JP2010503216A - 選択的に物質を堆積するために被加工物を表面改質する方法及び装置 - Google Patents
選択的に物質を堆積するために被加工物を表面改質する方法及び装置 Download PDFInfo
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Abstract
Description
1.相互接続が配置される基板上の分離された(誘電体)物質内に凹状の領域を形成する。
2.物質をスパッタ(又は無電解堆積)して基板表面全体を覆う。
3.電気めっき金属(例えば、Cu)を行き渡らせ、形成されたフィーチャを充填し、基板全体を金属で覆う。
4.基板上部表面から過剰な金属を研削する。
120、122、204a、204b 化学物質キャリア
Claims (50)
- 上部表面を有し、上部表面にリセスパターンを有する被加工物を提供する段階と、
リセス表面に対して、上部表面を表面改質剤と選択的に接触させ、上部表面を化学的に改質する段階と、
その後リセス内部に物質を選択的に堆積し、物質の堆積は上部表面上において阻害される段階と、を含む半導体処理方法。 - 選択的な接触が、上部表面と接触するようにアプリケータ表面上に表面改質剤を有するアプリケータと、上部表面とを、機械的に接触する工程を含む、請求項1に記載の方法。
- アプリケータが、選択的接触の間、被加工物を完全に覆う寸法及び形状を有する剛直で平坦な物体である、請求項2に記載の方法。
- アプリケータが、選択的接触の間、被加工物を完全に覆う寸法及び形状を有する平坦な膜である、請求項2に記載の方法。
- アプリケータがローラであり、選択的な接触はローラが上部表面を転がる工程を含む、請求項2に記載の方法。
- 上部表面を転がる工程は、ローラを表面改質剤キャリアに接触する工程をさらに含み、ローラの接触によりローラ上の表面改質剤の供給を補充する、請求項5に記載の方法。
- アプリケータが半透過性膜であり、半透過性膜は表面改質剤を透過する、請求項2に記載の方法。
- 半透過性膜はイオン交換膜である、請求項7に記載の方法。
- 表面改質剤をアプリケータ上に堆積する工程をさらに含む、請求項2に記載の方法。
- 表面改質剤を堆積する工程が、接触コーティング、スピンコーティング、蒸気凝縮、及び溶液からの化学析出からなる群から選択される工程を実行することを含む、請求項9に記載の方法。
- 表面改質剤が自己組織化単分子膜の一部であり、自己組織化単分子膜は表面改質剤の堆積の後アプリケータ上に配置される、請求項9に記載の方法。
- 選択的な接触が、非相溶な物質をリセス内部に堆積する工程を含み、前記非相溶な物質が表面改質剤と非相溶である、請求項1に記載の方法。
- 非相溶な物質がオイルである、請求項12に記載の方法。
- 表面改質剤が、ポリマー、チオール、P−,s−,t−アミン及びカルボン酸塩からなる群から選択される物質である、請求項1に記載の方法。
- 表面改質剤が二つ以上の官能基を含み、一つの官能基は上部表面と反応性であり、他の官能基は表面改質剤アプリケータと反応性である、請求項14に記載の方法。
- 選択的な接触が、上部表面を表面改質剤により化学的に改質することを含む、請求項1に記載の方法。
- 化学的改質が、酸化、錯形成、導電性の変化又は表面エネルギーの変化を含む、請求項16に記載の方法。
- 被加工物がシリコンウェハを含む、請求項1に記載の方法。
- 被加工物が太陽電池パネルを含む、請求項1に記載の方法。
- 被加工物が、導電物質、絶縁物質、半導体物質、非半導体物質、又はそれらの組合せからなる群から選択される一つ以上の物質を含む、請求項1に記載の方法。
- リセスがトレンチである、請求項1に記載の方法。
- その後選択的な堆積により導電性の相互接続を形成する、請求項21に記載の方法。
- その後の選択的な堆積が電気めっきを含む、請求項1に記載の方法。
- その後の選択的な堆積が、銅、ニッケル、アルミニウム、チタン、モリブデン、及びそれらの組合せ、及びそれらの合金からなる群から選択される物質の堆積を含む、請求項1に記載の方法。
- その後の選択的な堆積が、ドープされたポリシリコン、ドープされた単結晶シリコン、チタン、及び耐熱金属シリサイドからなる群から選択される物質の堆積を含む、請求項1に記載の方法。
- その後の選択的な堆積の前に、上部表面及びリセス表面を覆うシード層の堆積をさらに含む、請求項1に記載の方法。
- シード層の堆積の前に、上部表面及びリセス表面を覆うバリア層の堆積をさらに含む、請求項26に記載の方法。
- 選択的接触の前にシード層の堆積をさらに含む、請求項26に記載の方法。
- フィールド領域を有し、フィールド領域に開口するキャビティを有する基板を提供する段階と、
他のフィールド表面及びキャビティ表面に対して、フィールド領域及びキャビティ表面の一つを選択的に化学的改質する段階と、
その後他のフィールド表面及びキャビティ表面上に物質を選択的に堆積する段階と、を含む集積回路製造方法。 - 選択的な化学的改質が基板を化学的活性物質に露出する工程を含み、化学的活性物質はフィールド領域及びキャビティ表面の一つと化学的に活性である、請求項29に記載の方法。
- 選択的な化学的改質の前にキャビティ充填物質をキャビティ内部に堆積し、選択的な化学的改質の間キャビティ充填物質がキャビティを占有する工程をさらに含む、請求項30に記載の方法。
- キャビティ充填物質が化学的活性物質と相溶性である、請求項31に記載の方法。
- キャビティ充填物質が水である、請求項31に記載の方法。
- 化学的活性物質がMPTESである、請求項33に記載の方法。
- キャビティ充填物質が表面改質剤と非相溶性である、請求項31に記載の方法。
- その後の選択的な物質堆積の前に、キャビティからキャビティ充填物質を除去する工程をさらに含む、請求項31に記載の方法。
- キャビティ充填物質を除去する工程は、キャビティ充填物質の蒸発工程を含む、請求項31に記載の方法。
- 選択的な化学的改質が、フィールド領域と、化学的活性物質をフィールド領域に移動するように構成される化学物質アプリケータとを機械的に接触させる工程を含む、請求項29に記載の方法。
- 化学物質アプリケータが、剛直で平坦な物体、膜、ローラ、及び半透過性膜からなる群から選択される、請求項38に記載の方法。
