JP2018534863A5 - - Google Patents

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Publication number
JP2018534863A5
JP2018534863A5 JP2018520188A JP2018520188A JP2018534863A5 JP 2018534863 A5 JP2018534863 A5 JP 2018534863A5 JP 2018520188 A JP2018520188 A JP 2018520188A JP 2018520188 A JP2018520188 A JP 2018520188A JP 2018534863 A5 JP2018534863 A5 JP 2018534863A5
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JP
Japan
Prior art keywords
thickness
hybrid structure
support substrate
manufacturing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018520188A
Other languages
English (en)
Japanese (ja)
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JP2018534863A (ja
JP6985260B2 (ja
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Publication date
Priority claimed from FR1559993A external-priority patent/FR3042649B1/fr
Application filed filed Critical
Publication of JP2018534863A publication Critical patent/JP2018534863A/ja
Publication of JP2018534863A5 publication Critical patent/JP2018534863A5/ja
Priority to JP2021191041A priority Critical patent/JP2022043057A/ja
Application granted granted Critical
Publication of JP6985260B2 publication Critical patent/JP6985260B2/ja
Priority to JP2023213109A priority patent/JP7668864B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018520188A 2015-10-20 2016-10-17 ハイブリッド構造を製造するための方法 Active JP6985260B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021191041A JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride
FR1559993 2015-10-20
PCT/FR2016/052674 WO2017068269A1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021191041A Division JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造

Publications (3)

Publication Number Publication Date
JP2018534863A JP2018534863A (ja) 2018-11-22
JP2018534863A5 true JP2018534863A5 (https=) 2019-11-28
JP6985260B2 JP6985260B2 (ja) 2021-12-22

Family

ID=54848787

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018520188A Active JP6985260B2 (ja) 2015-10-20 2016-10-17 ハイブリッド構造を製造するための方法
JP2021191041A Pending JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A Active JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021191041A Pending JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
JP2023213109A Active JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造

Country Status (8)

Country Link
US (3) US11349065B2 (https=)
EP (1) EP3365929B1 (https=)
JP (3) JP6985260B2 (https=)
KR (1) KR102639433B1 (https=)
CN (1) CN108292699B (https=)
FR (1) FR3042649B1 (https=)
SG (1) SG11201803333RA (https=)
WO (1) WO2017068269A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042649B1 (fr) 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
CN114467258A (zh) * 2019-09-27 2022-05-10 株式会社村田制作所 弹性波装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848116B2 (ja) * 1992-05-26 1999-01-20 松下電器産業株式会社 水晶素板の加工方法
US5759753A (en) * 1995-07-19 1998-06-02 Matsushita Electric Industrial Co., Ltd. Piezoelectric device and method of manufacturing the same
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020158947A1 (en) * 2001-04-27 2002-10-31 Isaku Kanno Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element
JP2004186868A (ja) 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
US20080203137A1 (en) * 2007-02-28 2008-08-28 International Business Machines Corporation Substrate bonding methods and system including monitoring
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
JP4821834B2 (ja) * 2008-10-31 2011-11-24 株式会社村田製作所 圧電性複合基板の製造方法
FR2938702B1 (fr) * 2008-11-19 2011-03-04 Soitec Silicon On Insulator Preparation de surface d'un substrat saphir pour la realisation d'heterostructures
DE112010002512B4 (de) 2009-03-27 2024-03-14 Rigaku Corp. Röntgenstrahlerzeugungsvorrichtung und Untersuchungsvorrichtung, die diese verwendet
JP5359615B2 (ja) * 2009-07-02 2013-12-04 株式会社村田製作所 複合基板の製造方法
FR2949606B1 (fr) * 2009-08-26 2011-10-28 Commissariat Energie Atomique Procede de detachement par fracture d'un film mince de silicium mettant en oeuvre une triple implantation
KR101460086B1 (ko) * 2009-12-15 2014-11-10 소이텍 기판의 재활용 공정
FR2954585B1 (fr) * 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies Procede de realisation d'une heterostructure avec minimisation de contrainte
US8083362B2 (en) * 2010-04-29 2011-12-27 Skyline Solar, Inc. Thin film reflective coating pinning arrangement
CN106209007B (zh) * 2010-12-24 2019-07-05 株式会社村田制作所 弹性波装置
JP5796316B2 (ja) * 2011-03-22 2015-10-21 株式会社村田製作所 圧電デバイスの製造方法
EP2863545B1 (en) * 2012-06-13 2020-01-15 NGK Insulators, Ltd. Composite substrate
CN104396142B (zh) 2012-07-12 2018-01-05 日本碍子株式会社 复合基板、压电装置及复合基板的制造方法
KR101443015B1 (ko) * 2012-08-17 2014-09-22 엔지케이 인슐레이터 엘티디 복합 기판, 탄성 표면파 디바이스 및 복합 기판의 제조방법
KR101511001B1 (ko) * 2012-11-14 2015-04-10 엔지케이 인슐레이터 엘티디 복합 기판
JP2014147054A (ja) * 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
JP5934424B2 (ja) * 2013-02-19 2016-06-15 日本碍子株式会社 弾性波デバイスの製法
WO2014156507A1 (ja) * 2013-03-27 2014-10-02 日本碍子株式会社 複合基板及び弾性波デバイス
WO2015012005A1 (ja) * 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
JP2015073082A (ja) * 2013-09-03 2015-04-16 住友電気工業株式会社 積層体の設計方法
US10103317B2 (en) * 2015-01-05 2018-10-16 Inston, Inc. Systems and methods for implementing efficient magnetoelectric junctions
FR3042649B1 (fr) * 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
EP3196952B1 (en) * 2016-01-21 2019-06-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mems piezoelectric transducer formed at a pcb support structure

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