SG11201803333RA - Method for manufacturing a hybrid structure - Google Patents

Method for manufacturing a hybrid structure

Info

Publication number
SG11201803333RA
SG11201803333RA SG11201803333RA SG11201803333RA SG11201803333RA SG 11201803333R A SG11201803333R A SG 11201803333RA SG 11201803333R A SG11201803333R A SG 11201803333RA SG 11201803333R A SG11201803333R A SG 11201803333RA SG 11201803333R A SG11201803333R A SG 11201803333RA
Authority
SG
Singapore
Prior art keywords
manufacturing
hybrid structure
hybrid
Prior art date
Application number
SG11201803333RA
Other languages
English (en)
Inventor
Didier Landru
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201803333RA publication Critical patent/SG11201803333RA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG11201803333RA 2015-10-20 2016-10-17 Method for manufacturing a hybrid structure SG11201803333RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride
PCT/FR2016/052674 WO2017068269A1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride

Publications (1)

Publication Number Publication Date
SG11201803333RA true SG11201803333RA (en) 2018-05-30

Family

ID=54848787

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201803333RA SG11201803333RA (en) 2015-10-20 2016-10-17 Method for manufacturing a hybrid structure

Country Status (8)

Country Link
US (3) US11349065B2 (https=)
EP (1) EP3365929B1 (https=)
JP (3) JP6985260B2 (https=)
KR (1) KR102639433B1 (https=)
CN (1) CN108292699B (https=)
FR (1) FR3042649B1 (https=)
SG (1) SG11201803333RA (https=)
WO (1) WO2017068269A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042649B1 (fr) 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
CN114467258A (zh) * 2019-09-27 2022-05-10 株式会社村田制作所 弹性波装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848116B2 (ja) * 1992-05-26 1999-01-20 松下電器産業株式会社 水晶素板の加工方法
US5759753A (en) * 1995-07-19 1998-06-02 Matsushita Electric Industrial Co., Ltd. Piezoelectric device and method of manufacturing the same
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020158947A1 (en) * 2001-04-27 2002-10-31 Isaku Kanno Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element
JP2004186868A (ja) 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
US20080203137A1 (en) * 2007-02-28 2008-08-28 International Business Machines Corporation Substrate bonding methods and system including monitoring
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
JP4821834B2 (ja) * 2008-10-31 2011-11-24 株式会社村田製作所 圧電性複合基板の製造方法
FR2938702B1 (fr) * 2008-11-19 2011-03-04 Soitec Silicon On Insulator Preparation de surface d'un substrat saphir pour la realisation d'heterostructures
DE112010002512B4 (de) 2009-03-27 2024-03-14 Rigaku Corp. Röntgenstrahlerzeugungsvorrichtung und Untersuchungsvorrichtung, die diese verwendet
JP5359615B2 (ja) * 2009-07-02 2013-12-04 株式会社村田製作所 複合基板の製造方法
FR2949606B1 (fr) * 2009-08-26 2011-10-28 Commissariat Energie Atomique Procede de detachement par fracture d'un film mince de silicium mettant en oeuvre une triple implantation
KR101460086B1 (ko) * 2009-12-15 2014-11-10 소이텍 기판의 재활용 공정
FR2954585B1 (fr) * 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies Procede de realisation d'une heterostructure avec minimisation de contrainte
US8083362B2 (en) * 2010-04-29 2011-12-27 Skyline Solar, Inc. Thin film reflective coating pinning arrangement
CN106209007B (zh) * 2010-12-24 2019-07-05 株式会社村田制作所 弹性波装置
JP5796316B2 (ja) * 2011-03-22 2015-10-21 株式会社村田製作所 圧電デバイスの製造方法
EP2863545B1 (en) * 2012-06-13 2020-01-15 NGK Insulators, Ltd. Composite substrate
CN104396142B (zh) 2012-07-12 2018-01-05 日本碍子株式会社 复合基板、压电装置及复合基板的制造方法
KR101443015B1 (ko) * 2012-08-17 2014-09-22 엔지케이 인슐레이터 엘티디 복합 기판, 탄성 표면파 디바이스 및 복합 기판의 제조방법
KR101511001B1 (ko) * 2012-11-14 2015-04-10 엔지케이 인슐레이터 엘티디 복합 기판
JP2014147054A (ja) * 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
JP5934424B2 (ja) * 2013-02-19 2016-06-15 日本碍子株式会社 弾性波デバイスの製法
WO2014156507A1 (ja) * 2013-03-27 2014-10-02 日本碍子株式会社 複合基板及び弾性波デバイス
WO2015012005A1 (ja) * 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
JP2015073082A (ja) * 2013-09-03 2015-04-16 住友電気工業株式会社 積層体の設計方法
US10103317B2 (en) * 2015-01-05 2018-10-16 Inston, Inc. Systems and methods for implementing efficient magnetoelectric junctions
FR3042649B1 (fr) * 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
EP3196952B1 (en) * 2016-01-21 2019-06-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mems piezoelectric transducer formed at a pcb support structure

Also Published As

Publication number Publication date
WO2017068269A1 (fr) 2017-04-27
FR3042649B1 (fr) 2019-06-21
JP2018534863A (ja) 2018-11-22
EP3365929B1 (fr) 2019-09-25
US20240147864A1 (en) 2024-05-02
KR102639433B1 (ko) 2024-02-23
EP3365929A1 (fr) 2018-08-29
JP2022043057A (ja) 2022-03-15
US11349065B2 (en) 2022-05-31
KR20180074702A (ko) 2018-07-03
US12490656B2 (en) 2025-12-02
JP6985260B2 (ja) 2021-12-22
CN108292699B (zh) 2021-06-29
JP2024022682A (ja) 2024-02-16
JP7668864B2 (ja) 2025-04-25
US20220278269A1 (en) 2022-09-01
CN108292699A (zh) 2018-07-17
FR3042649A1 (fr) 2017-04-21
US11930710B2 (en) 2024-03-12
US20180309045A1 (en) 2018-10-25

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