- 選択的に堆積された物質上、及び選択的に化学的改質されたフィールド領域及びキャビティ表面の一つ上にさらなる物質を非選択的に堆積する工程をさらに含む、請求項29に記載の方法。
- 選択的に堆積された物質上にカッピング層を形成する工程をさらに含む、請求項40に記載の方法。
- 基板表面を改質するための表面改質剤のソースと、
基板表面の機械的接触によって基板表面上部に表面改質剤を塗布するよう構成された固相化学物質キャリアと、
前記基板上部に物質を堆積するための堆積装置と、を備える集積回路製造システム。 - 化学物質キャリアが、化学物質キャリア表面上に表面改質剤が存在するように構成され、化学物質キャリアが基板表面と接触する間化学物質キャリア表面と基板表面との間に配置された表面改質剤を提供するように構成される、請求項42に記載のシステム。
- 化学物質キャリアが、前記表面を転がるよう構成されたローラを備える、請求項42に記載のシステム。
- 化学物質キャリアは半透過性膜を含む、請求項42に記載のシステム。
- 半透過性膜はイオン交換膜である、請求項45に記載のシステム。
- 表面改質剤が、ポリマー、チオール、P−,s−,t−アミン及びカルボン酸塩からなる群から選択される物質である、請求項42に記載のシステム。
- 表面改質剤が化学物質キャリア上に層を形成し、前記層の厚みが1−500nmである、請求項42に記載のシステム。
- 前記厚みが50−100nmである、請求項42に記載のシステム。
- 堆積装置が電気化学的堆積によって基板上に物質を堆積するように構成される、請求項42に記載のシステム。
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PCT/US2007/076446 WO2008027761A2 (en) | 2006-08-30 | 2007-08-21 | Method and apparatus for workpiece surface modification for selective material deposition |
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Publication number | Priority date | Publication date | Assignee | Title |
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US8119525B2 (en) * | 2008-02-26 | 2012-02-21 | Applied Materials, Inc. | Process for selective growth of films during ECP plating |
CN102460656B (zh) * | 2009-06-02 | 2015-02-11 | 三菱电机株式会社 | 太阳能电池的制造方法 |
US8334202B2 (en) * | 2009-11-03 | 2012-12-18 | Infineon Technologies Ag | Device fabricated using an electroplating process |
US8242012B2 (en) | 2010-07-28 | 2012-08-14 | International Business Machines Corporation | Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure |
CA2815568C (en) * | 2010-09-23 | 2018-10-09 | Monosolrx Llc | Method and system for forming a pharmaceutical product directly onto a packaging surface |
US9515166B2 (en) * | 2014-04-10 | 2016-12-06 | Applied Materials, Inc. | Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications |
DE102015006606B4 (de) * | 2015-05-21 | 2021-11-04 | Audi Ag | Verfahren zum Herstellen eines Bedienelements für einen Kraftwagen |
US10241024B1 (en) | 2016-05-02 | 2019-03-26 | Rashid Mavliev | System and method for characterization of inclusions in liquid samples |
US9799752B1 (en) | 2016-10-31 | 2017-10-24 | Eastman Kodak Company | Method for forming a thin-film transistor |
US10163632B2 (en) * | 2016-12-15 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Material composition and process for substrate modification |
US11142825B2 (en) * | 2019-02-01 | 2021-10-12 | Averatek Corporation | Coating of nano-scaled cavities |
KR20220161331A (ko) | 2020-03-31 | 2022-12-06 | 라시드 마블리에프 | 가공된 템플릿들을 이용하여 금속 상호연결 층들을 형성하는 방법들 및 시스템들 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10214896A (ja) * | 1996-11-29 | 1998-08-11 | Toshiba Corp | 半導体装置の製造方法及び製造装置 |
