FR3042649B1 - Procede de fabrication d'une structure hybride - Google Patents

Procede de fabrication d'une structure hybride Download PDF

Info

Publication number
FR3042649B1
FR3042649B1 FR1559993A FR1559993A FR3042649B1 FR 3042649 B1 FR3042649 B1 FR 3042649B1 FR 1559993 A FR1559993 A FR 1559993A FR 1559993 A FR1559993 A FR 1559993A FR 3042649 B1 FR3042649 B1 FR 3042649B1
Authority
FR
France
Prior art keywords
thickness
layer
thinned
manufacturing
support substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1559993A
Other languages
English (en)
French (fr)
Other versions
FR3042649A1 (fr
Inventor
Didier Landru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1559993A priority Critical patent/FR3042649B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to EP16795121.9A priority patent/EP3365929B1/fr
Priority to PCT/FR2016/052674 priority patent/WO2017068269A1/fr
Priority to KR1020187013180A priority patent/KR102639433B1/ko
Priority to JP2018520188A priority patent/JP6985260B2/ja
Priority to US15/769,690 priority patent/US11349065B2/en
Priority to CN201680067866.1A priority patent/CN108292699B/zh
Priority to SG11201803333RA priority patent/SG11201803333RA/en
Publication of FR3042649A1 publication Critical patent/FR3042649A1/fr
Application granted granted Critical
Publication of FR3042649B1 publication Critical patent/FR3042649B1/fr
Priority to JP2021191041A priority patent/JP2022043057A/ja
Priority to US17/663,569 priority patent/US11930710B2/en
Priority to JP2023213109A priority patent/JP7668864B2/ja
Priority to US18/403,485 priority patent/US12490656B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR1559993A 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride Expired - Fee Related FR3042649B1 (fr)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride
SG11201803333RA SG11201803333RA (en) 2015-10-20 2016-10-17 Method for manufacturing a hybrid structure
KR1020187013180A KR102639433B1 (ko) 2015-10-20 2016-10-17 하이브리드 구조체의 제조 방법
JP2018520188A JP6985260B2 (ja) 2015-10-20 2016-10-17 ハイブリッド構造を製造するための方法
US15/769,690 US11349065B2 (en) 2015-10-20 2016-10-17 Method for manufacturing a hybrid structure
CN201680067866.1A CN108292699B (zh) 2015-10-20 2016-10-17 用于制造混合结构的方法
EP16795121.9A EP3365929B1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride
PCT/FR2016/052674 WO2017068269A1 (fr) 2015-10-20 2016-10-17 Procédé de fabrication d'une structure hybride
JP2021191041A JP2022043057A (ja) 2015-10-20 2021-11-25 ハイブリッド構造
US17/663,569 US11930710B2 (en) 2015-10-20 2022-05-16 Hybrid structure and a method for manufacturing the same
JP2023213109A JP7668864B2 (ja) 2015-10-20 2023-12-18 ハイブリッド構造
US18/403,485 US12490656B2 (en) 2015-10-20 2024-01-03 Hybrid structure and a method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1559993 2015-10-20
FR1559993A FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride

Publications (2)

Publication Number Publication Date
FR3042649A1 FR3042649A1 (fr) 2017-04-21
FR3042649B1 true FR3042649B1 (fr) 2019-06-21

Family

ID=54848787

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1559993A Expired - Fee Related FR3042649B1 (fr) 2015-10-20 2015-10-20 Procede de fabrication d'une structure hybride

Country Status (8)

