JP2013524019A - ミクロスケール構造中でのシード層堆積 - Google Patents
ミクロスケール構造中でのシード層堆積 Download PDFInfo
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- 230000008021 deposition Effects 0.000 title claims description 26
- 230000004888 barrier function Effects 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 62
- 239000011248 coating agent Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 35
- 239000000126 substance Substances 0.000 claims abstract description 18
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 5
- 238000006557 surface reaction Methods 0.000 claims abstract description 3
- 239000012799 electrically-conductive coating Substances 0.000 claims abstract 7
- 239000010410 layer Substances 0.000 claims description 127
- 239000010949 copper Substances 0.000 claims description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 46
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 238000000151 deposition Methods 0.000 claims description 34
- 238000005240 physical vapour deposition Methods 0.000 claims description 33
- 239000012530 fluid Substances 0.000 claims description 26
- 238000004070 electrodeposition Methods 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 18
- 239000010936 titanium Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 5
- 239000005002 finish coating Substances 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 238000009736 wetting Methods 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims 1
- 238000007704 wet chemistry method Methods 0.000 claims 1
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- 239000000758 substrate Substances 0.000 description 49
- 235000012431 wafers Nutrition 0.000 description 16
- 238000007796 conventional method Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000006911 nucleation Effects 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000000454 electroless metal deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 229910052760 oxygen Inorganic materials 0.000 description 2
- 101100445460 Arabidopsis thaliana EREX gene Proteins 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 241000724291 Tobacco streak virus Species 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
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- 230000005684 electric field Effects 0.000 description 1
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- 239000002659 electrodeposit Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- -1 nitrogen Chemical compound 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1068—Formation and after-treatment of conductors
- H01L2221/1073—Barrier, adhesion or liner layers
- H01L2221/1084—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L2221/1089—Stacks of seed layers
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- Chemical Kinetics & Catalysis (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (22)
- 試料の実質的に平坦面に作製されるミクロスケールの穴構造の内面をコーティングする方法であって:
試料にバリア金属コーティングを供する工程であって、前記バリア金属コーティングは前記試料の平坦面及び前記ミクロスケールの穴構造の内面の両方に沿って実質的に連続かつ均一で、前記バリア金属コーティングは実質的に表面反応律速過程により堆積される、工程;
前記試料の平坦面上に厚い金属層のコーティングを供する工程であって、前記厚い金属層のコーティングは前記バリア層コーティングに接合して、前記試料にわたって設けられ、かつ前記試料を貫通するように設けられた前記ミクロスケール構造に実質的に均一な伝導性を与える、工程;
前記試料の周辺部で電気伝導性コーティングに電気コンタクト路を供する工程;
前記試料を化学浴中に浸漬させて、前記化学浴を、前記ミクロスケールの穴構造の内面と完全に接触させる工程であって、前記化学浴は電着に適した金属イオンを含む、工程;並びに、
前記試料の周辺部で電位を印加することで、前記ミクロスケールの穴構造の内面を含む前記試料の全表面に金属イオンを電着させ、一の電着工程において所定の仕上げコーティングを生成する工程;
を有する方法。 - 前記電気伝導性コーティングが、プラズマ気相成長(PVD)法により堆積される、請求項1に記載の方法。
- 前記電気伝導性コーティングが、前記ミクロスケール構造の内面をはっきりわかる程にコーティングしない、請求項1に記載の方法。
