ID=59359138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018537774A Active JP6903061B2 (ja) | 2016-01-21 | 2016-12-19 | Ｓｉ貫通電極のメッキのプロセス及び化学作用 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9935004B2 (https=) |
| JP (1) | JP6903061B2 (https=) |
| KR (1) | KR20180097179A (https=) |
| CN (1) | CN108474129B (https=) |
| TW (1) | TWI718227B (https=) |
| WO (1) | WO2017127197A1 (https=) |
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| KR101940981B1 (ko) | 2014-05-05 | 2019-01-23 | 3디 글래스 솔루션즈 인코포레이티드 | 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판 |
| KR20200010598A (ko) | 2016-02-25 | 2020-01-30 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| US10755973B2 (en) * | 2016-10-17 | 2020-08-25 | Tokyo Electron Limited | Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium |
| US10103056B2 (en) * | 2017-03-08 | 2018-10-16 | Lam Research Corporation | Methods for wet metal seed deposition for bottom up gapfill of features |
| WO2018200804A1 (en) | 2017-04-28 | 2018-11-01 | 3D Glass Solutions, Inc. | Rf circulator |
| AU2018297035B2 (en) | 2017-07-07 | 2021-02-25 | 3D Glass Solutions, Inc. | 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates |
| WO2019118761A1 (en) | 2017-12-15 | 2019-06-20 | 3D Glass Solutions, Inc. | Coupled transmission line resonate rf filter |
| KR102600200B1 (ko) | 2018-01-04 | 2023-11-10 | 3디 글래스 솔루션즈 인코포레이티드 | 고효율 ｒｆ 회로들을 위한 임피던스 정합 도전성 구조 |
| KR102145746B1 (ko) | 2018-04-10 | 2020-08-19 | 3디 글래스 솔루션즈 인코포레이티드 | Rf 집적형 전력 조절 커패시터 |
| KR102475010B1 (ko) | 2018-05-29 | 2022-12-07 | 3디 글래스 솔루션즈 인코포레이티드 | 저 삽입 손실 rf 전송 라인 |
| KR102518025B1 (ko) | 2018-09-17 | 2023-04-06 | 3디 글래스 솔루션즈 인코포레이티드 | 접지면을 갖는 고효율 컴팩트형 슬롯 안테나 |
| US10651081B2 (en) * | 2018-09-21 | 2020-05-12 | Nanya Technology Corporation | Semiconductor structure and manufacturing method thereof |
| JP7080781B2 (ja) * | 2018-09-26 | 2022-06-06 | 株式会社東芝 | 多孔質層の形成方法、エッチング方法、物品の製造方法、半導体装置の製造方法、及びめっき液 |
| US10734308B2 (en) * | 2018-11-20 | 2020-08-04 | Nanya Technology Corporation | Semiconductor device and method for manufacturing the same |
| JP7241433B2 (ja) | 2018-12-28 | 2023-03-17 | スリーディー グラス ソリューションズ，インク | 光活性ガラス基板におけるｒｆ、マイクロ波及びｍｍ波システムのためのヘテロジニアスインテグレーション |
| WO2020139955A1 (en) | 2018-12-28 | 2020-07-02 | 3D Glass Solutions, Inc. | Annular capacitor rf, microwave and mm wave systems |
| JP7273170B2 (ja) * | 2019-02-08 | 2023-05-12 | アヴニ | コバルト又は銅合金の電着、及びマイクロエレクトロニクスにおける使用 |
| FR3092589A1 (fr) * | 2019-02-08 | 2020-08-14 | Aveni | Electrodéposition d’un alliage de cobalt et utilisation en microélectronique |
| WO2020206323A1 (en) | 2019-04-05 | 2020-10-08 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| WO2020214788A1 (en) | 2019-04-18 | 2020-10-22 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
| KR102633148B1 (ko) | 2019-05-28 | 2024-02-06 | 삼성전자주식회사 | 관통 비아를 포함하는 반도체 장치 및 이의 제조 방법 |
| US11121088B2 (en) * | 2019-10-16 | 2021-09-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method of manufacturing the same |
| CN110767604B (zh) * | 2019-10-31 | 2022-03-18 | 厦门市三安集成电路有限公司 | 化合物半导体器件和化合物半导体器件的背面铜制程方法 |
| WO2021211855A1 (en) | 2020-04-17 | 2021-10-21 | 3D Glass Solutions, Inc. | Broadband inductor |
| JP7799623B2 (ja) * | 2020-05-08 | 2026-01-15 | ラム リサーチ コーポレーション | コバルト、ニッケル、および、それらの合金の電気メッキ |
| JP2022141425A (ja) * | 2021-03-15 | 2022-09-29 | キオクシア株式会社 | 半導体製造方法および半導体装置 |
| FI20215520A1 (en) * | 2021-05-04 | 2022-11-05 | Iqm Finland Oy | Superconducting vias in the substrate |
| CN116033820B (zh) * | 2021-10-26 | 2026-04-10 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| JP2025124244A (ja) * | 2024-02-14 | 2025-08-26 | 富士フイルム株式会社 | 電鋳用原盤、電鋳用原盤の製造方法、及び金属成形物製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4321283A (en) | 1979-10-26 | 1982-03-23 | Mobil Tyco Solar Energy Corporation | Nickel plating method |
| US6498091B1 (en) * | 2000-11-01 | 2002-12-24 | Applied Materials, Inc. | Method of using a barrier sputter reactor to remove an underlying barrier layer |
