JP2018534863A5 - - Google Patents

Download PDF

Info

Publication number
JP2018534863A5
JP2018534863A5 JP2018520188A JP2018520188A JP2018534863A5 JP 2018534863 A5 JP2018534863 A5 JP 2018534863A5 JP 2018520188 A JP2018520188 A JP 2018520188A JP 2018520188 A JP2018520188 A JP 2018520188A JP 2018534863 A5 JP2018534863 A5 JP 2018534863A5
Authority
JP
Japan
Prior art keywords
thickness
hybrid structure
support substrate
manufacturing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018520188A
Other languages
English (en)
Japanese (ja)
Other versions
JP6985260B2 (ja
JP2018534863A (ja
Filing date
Publication date
Priority claimed from FR1559993A external-priority patent/FR3042649B1/fr
Application filed filed Critical
Publication of JP2018534863A publication Critical patent/JP2018534863A/ja
Publication of JP2018534863A5 publication Critical patent/JP2018534863A5/ja
Priority to JP2021191041A priority Critical patent/JP2022043057A/ja
Application granted granted Critical
Publication of JP6985260B2 publication Critical patent/JP6985260B2/ja
Priority to JP2023213109A priority patent/JP7668864B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018520188A 2015-10-20 2016-10-17 ハイブリッド構造を製造するための方法 Active JP6985260B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021191041A JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1559993 2015-10-20
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride
PCT/FR2016/052674 WO2017068269A1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021191041A Division JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造

Publications (3)

Publication Number Publication Date
JP2018534863A JP2018534863A (ja) 2018-11-22
JP2018534863A5 true JP2018534863A5 (https=) 2019-11-28
JP6985260B2 JP6985260B2 (ja) 2021-12-22

Family

ID=54848787

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018520188A Active JP6985260B2 (ja) 2015-10-20 2016-10-17 ハイブリッド構造を製造するための方法
JP2021191041A Pending JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A Active JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021191041A Pending JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A Active JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Country Status (8)

Country Link
US (3) US11349065B2 (https=)
EP (1) EP3365929B1 (https=)
JP (3) JP6985260B2 (https=)
KR (1) KR102639433B1 (https=)
CN (1) CN108292699B (https=)
FR (1) FR3042649B1 (https=)
SG (1) SG11201803333RA (https=)
WO (1) WO2017068269A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042649B1 (fr) 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
JP7103528B2 (ja) * 2019-09-27 2022-07-20 株式会社村田製作所 弾性波装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848116B2 (ja) * 1992-05-26 1999-01-20 松下電器産業株式会社 水晶素板の加工方法
US5759753A (en) * 1995-07-19 1998-06-02 Matsushita Electric Industrial Co., Ltd. Piezoelectric device and method of manufacturing the same
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020158947A1 (en) * 2001-04-27 2002-10-31 Isaku Kanno Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element
JP2004186868A (ja) 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
US20080203137A1 (en) * 2007-02-28 2008-08-28 International Business Machines Corporation Substrate bonding methods and system including monitoring
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
JP4821834B2 (ja) 2008-10-31 2011-11-24 株式会社村田製作所 圧電性複合基板の製造方法
FR2938702B1 (fr) * 2008-11-19 2011-03-04 Soitec Silicon On Insulator Preparation de surface d'un substrat saphir pour la realisation d'heterostructures
US8644451B2 (en) 2009-03-27 2014-02-04 Shozo Aoki X-ray generating apparatus and inspection apparatus using the same therein
JP5359615B2 (ja) * 2009-07-02 2013-12-04 株式会社村田製作所 複合基板の製造方法
FR2949606B1 (fr) * 2009-08-26 2011-10-28 Commissariat Energie Atomique Procede de detachement par fracture d'un film mince de silicium mettant en oeuvre une triple implantation
CN102652354B (zh) * 2009-12-15 2015-02-18 索泰克公司 用于重复利用衬底的处理
FR2954585B1 (fr) * 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies Procede de realisation d'une heterostructure avec minimisation de contrainte
WO2011139852A2 (en) * 2010-04-29 2011-11-10 Skyline Solar, Inc. Thin film coating pinning arrangement
CN103262410B (zh) * 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
JP5796316B2 (ja) * 2011-03-22 2015-10-21 株式会社村田製作所 圧電デバイスの製造方法
CN104365019B (zh) * 2012-06-13 2017-08-25 日本碍子株式会社 复合基板
KR101636220B1 (ko) * 2012-07-12 2016-07-04 엔지케이 인슐레이터 엘티디 복합 기판, 압전 디바이스 및 복합 기판의 제법
WO2014027538A1 (ja) * 2012-08-17 2014-02-20 日本碍子株式会社 複合基板，弾性表面波デバイス及び複合基板の製造方法
WO2014077213A1 (ja) * 2012-11-14 2014-05-22 日本碍子株式会社 複合基板
JP2014147054A (ja) 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
TWI635632B (zh) 2013-02-19 2018-09-11 日本碍子股份有限公司 複合基板、彈性波裝置及彈性波裝置的製法
CN104272592B (zh) * 2013-03-27 2016-12-07 日本碍子株式会社 复合基板及弹性波装置
DE112014003430B4 (de) * 2013-07-25 2025-10-16 Ngk Ceramic Device Co.,Ltd., Kompositsubstrat und Verfahren zum Herstellen desselben
JP2015073082A (ja) * 2013-09-03 2015-04-16 住友電気工業株式会社 積層体の設計方法
US10103317B2 (en) * 2015-01-05 2018-10-16 Inston, Inc. Systems and methods for implementing efficient magnetoelectric junctions
FR3042649B1 (fr) * 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
EP3196952B1 (en) * 2016-01-21 2019-06-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mems piezoelectric transducer formed at a pcb support structure

Similar Documents

Publication Publication Date Title
JP2018537888A5 (https=)
CN111919290B (zh) 将压电层转移至载体衬底上的工艺
JP5934424B2 (ja) 弾性波デバイスの製法
CN109786229B (zh) 一种晶圆键合方法以及相应的异质衬底制备的方法
JP6481687B2 (ja) 弾性波装置
KR102333997B1 (ko) 유용층 이송방법
CN111033774B (zh) 压电器件以及压电器件的制造方法
JP6923518B2 (ja) 複合構造
US9680083B2 (en) Composite substrate, piezoelectric device, and method for manufacturing composite substrate
JP2012513684A5 (https=)
US9224696B2 (en) Integrated semiconductor device and method for fabricating the same
WO2019114072A1 (zh) 柔性显示面板的制作方法
JPWO2014156507A1 (ja) 複合基板及び弾性波デバイス
JP2018534863A5 (https=)
JP2016146449A (ja) 半導体装置の製造方法
JP7668864B2 (ja) ハイブリッド構造
JP5458651B2 (ja) 弾性表面波素子用基板及び弾性表面波素子の製造方法
WO2008139684A1 (ja) Ｓｏｉ基板の製造方法及びｓｏｉ基板
JP2015122566A (ja) 弾性波装置
JP4908597B2 (ja) 電子素子の個片化方法
JP6834088B2 (ja) 基板を製造するための方法
JP2014033467A (ja) 弾性表面波素子
JP5446338B2 (ja) 弾性表面波素子の製造方法及び弾性表面波素子