US20050153547A1 (en) * | 2003-03-31 | 2005-07-14 | Chris Barns | Method and apparatus for selective deposition |
JP2006510210A (ja) * | 2002-12-14 | 2006-03-23 | プラスティック ロジック リミテッド | 電子装置 |
JP2006156426A (ja) * | 2004-11-25 | 2006-06-15 | Seiko Epson Corp | 導電性パターンの形成方法 |
Family Cites Families (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3411952A (en) * | 1962-04-02 | 1968-11-19 | Globe Union Inc | Photovoltaic cell and solar cell panel |
FR2288389A1 (fr) * | 1974-10-17 | 1976-05-14 | Nat Res Dev | Procede d'electrodeposition de metaux sur des substrats semi-conducteurs |
IT1046971B (it) * | 1975-03-11 | 1980-09-10 | Oxy Metal Industries Corp | Begno per l elettrodeposizione di rame e metodo per prepararlo |
US5567300A (en) * | 1994-09-02 | 1996-10-22 | Ibm Corporation | Electrochemical metal removal technique for planarization of surfaces |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US5862605A (en) * | 1996-05-24 | 1999-01-26 | Ebara Corporation | Vaporizer apparatus |
US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
US6074546A (en) * | 1997-08-21 | 2000-06-13 | Rodel Holdings, Inc. | Method for photoelectrochemical polishing of silicon wafers |
WO1999016936A1 (en) * | 1997-09-30 | 1999-04-08 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
US6004880A (en) * | 1998-02-20 | 1999-12-21 | Lsi Logic Corporation | Method of single step damascene process for deposition and global planarization |
JP3191759B2 (ja) * | 1998-02-20 | 2001-07-23 | 日本電気株式会社 | 半導体装置の製造方法 |
US6185354B1 (en) * | 1998-05-15 | 2001-02-06 | Motorola, Inc. | Printed circuit board having integral waveguide |
EP1070159A4 (en) * | 1998-10-14 | 2004-06-09 | Faraday Technology Inc | ELECTRIC COATING OF METALS IN SMALL CUTOUTS USING MODULATED ELECTRICAL FIELDS |
US7449098B1 (en) * | 1999-10-05 | 2008-11-11 | Novellus Systems, Inc. | Method for planar electroplating |
US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6534116B2 (en) * | 2000-08-10 | 2003-03-18 | Nutool, Inc. | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
US6902659B2 (en) * | 1998-12-01 | 2005-06-07 | Asm Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6497800B1 (en) * | 2000-03-17 | 2002-12-24 | Nutool Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
US6251235B1 (en) * | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
US6610190B2 (en) * | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US6353623B1 (en) | 1999-01-04 | 2002-03-05 | Uniphase Telecommunications Products, Inc. | Temperature-corrected wavelength monitoring and control apparatus |
JP2000208443A (ja) | 1999-01-13 | 2000-07-28 | Sony Corp | 電子装置の製造方法および製造装置 |
JP2000232078A (ja) * | 1999-02-10 | 2000-08-22 | Toshiba Corp | メッキ方法及びメッキ装置 |
