JP2019119001A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2019119001A JP2019119001A JP2018000352A JP2018000352A JP2019119001A JP 2019119001 A JP2019119001 A JP 2019119001A JP 2018000352 A JP2018000352 A JP 2018000352A JP 2018000352 A JP2018000352 A JP 2018000352A JP 2019119001 A JP2019119001 A JP 2019119001A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- blade
- cleaning
- axis direction
- detection means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005520 cutting process Methods 0.000 title claims abstract description 191
- 238000004140 cleaning Methods 0.000 claims abstract description 79
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims description 72
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 40
- 238000005406 washing Methods 0.000 description 27
- 230000001681 protective effect Effects 0.000 description 22
- 239000002173 cutting fluid Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000003825 pressing Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
11 :基台
12 :開口
13 :チャックテーブル
14 :X軸テーブル
16 :切削送り手段(洗浄機構、摺動手段)
21 :保持面
22 :クランプ
26 :側壁
30 :切削手段
31 :インデックス送り手段
32 :切り込み送り手段
34 :Y軸テーブル
37 :Z軸テーブル
40 :スピンドル
41 :切削ブレード
50 :ブレード検出手段
51 :支持脚部
52 :基部
53 :対向部
54 :対向部
55 :発光部
56 :受光部
57 :溝部
60 :洗浄水ノズル
61 :洗浄水ノズル
62 :エアーノズル
63 :エアーノズル
65 :防護カバー
70 :洗浄ユニット(洗浄機構)
71 :スポンジ収容筐体(収容筐体)
71a :開口
72 :スポンジ部材(摺接部材)
73 :開閉蓋
75 :スポンジ位置付け手段(位置付け手段)
76 :ピストンロッド
77 :水供給部
W :ウェーハ(被加工物)
Claims (2)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削するための円環状の切れ刃を有する切削ブレードを装着した切削手段と、該チャックテーブルに保持された被加工物をX軸方向に切削送りする切削送り手段と、該切削ブレードの該切れ刃を挟んで互いに対面して配設された発光部と受光部とを有するブレード検出手段と、
を備えた切削装置であって、
対面して配設された該発光部及び該受光部の間に挿入して洗浄する摺接部材と、該摺接部材を収容し且つ該摺接部材を出し入れする開閉自在の開口を備える収容筐体と、該摺接部材を該収容筐体内に収容する収容位置と該発光部及び該受光部間に挿入して洗浄する洗浄位置とに選択的に位置付ける位置付け手段と、該摺接部材と該ブレード検出手段とを相対的に摺動させる摺動手段と、を有する洗浄機構を備え、
該摺接部材を該洗浄位置に位置付け該摺動手段により摺動させて該摺接部材が該発光部及び該受光部を洗浄すること、を特徴とする切削装置。 - 該ブレード検出手段は該切削送り手段に配設されており、
該摺動手段は、該切削送り手段であり、
該摺接部材を該洗浄位置に位置付け該切削送り手段により該ブレード検出手段をX軸方向に摺動させて該摺接部材が該発光部及び該受光部を洗浄すること、
を特徴とする請求項1記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018000352A JP6990588B2 (ja) | 2018-01-05 | 2018-01-05 | 切削装置 |
KR1020180167179A KR102652143B1 (ko) | 2018-01-05 | 2018-12-21 | 절삭 장치 |
CN201811620639.4A CN110000940B (zh) | 2018-01-05 | 2018-12-28 | 切削装置 |
TW108100368A TWI768172B (zh) | 2018-01-05 | 2019-01-04 | 切割裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018000352A JP6990588B2 (ja) | 2018-01-05 | 2018-01-05 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019119001A true JP2019119001A (ja) | 2019-07-22 |
JP6990588B2 JP6990588B2 (ja) | 2022-01-12 |
Family
ID=67165312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018000352A Active JP6990588B2 (ja) | 2018-01-05 | 2018-01-05 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6990588B2 (ja) |
KR (1) | KR102652143B1 (ja) |
