JP2018533117A - フレキシブルデバイス用ファブリック信号経路構造 - Google Patents
フレキシブルデバイス用ファブリック信号経路構造 Download PDFInfo
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 7
- 239000002759 woven fabric Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
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- 229910052759 nickel Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
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- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1683—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for the transmission of signal or power between the different housings, e.g. details of wired or wireless communication, passage of cabling
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- H—ELECTRICITY
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- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
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- A45C2011/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for portable computing devices, e.g. laptop, tablet, netbook, game boy, navigation system, calculator
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- Textile Engineering (AREA)
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- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Woven Fabrics (AREA)
Abstract
Description
本出願は、一般に、電子デバイスに関し、より具体的には、電子デバイス用のフレキシブルな信号経路構造に関するものである。
Claims (22)
- 電子デバイス内で信号を伝達するためのフレキシブルファブリック信号経路構造であって、
ファブリック基材と、
複数の平行した金属トレースを形成するようにパターニングされた、前記ファブリック基材上の金属層と、を備える、フレキシブルファブリック信号経路構造。 - 前記ファブリック基材は、織布層を含む、請求項1に記載のフレキシブルファブリック信号経路構造。
- 前記織布層は、ポリマーストランド材料を含む、請求項2に記載のフレキシブルファブリック信号経路構造。
- 前記ポリマーストランド材料は、ナイロンを含む、請求項3に記載のフレキシブルファブリック信号経路構造。
- 前記金属層は、異なる金属の複数の金属層を含む、請求項3に記載のフレキシブルファブリック信号経路構造。
- 前記金属層は、第1の金属層と、前記第1の金属層上の第2の金属層とを含む、請求項3に記載のフレキシブルファブリック信号経路構造。
- 前記第1の金属層は、銅及びニッケルからなるグループから選択される金属を含む、請求項6に記載のフレキシブルファブリック信号経路構造。
- 前記第2の層は、銀、銅及びスズからなるグループから選択される材料を含む、請求項7に記載のフレキシブルファブリック信号経路構造。
- 前記金属層は、無電解金属及び電解質めっきされた金属からなるグループから選択される複数の金属層を含む、請求項3に記載のフレキシブルファブリック信号経路構造。
- 前記金属トレースの幅は0.5cmよりも大きい、請求項1に記載のフレキシブルファブリック信号経路構造。
- 電子デバイス用のカバーであって、
少なくとも1つの曲げ軸周りで曲がることを可能とするヒンジ部を有する本体と、
前記曲げ軸と重なり、かつ、前記曲げ軸を横切って信号を伝達する信号経路を有する、前記本体内のフレキシブルファブリック信号経路構造と、を備える、カバー。 - 前記カバーは、
金属パッドを有するプリント回路と、
前記フレキシブルファブリック信号経路構造上の前記信号経路と前記プリント回路との間に挟まれて、前記信号経路を前記プリント回路上の前記金属パッドに電気的に結合する導電性接着剤と、を更に含む、請求項11に記載のカバー。 - 前記導電性接着剤を囲む絶縁性接着剤を更に含む、請求項12に記載のカバー。
- キーボードの一部を形成する、前記プリント回路上に取り付けられたキースイッチを更に含む、請求項13に記載のカバー。
- 前記フレキシブルファブリック信号経路構造は、互いに反対側にある第1の端部及び第2の端部を有し、前記導電性接着剤は、前記第1の端部において形成され、前記カバーは、前記第2の端部において前記フレキシブルファブリック信号経路構造に結合されたコネクタを更に含む、請求項14に記載のカバー。
- 前記信号経路は、導電性ストランド材料を含み、前記フレキシブルファブリック信号経路構造は、前記ストランド材料を含むファブリック層を含む、請求項15に記載のカバー。
- 前記フレキシブルファブリック信号経路構造は、ファブリック基材を有し、前記信号経路は、前記ファブリック基材上に金属トレースを含む、請求項15に記載のカバー。
- 前記金属トレースは、電気めっきされた金属を含む、請求項17に記載のカバー。
- 前記金属トレースは、前記曲げ軸に垂直に延在し、前記ファブリック基材は、前記曲げ軸から1〜10°のゼロ度以外の角度で配向されたストランド材料を含む、請求項18に記載のカバー。
- タブレットコンピュータ用のカバーであって、
互いに反対側にある第1の端部及び第2の端部を有する本体であって、前記第1の端部と第2の端部との間の位置において、曲げ軸周りで前記本体が曲がることを可能とするヒンジ部を有する本体と、
プリント回路を有するキーボードと、
コネクタと、
前記第1において前記キーボードに結合され、かつ前記第2の端部において前記コネクタに結合された金属トレースを有する、前記本体内のフレキシブルファブリック信号経路構造と、を備える、カバー。 - 前記フレキシブルファブリック信号経路構造は、前記キーボードと前記コネクタとの間で信号を伝達する、電気めっきされた金属トレースでコーティングされた織布を含む、請求項20記載のカバー。
- 前記金属トレースの幅は0.5cmよりも大きい、請求項21に記載のカバー。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/843,617 | 2015-09-02 | ||
US14/843,617 US9883583B2 (en) | 2015-09-02 | 2015-09-02 | Fabric signal path structures for flexible devices |
PCT/US2016/041180 WO2017039830A1 (en) | 2015-09-02 | 2016-07-06 | Fabric signal path structures for flexible devices |
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JP2020149158A Division JP7116129B2 (ja) | 2015-09-02 | 2020-09-04 | フレキシブルデバイス用ファブリック信号経路構造 |
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JP2018533117A true JP2018533117A (ja) | 2018-11-08 |
JP6802261B2 JP6802261B2 (ja) | 2020-12-16 |
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JP2018511251A Active JP6802261B2 (ja) | 2015-09-02 | 2016-07-06 | フレキシブルデバイス用ファブリック信号経路構造 |
JP2020149158A Active JP7116129B2 (ja) | 2015-09-02 | 2020-09-04 | フレキシブルデバイス用ファブリック信号経路構造 |
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US (2) | US9883583B2 (ja) |
JP (2) | JP6802261B2 (ja) |
KR (2) | KR102223162B1 (ja) |
CN (3) | CN107920643A (ja) |
WO (1) | WO2017039830A1 (ja) |
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JP7144707B1 (ja) * | 2022-04-22 | 2022-09-30 | 富士通クライアントコンピューティング株式会社 | 電子機器および電子機器システム |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9588551B1 (en) * | 2015-09-02 | 2017-03-07 | Apple Inc. | Fabric electronic device housings |
US10993635B1 (en) | 2016-03-22 | 2021-05-04 | Flextronics Ap, Llc | Integrating biosensor to compression shirt textile and interconnect method |
US10400364B1 (en) * | 2016-09-20 | 2019-09-03 | Apple Inc. | Fabrics with conductive paths |
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US10362670B2 (en) | 2019-07-23 |
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US9883583B2 (en) | 2018-01-30 |
JP7116129B2 (ja) | 2022-08-09 |
CN205847721U (zh) | 2016-12-28 |
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