KR102639433B1 - 하이브리드 구조체의 제조 방법 - Google Patents

하이브리드 구조체의 제조 방법 Download PDF

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KR102639433B1
KR102639433B1 KR1020187013180A KR20187013180A KR102639433B1 KR 102639433 B1 KR102639433 B1 KR 102639433B1 KR 1020187013180 A KR1020187013180 A KR 1020187013180A KR 20187013180 A KR20187013180 A KR 20187013180A KR 102639433 B1 KR102639433 B1 KR 102639433B1
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thickness
layer
support substrate
thinned
manufacturing
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Korean (ko)
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KR20180074702A (ko
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디디에 랑드뤼
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소이텍
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020187013180A 2015-10-20 2016-10-17 하이브리드 구조체의 제조 방법 Active KR102639433B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1559993 2015-10-20
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride
PCT/FR2016/052674 WO2017068269A1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride

Publications (2)

Publication Number Publication Date
KR20180074702A KR20180074702A (ko) 2018-07-03
KR102639433B1 true KR102639433B1 (ko) 2024-02-23

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KR1020187013180A Active KR102639433B1 (ko) 2015-10-20 2016-10-17 하이브리드 구조체의 제조 방법

Country Status (8)

Country Link
US (3) US11349065B2 (https=)
EP (1) EP3365929B1 (https=)
JP (3) JP6985260B2 (https=)
KR (1) KR102639433B1 (https=)
CN (1) CN108292699B (https=)
FR (1) FR3042649B1 (https=)
SG (1) SG11201803333RA (https=)
WO (1) WO2017068269A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042649B1 (fr) 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
JP7103528B2 (ja) * 2019-09-27 2022-07-20 株式会社村田製作所 弾性波装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109909A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd 圧電性複合基板の製造方法
JP2012199762A (ja) * 2011-03-22 2012-10-18 Murata Mfg Co Ltd 圧電デバイスの製造方法
WO2014010696A1 (ja) * 2012-07-12 2014-01-16 日本碍子株式会社 複合基板、圧電デバイス及び複合基板の製法

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JP2848116B2 (ja) * 1992-05-26 1999-01-20 松下電器産業株式会社 水晶素板の加工方法
US5759753A (en) * 1995-07-19 1998-06-02 Matsushita Electric Industrial Co., Ltd. Piezoelectric device and method of manufacturing the same
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020158947A1 (en) * 2001-04-27 2002-10-31 Isaku Kanno Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element
JP2004186868A (ja) 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
US20080203137A1 (en) * 2007-02-28 2008-08-28 International Business Machines Corporation Substrate bonding methods and system including monitoring
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
FR2938702B1 (fr) * 2008-11-19 2011-03-04 Soitec Silicon On Insulator Preparation de surface d'un substrat saphir pour la realisation d'heterostructures
US8644451B2 (en) 2009-03-27 2014-02-04 Shozo Aoki X-ray generating apparatus and inspection apparatus using the same therein
JP5359615B2 (ja) * 2009-07-02 2013-12-04 株式会社村田製作所 複合基板の製造方法
FR2949606B1 (fr) * 2009-08-26 2011-10-28 Commissariat Energie Atomique Procede de detachement par fracture d'un film mince de silicium mettant en oeuvre une triple implantation
CN102652354B (zh) * 2009-12-15 2015-02-18 索泰克公司 用于重复利用衬底的处理
FR2954585B1 (fr) * 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies Procede de realisation d'une heterostructure avec minimisation de contrainte
WO2011139852A2 (en) * 2010-04-29 2011-11-10 Skyline Solar, Inc. Thin film coating pinning arrangement
CN103262410B (zh) * 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
CN104365019B (zh) * 2012-06-13 2017-08-25 日本碍子株式会社 复合基板
WO2014027538A1 (ja) * 2012-08-17 2014-02-20 日本碍子株式会社 複合基板，弾性表面波デバイス及び複合基板の製造方法
WO2014077213A1 (ja) * 2012-11-14 2014-05-22 日本碍子株式会社 複合基板
JP2014147054A (ja) 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
TWI635632B (zh) 2013-02-19 2018-09-11 日本碍子股份有限公司 複合基板、彈性波裝置及彈性波裝置的製法
CN104272592B (zh) * 2013-03-27 2016-12-07 日本碍子株式会社 复合基板及弹性波装置
DE112014003430B4 (de) * 2013-07-25 2025-10-16 Ngk Ceramic Device Co.,Ltd., Kompositsubstrat und Verfahren zum Herstellen desselben
JP2015073082A (ja) * 2013-09-03 2015-04-16 住友電気工業株式会社 積層体の設計方法
US10103317B2 (en) * 2015-01-05 2018-10-16 Inston, Inc. Systems and methods for implementing efficient magnetoelectric junctions
FR3042649B1 (fr) * 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
EP3196952B1 (en) * 2016-01-21 2019-06-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mems piezoelectric transducer formed at a pcb support structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109909A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd 圧電性複合基板の製造方法
JP2012199762A (ja) * 2011-03-22 2012-10-18 Murata Mfg Co Ltd 圧電デバイスの製造方法
WO2014010696A1 (ja) * 2012-07-12 2014-01-16 日本碍子株式会社 複合基板、圧電デバイス及び複合基板の製法

Also Published As

Publication number Publication date
EP3365929A1 (fr) 2018-08-29
JP6985260B2 (ja) 2021-12-22
WO2017068269A1 (fr) 2017-04-27
US20220278269A1 (en) 2022-09-01
JP2024022682A (ja) 2024-02-16
JP2018534863A (ja) 2018-11-22
CN108292699A (zh) 2018-07-17
FR3042649B1 (fr) 2019-06-21
US20180309045A1 (en) 2018-10-25
FR3042649A1 (fr) 2017-04-21
US11930710B2 (en) 2024-03-12
CN108292699B (zh) 2021-06-29
SG11201803333RA (en) 2018-05-30
US11349065B2 (en) 2022-05-31
KR20180074702A (ko) 2018-07-03
JP2022043057A (ja) 2022-03-15
JP7668864B2 (ja) 2025-04-25
US20240147864A1 (en) 2024-05-02
US12490656B2 (en) 2025-12-02
EP3365929B1 (fr) 2019-09-25

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