Country Link
US (3) US11349065B2 (https=)
EP (1) EP3365929B1 (https=)
JP (3) JP6985260B2 (https=)
KR (1) KR102639433B1 (https=)
CN (1) CN108292699B (https=)
FR (1) FR3042649B1 (https=)
SG (1) SG11201803333RA (https=)
WO (1) WO2017068269A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042649B1 (fr) 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
JP7103528B2 (ja) * 2019-09-27 2022-07-20 株式会社村田製作所 弾性波装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848116B2 (ja) * 1992-05-26 1999-01-20 松下電器産業株式会社 水晶素板の加工方法
US5759753A (en) * 1995-07-19 1998-06-02 Matsushita Electric Industrial Co., Ltd. Piezoelectric device and method of manufacturing the same
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020158947A1 (en) * 2001-04-27 2002-10-31 Isaku Kanno Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element
JP2004186868A (ja) 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
FR2858461B1 (fr) * 2003-07-30 2005-11-04 Soitec Silicon On Insulator Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques
US7601271B2 (en) * 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
US20080203137A1 (en) * 2007-02-28 2008-08-28 International Business Machines Corporation Substrate bonding methods and system including monitoring
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
JP4821834B2 (ja) 2008-10-31 2011-11-24 株式会社村田製作所 圧電性複合基板の製造方法
FR2938702B1 (fr) * 2008-11-19 2011-03-04 Soitec Silicon On Insulator Preparation de surface d'un substrat saphir pour la realisation d'heterostructures
US8644451B2 (en) 2009-03-27 2014-02-04 Shozo Aoki X-ray generating apparatus and inspection apparatus using the same therein
JP5359615B2 (ja) * 2009-07-02 2013-12-04 株式会社村田製作所 複合基板の製造方法
FR2949606B1 (fr) * 2009-08-26 2011-10-28 Commissariat Energie Atomique Procede de detachement par fracture d'un film mince de silicium mettant en oeuvre une triple implantation
CN102652354B (zh) * 2009-12-15 2015-02-18 索泰克公司 用于重复利用衬底的处理
FR2954585B1 (fr) * 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies Procede de realisation d'une heterostructure avec minimisation de contrainte
WO2011139852A2 (en) * 2010-04-29 2011-11-10 Skyline Solar, Inc. Thin film coating pinning arrangement
CN103262410B (zh) * 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
JP5796316B2 (ja) * 2011-03-22 2015-10-21 株式会社村田製作所 圧電デバイスの製造方法
CN104365019B (zh) * 2012-06-13 2017-08-25 日本碍子株式会社 复合基板
KR101636220B1 (ko) * 2012-07-12 2016-07-04 엔지케이 인슐레이터 엘티디 복합 기판, 압전 디바이스 및 복합 기판의 제법
WO2014027538A1 (ja) * 2012-08-17 2014-02-20 日本碍子株式会社 複合基板，弾性表面波デバイス及び複合基板の製造方法
WO2014077213A1 (ja) * 2012-11-14 2014-05-22 日本碍子株式会社 複合基板
JP2014147054A (ja) 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
TWI635632B (zh) 2013-02-19 2018-09-11 日本碍子股份有限公司 複合基板、彈性波裝置及彈性波裝置的製法
CN104272592B (zh) * 2013-03-27 2016-12-07 日本碍子株式会社 复合基板及弹性波装置
DE112014003430B4 (de) * 2013-07-25 2025-10-16 Ngk Ceramic Device Co.,Ltd., Kompositsubstrat und Verfahren zum Herstellen desselben
JP2015073082A (ja) * 2013-09-03 2015-04-16 住友電気工業株式会社 積層体の設計方法
US10103317B2 (en) * 2015-01-05 2018-10-16 Inston, Inc. Systems and methods for implementing efficient magnetoelectric junctions
FR3042649B1 (fr) * 2015-10-20 2019-06-21 Soitec Procede de fabrication d'une structure hybride
EP3196952B1 (en) * 2016-01-21 2019-06-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mems piezoelectric transducer formed at a pcb support structure

Also Published As

Publication number Publication date
EP3365929A1 (fr) 2018-08-29
KR102639433B1 (ko) 2024-02-23
JP6985260B2 (ja) 2021-12-22
WO2017068269A1 (fr) 2017-04-27
US20220278269A1 (en) 2022-09-01
JP2024022682A (ja) 2024-02-16
JP2018534863A (ja) 2018-11-22
CN108292699A (zh) 2018-07-17
US20180309045A1 (en) 2018-10-25
FR3042649A1 (fr) 2017-04-21
US11930710B2 (en) 2024-03-12
CN108292699B (zh) 2021-06-29
SG11201803333RA (en) 2018-05-30
US11349065B2 (en) 2022-05-31
KR20180074702A (ko) 2018-07-03
JP2022043057A (ja) 2022-03-15
JP7668864B2 (ja) 2025-04-25
US20240147864A1 (en) 2024-05-02
US12490656B2 (en) 2025-12-02
EP3365929B1 (fr) 2019-09-25

Similar Documents

Publication Publication Date Title
EP1359615B1 (fr) Procédé de décollement de couches de matériau
EP3365927B1 (fr) Structure composite et procédé de fabrication associé
WO2008093008A2 (fr) Procédé de fabrication de couches minces de gan par implantation et recyclage d'un substrat de départ
FR2797347A1 (fr) Procede de transfert d'une couche mince comportant une etape de surfragililisation
FR2931014A1 (fr) Procede d'assemblage de plaques par adhesion moleculaire
FR3020175A1 (fr) Procede de transfert d'une couche utile
FR3052298A1 (fr) Structure hybride pour dispositif a ondes acoustiques de surface
JP7668864B2 (ja) ハイブリッド構造
FR2969378A1 (fr) Structure composite tridimensionnelle comportant plusieurs couches de microcomposants en alignement
EP4128330B1 (fr) Procede de fabrication d'une structure empilee
EP2302666B1 (fr) Procédé de planarisation par ultrasons d'un substrat dont une surface a été libérée par fracture d'une couche enterrée fragilisée
EP3939078A1 (fr) Procede de transfert d'une couche utile sur une substrat support
FR3073083B1 (fr) Procede de fabrication d'un film sur un feuillet flexible
EP3939077A1 (fr) Procede de transfert d'une couche utile sur un substrat support
EP3939076A1 (fr) Procede de transfert d'une couche utile sur un substrat support
WO2025185960A1 (fr) Procédé de fabrication d'un substrat, et substrat

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20170421

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

ST Notification of lapse

Effective date: 20250606