EP1063696B1 (en) | 1999-06-22 | 2007-08-22 | Interuniversitair Micro-Elektronica Centrum Vzw | A method for improving the quality of a metal-containing layer deposited from a plating bath |
JP3422731B2 (ja) * | 1999-07-23 | 2003-06-30 | 理化学研究所 | Elidセンタレス研削装置 |
US6410418B1 (en) * | 1999-08-18 | 2002-06-25 | Advanced Micro Devices, Inc. | Recess metallization via selective insulator formation on nucleation/seed layer |
US6224737B1 (en) * | 1999-08-19 | 2001-05-01 | Taiwan Semiconductor Manufacturing Company | Method for improvement of gap filling capability of electrochemical deposition of copper |
US6080656A (en) * | 1999-09-01 | 2000-06-27 | Taiwan Semiconductor Manufacturing Company | Method for forming a self-aligned copper structure with improved planarity |
US6653226B1 (en) * | 2001-01-09 | 2003-11-25 | Novellus Systems, Inc. | Method for electrochemical planarization of metal surfaces |
US6341998B1 (en) | 1999-11-04 | 2002-01-29 | Vlsi Technology, Inc. | Integrated circuit (IC) plating deposition system and method |
CA2327034C (en) * | 1999-12-01 | 2007-07-17 | Canon Kabushiki Kaisha | Method of reforming element surface, element with reformed surface, method of manufacturing element with reformed surface, surface treatment liquid for forming reformed surface, and method of manufacturing surface treatment liquid |
US6352623B1 (en) * | 1999-12-17 | 2002-03-05 | Nutool, Inc. | Vertically configured chamber used for multiple processes |
JP3594894B2 (ja) | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | ビアフィリングめっき方法 |
US6354916B1 (en) * | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US6346479B1 (en) * | 2000-06-14 | 2002-02-12 | Advanced Micro Devices, Inc. | Method of manufacturing a semiconductor device having copper interconnects |
US6605534B1 (en) * | 2000-06-28 | 2003-08-12 | International Business Machines Corporation | Selective deposition of a conductive material |
US6436267B1 (en) * | 2000-08-29 | 2002-08-20 | Applied Materials, Inc. | Method for achieving copper fill of high aspect ratio interconnect features |
US7220166B2 (en) * | 2000-08-30 | 2007-05-22 | Micron Technology, Inc. | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
US6766082B2 (en) * | 2000-10-18 | 2004-07-20 | Nippon Telegraph And Telephone Corporation | Waveguide-type optical device and manufacturing method therefor |
US6936154B2 (en) * | 2000-12-15 | 2005-08-30 | Asm Nutool, Inc. | Planarity detection methods and apparatus for electrochemical mechanical processing systems |
US6696358B2 (en) * | 2001-01-23 | 2004-02-24 | Honeywell International Inc. | Viscous protective overlayers for planarization of integrated circuits |
US7201829B2 (en) * | 2001-03-01 | 2007-04-10 | Novellus Systems, Inc. | Mask plate design |
JP2002289687A (ja) * | 2001-03-27 | 2002-10-04 | Sony Corp | 半導体装置、及び、半導体装置における配線形成方法 |