CN (1) | CN110000940B (ja) |
TW (1) | TWI768172B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112658941A (zh) * | 2020-11-26 | 2021-04-16 | 重庆新久融科技有限公司 | 一种铝合金板材加工用切割装置 |
CN115609439A (zh) * | 2022-12-16 | 2023-01-17 | 广东启新模具有限公司 | 一种高效除尘的汽车配件加工机床 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110744731B (zh) * | 2019-10-30 | 2021-07-27 | 许昌学院 | 一种基于光电控制的晶片切片设备 |
CN112606234A (zh) * | 2020-12-28 | 2021-04-06 | 郑州光力瑞弘电子科技有限公司 | 划片机刀片监测装置及划片机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0464109U (ja) * | 1990-10-11 | 1992-06-01 | ||
JP2011222867A (ja) * | 2010-04-13 | 2011-11-04 | Disco Abrasive Syst Ltd | 可動装置 |
JP2014078544A (ja) * | 2012-10-09 | 2014-05-01 | Disco Abrasive Syst Ltd | 清掃工具および清掃方法 |
JP2014079833A (ja) * | 2012-10-16 | 2014-05-08 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4590058B2 (ja) | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP2003211354A (ja) * | 2002-01-18 | 2003-07-29 | Disco Abrasive Syst Ltd | 切削装置 |
JP5068621B2 (ja) * | 2007-10-03 | 2012-11-07 | 株式会社ディスコ | 切削装置 |
JP5660903B2 (ja) * | 2011-01-19 | 2015-01-28 | 株式会社ディスコ | 加工装置 |
JP2014108463A (ja) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | 切削装置 |
JP2016082195A (ja) * | 2014-10-22 | 2016-05-16 | Towa株式会社 | 切断装置及び切断方法 |
JP6746198B2 (ja) * | 2016-04-01 | 2020-08-26 | 株式会社ディスコ | 切削装置 |
JP6727699B2 (ja) * | 2016-04-19 | 2020-07-22 | 株式会社ディスコ | 切削装置のセットアップ方法 |
CN205683150U (zh) * | 2016-05-04 | 2016-11-16 | 杨飞 | 自动腔镜清洗机 |
CN107470184A (zh) * | 2017-07-10 | 2017-12-15 | 中国电子科技集团公司第十八研究所 | 氧化银电极化成用辅助极板刷洗工装 |
CN107433276A (zh) * | 2017-09-12 | 2017-12-05 | 于乐军 | 生物化学实验试管清洗装置 |
-
2018
- 2018-01-05 JP JP2018000352A patent/JP6990588B2/ja active Active
- 2018-12-21 KR KR1020180167179A patent/KR102652143B1/ko active IP Right Grant
- 2018-12-28 CN CN201811620639.4A patent/CN110000940B/zh active Active
-
2019
- 2019-01-04 TW TW108100368A patent/TWI768172B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0464109U (ja) * | 1990-10-11 | 1992-06-01 | ||
JP2011222867A (ja) * | 2010-04-13 | 2011-11-04 | Disco Abrasive Syst Ltd | 可動装置 |
JP2014078544A (ja) * | 2012-10-09 | 2014-05-01 | Disco Abrasive Syst Ltd | 清掃工具および清掃方法 |
JP2014079833A (ja) * | 2012-10-16 | 2014-05-08 | Disco Abrasive Syst Ltd | 切削装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112658941A (zh) * | 2020-11-26 | 2021-04-16 | 重庆新久融科技有限公司 | 一种铝合金板材加工用切割装置 |
CN115609439A (zh) * | 2022-12-16 | 2023-01-17 | 广东启新模具有限公司 | 一种高效除尘的汽车配件加工机床 |
Also Published As
Publication number | Publication date |
---|---|
CN110000940B (zh) | 2022-07-12 |
KR102652143B1 (ko) | 2024-03-27 |
JP6990588B2 (ja) | 2022-01-12 |
TWI768172B (zh) | 2022-06-21 |
KR20190083971A (ko) | 2019-07-15 |
CN110000940A (zh) | 2019-07-12 |
TW201931453A (zh) | 2019-08-01 |
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