- 前記電気伝導性コーティングが、厚さ2000Å乃至5000Åの銅の層である、請求項1に記載の方法。
- 前記電気伝導性コーティングが、厚さ5000Åの銅の層である、請求項1に記載の方法。
- 前記電気伝導性コーティングが、厚さ3000Åの銅の層である、請求項1に記載の方法。
- 前記バリア金属コーティングが、厚さ500Å乃至2000Åのチタン又はチタン−タングステン接合層である、請求項1に記載の方法。
- 前記バリア金属コーティングが、厚さ1000Åのチタン又はチタン−タングステン接合層である、請求項1に記載の方法。
- 前記ミクロスケールの穴構造は、幅1μm乃至20μmで、かつ、深さ10μm乃至250μmである、請求項1に記載の方法。
- 前記ミクロスケールの穴構造は、直径5μmの環状の穴で、かつ、深さ50μmである、請求項1に記載の方法。
- 前記ミクロスケールの穴構造は、幅1μm乃至20μmの非環状の穴で、かつ、深さ10μm乃至250μmである、請求項1に記載の方法。
- 前記バリア金属コーティングが、チタン窒化物、タンタル窒化物、タングステン、ニッケル、チタン、タンタル、又は上記の混合物である、請求項1に記載の方法。
- 前記バリア金属コーティングが、気相成長法により堆積される、請求項1に記載の方法。
- 前記バリア金属コーティングが、湿式化学処理により堆積される、請求項1に記載の方法。
- 堆積のための前記電位の印加が時間的に周期的で、50[ms]の期間電位が印加され、100[ms]の期間電位が印加されない、請求項1に記載の方法。
- バリア層を有する試料中にミクロスケールの穴構造を作製する半導体試料処理装置であって、前記バリア層は、前記試料の平坦面と前記試料のミクロスケールの穴構造の内面に堆積され、かつ、金属層を有し、前記金属層は、前記バリア層全体にわたって堆積され、かつ、前記バリア膜と接合し:
前記試料用の処理チャンバを画定する筐体であって、前記チャンバは、前記試料を処理流体によって事前に濡らすように構成され、前記処理流体は、該処理流体と、前記試料の平坦面及び前記試料の各ミクロスケールの穴構造の内面との間での流体−金属界面を構成し、
前記試料を電気メッキするための前記チャンバ内部に設けられた陽極であって、前記陽極の配置は、電気メッキの過電圧が前記試料と陽極との間に生成され、前記電気メッキの過電圧は前記試料にわたって実質的に均一で、前記電気メッキの過電圧は、電着流体から、前記試料の平坦面と前記試料の各ミクロスケールの穴構造の内面での金属の電着に影響し、それにより各ミクロスケールの穴構造の内面は、一の層のコーティングである仕上げコーティングを有するように行われる、陽極;
を有する装置。 - 前記バリア膜が、チタン窒化物、タンタル窒化物、タングステン、ニッケル、チタン、タンタル、又は上記の混合物である、請求項16に記載の装置。
- 前記金属層が、物理的気相成長法により前記試料上に形成される、請求項16に記載の装置。
- 前記事前に濡らす処理が、真空での事前に濡らす処理である、請求項16に記載の装置。
- 前記電着流体が銅の電気メッキ溶液を有する、請求項16に記載の装置。
- 前記試料にエネルギーを付与するために前記チャンバ内の試料と接続可能なエネルギー源;及び
前記エネルギー源と接続し、かつ、前記試料と陽極との間に実質的に均一な過電圧を生成するように構成された制御装置;
をさらに有する、請求項16に記載の装置。 - 前記陽極が、前記チャンバ内に保持された前記試料に対して実質的に平行である、請求項16に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/755,198 US9714474B2 (en) | 2010-04-06 | 2010-04-06 | Seed layer deposition in microscale features |
US12/755,198 | 2010-04-06 | ||
PCT/US2011/030637 WO2011126914A1 (en) | 2010-04-06 | 2011-03-31 | Seed layer deposition in microscale features |
Publications (1)
Publication Number | Publication Date |
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JP2013524019A true JP2013524019A (ja) | 2013-06-17 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013503793A Pending JP2013524019A (ja) | 2010-04-06 | 2011-03-31 | ミクロスケール構造中でのシード層堆積 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9714474B2 (ja) |
JP (1) | JP2013524019A (ja) |
KR (1) | KR20130093485A (ja) |
CN (1) | CN103109365B (ja) |
TW (1) | TW201201322A (ja) |
WO (1) | WO2011126914A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20130249047A1 (en) * | 2012-03-26 | 2013-09-26 | Nanya Technology Corporation | Through silicon via structure and method for fabricating the same |
US8791005B2 (en) | 2012-06-18 | 2014-07-29 | International Business Machines Corporation | Sidewalls of electroplated copper interconnects |
US10157792B2 (en) * | 2016-10-27 | 2018-12-18 | Nxp Usa, Inc. | Through substrate via (TSV) and method therefor |
CN109019504B (zh) * | 2018-06-22 | 2020-02-21 | 北京时代民芯科技有限公司 | 一种电阻可调的互联硅通孔的制作方法 |
US10707151B2 (en) * | 2018-11-20 | 2020-07-07 | Nanya Technology Corporation | Through silicon via structure and method for manufacturing the same |
CN114921821B (zh) * | 2022-04-14 | 2023-05-16 | 电子科技大学 | 一种通孔填孔的电镀装置及tgv/tcv孔金属化方法 |
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CN103109365A (zh) | 2013-05-15 |
WO2011126914A1 (en) | 2011-10-13 |
US9714474B2 (en) | 2017-07-25 |
TW201201322A (en) | 2012-01-01 |
KR20130093485A (ko) | 2013-08-22 |
US20110240481A1 (en) | 2011-10-06 |
CN103109365B (zh) | 2015-08-26 |
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