| US20020111013A1 (en) * | 2001-02-15 | 2002-08-15 | Okada Lynn A. | Method for formation of single inlaid structures |
| JP4043234B2 (ja) | 2001-06-18 | 2008-02-06 | 株式会社荏原製作所 | 電解加工装置及び基板処理装置 |
| US6509267B1 (en) | 2001-06-20 | 2003-01-21 | Advanced Micro Devices, Inc. | Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layer |
| JP4304905B2 (ja) * | 2002-03-13 | 2009-07-29 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| US6897148B2 (en) | 2003-04-09 | 2005-05-24 | Tru-Si Technologies, Inc. | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
| US20070125657A1 (en) | 2003-07-08 | 2007-06-07 | Zhi-Wen Sun | Method of direct plating of copper on a substrate structure |
| WO2006102318A2 (en) | 2005-03-18 | 2006-09-28 | Applied Materials, Inc. | Electroless deposition process on a contact containing silicon or silicide |
| US20070190362A1 (en) | 2005-09-08 | 2007-08-16 | Weidman Timothy W | Patterned electroless metallization processes for large area electronics |
| US20070071888A1 (en) | 2005-09-21 | 2007-03-29 | Arulkumar Shanmugasundram | Method and apparatus for forming device features in an integrated electroless deposition system |
| JP2008053568A (ja) | 2006-08-25 | 2008-03-06 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| KR100883806B1 (ko) | 2007-01-02 | 2009-02-17 | 삼성전자주식회사 | 반도체 장치 및 그 형성방법 |
| US7566657B2 (en) * | 2007-01-17 | 2009-07-28 | Hewlett-Packard Development Company, L.P. | Methods of forming through-substrate interconnects |
| CN100483677C (zh) * | 2007-01-29 | 2009-04-29 | 清华大学 | 用超声化学镀制备集成电路铜互连线和阻挡层的方法 |
| KR101180238B1 (ko) * | 2008-01-23 | 2012-09-05 | 닛코킨조쿠 가부시키가이샤 | 배리어층 상에 루테늄 전기 도금층을 가진 ｕｌｓｉ 미세 배선 부재 |
| KR101300587B1 (ko) | 2009-12-09 | 2013-08-28 | 한국전자통신연구원 | 반도체 소자의 제조 방법 |
| US20110207323A1 (en) * | 2010-02-25 | 2011-08-25 | Robert Ditizio | Method of forming and patterning conformal insulation layer in vias and etched structures |
| US20130213816A1 (en) * | 2010-04-06 | 2013-08-22 | Tel Nexx, Inc. | Incorporating High-Purity Copper Deposit As Smoothing Step After Direct On-Barrier Plating To Improve Quality Of Deposited Nucleation Metal In Microscale Features |
| JP5996244B2 (ja) | 2011-04-19 | 2016-09-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | 半導体上の銅のめっき |
| US8664126B2 (en) * | 2011-06-10 | 2014-03-04 | Applied Materials, Inc. | Selective deposition of polymer films on bare silicon instead of oxide surface |
| WO2013095433A1 (en) * | 2011-12-21 | 2013-06-27 | Intel Corporation | Electroless filled conductive structures |
| JP5925006B2 (ja) * | 2012-03-26 | 2016-05-25 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| US9330939B2 (en) * | 2012-03-28 | 2016-05-03 | Applied Materials, Inc. | Method of enabling seamless cobalt gap-fill |
| US8791005B2 (en) * | 2012-06-18 | 2014-07-29 | International Business Machines Corporation | Sidewalls of electroplated copper interconnects |
| US20140374907A1 (en) * | 2012-06-21 | 2014-12-25 | Applied Materials, Inc. | Ultra-thin copper seed layer for electroplating into small features |
| US9029258B2 (en) | 2013-02-05 | 2015-05-12 | Lam Research Corporation | Through silicon via metallization |
| SG11201509673SA (en) * | 2013-06-17 | 2016-01-28 | Applied Materials Inc | Method for copper plating through silicon vias using wet wafer back contact |
| US20150137323A1 (en) * | 2013-11-15 | 2015-05-21 | United Microelectronics Corp. | Method for fabricating through silicon via structure |
| US9617648B2 (en) * | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
-
2016
- 2016-12-19 US US15/382,945 patent/US9935004B2/en active Active
- 2016-12-19 CN CN201680079254.4A patent/CN108474129B/zh not_active Expired - Fee Related
- 2016-12-19 JP JP2018537774A patent/JP6903061B2/ja active Active
- 2016-12-19 WO PCT/US2016/067571 patent/WO2017127197A1/en not_active Ceased
- 2016-12-19 KR KR1020187023965A patent/KR20180097179A/ko not_active Withdrawn
-
2017
- 2017-01-04 TW TW106100097A patent/TWI718227B/zh not_active IP Right Cessation
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