US6482656B1 (en) * | 2001-06-04 | 2002-11-19 | Advanced Micro Devices, Inc. | Method of electrochemical formation of high Tc superconducting damascene interconnect for integrated circuit |
EP1415365A4 (en) * | 2001-07-13 | 2009-01-14 | Univ Brown Res Found | POLYMER ELECTROLYTE MEMBRANE FOR ELECTROCHEMICAL AND OTHER APPLICATIONS |
TW584899B (en) * | 2001-07-20 | 2004-04-21 | Nutool Inc | Planar metal electroprocessing |
US7238092B2 (en) * | 2001-09-28 | 2007-07-03 | Novellus Systems, Inc. | Low-force electrochemical mechanical processing method and apparatus |
US6833063B2 (en) * | 2001-12-21 | 2004-12-21 | Nutool, Inc. | Electrochemical edge and bevel cleaning process and system |
US6787460B2 (en) * | 2002-01-14 | 2004-09-07 | Samsung Electronics Co., Ltd. | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed |
US6974775B2 (en) * | 2002-12-31 | 2005-12-13 | Intel Corporation | Method and apparatus for making an imprinted conductive circuit using semi-additive plating |
US7250104B2 (en) * | 2003-08-08 | 2007-07-31 | Novellus Systems, Inc. | Method and system for optically enhanced metal planarization |
CN100463115C (zh) * | 2004-05-18 | 2009-02-18 | 日立化成工业株式会社 | 粘接接合片与使用该粘接接合片的半导体装置以及其制造方法 |
US20060234499A1 (en) * | 2005-03-29 | 2006-10-19 | Akira Kodera | Substrate processing method and substrate processing apparatus |
-
2007
- 2007-08-17 US US11/893,793 patent/US7732329B2/en active Active
- 2007-08-21 CN CN2007800401823A patent/CN101529572B/zh not_active Expired - Fee Related
- 2007-08-21 KR KR1020097006252A patent/KR20090057282A/ko not_active Application Discontinuation
- 2007-08-21 WO PCT/US2007/076446 patent/WO2008027761A2/en active Application Filing
- 2007-08-21 JP JP2009526813A patent/JP2010503216A/ja active Pending
- 2007-08-30 TW TW096132314A patent/TW200822227A/zh unknown
-
2010
- 2010-04-09 US US12/757,652 patent/US8012875B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10214896A (ja) * | 1996-11-29 | 1998-08-11 | Toshiba Corp | 半導体装置の製造方法及び製造装置 |
JP2006510210A (ja) * | 2002-12-14 | 2006-03-23 | プラスティック ロジック リミテッド | 電子装置 |
US20050153547A1 (en) * | 2003-03-31 | 2005-07-14 | Chris Barns | Method and apparatus for selective deposition |
JP2006156426A (ja) * | 2004-11-25 | 2006-06-15 | Seiko Epson Corp | 導電性パターンの形成方法 |
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CN101529572B (zh) | 2012-01-04 |
WO2008027761A2 (en) | 2008-03-06 |
US20080057709A1 (en) | 2008-03-06 |
US20100193364A1 (en) | 2010-08-05 |
TW200822227A (en) | 2008-05-16 |
CN101529572A (zh) | 2009-09-09 |
KR20090057282A (ko) | 2009-06-04 |
US8012875B2 (en) | 2011-09-06 |
US7732329B2 (en) | 2010-06-08 |
WO2008027761A3 (en) | 2008-11-13 |
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