JP7116129B2 - フレキシブルデバイス用ファブリック信号経路構造 - Google Patents
フレキシブルデバイス用ファブリック信号経路構造 Download PDFInfo
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- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
- A45C11/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable computing devices, e.g. laptops, tablets or calculators
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- A—HUMAN NECESSITIES
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- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
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- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- Textile Engineering (AREA)
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- Manufacturing & Machinery (AREA)
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Description
本出願は、一般に、電子デバイスに関し、より具体的には、電子デバイス用のフレキシブルな信号経路構造に関するものである。
Claims (20)
- 電子デバイスのためのカバーであって、
第1の部分及び第2の部分を有する本体であって、前記第2の部分は、互いに反対側にある第1の端部及び第2の端部を有し、前記第1の端部は、前記第1の部分に結合されており、前記本体は、前記第1の部分と前記第2の部分との間の曲げ軸に沿って折り曲がり、前記本体は、外面を有する、本体と、
前記本体の前記第1の部分上のキーボードと、
前記本体の前記第2の部分の前記第2の端部上のコネクタであって、前記コネクタは、前記本体の前記外面に位置する、コネクタと、
前記曲げ軸と交わり、前記キーボードを前記コネクタに結合するフレキシブル信号経路と、
を備えるカバー。 - 請求項1に記載のカバーであって、前記本体は、前記曲げ軸に平行な第1の追加の曲げ軸及び第2の追加の曲げ軸に沿って折り曲がり、前記第1の追加の曲げ軸は、前記曲げ軸と前記第2の追加の曲げ軸との間にあり、前記カバーは、前記カバーが前記電子デバイスを支え前記電子デバイスに接続するスタンド位置に構成可能であり、前記カバーが前記スタンド位置である場合に、前記カバーは、前記曲げ軸で開かれ、前記第1の追加の曲げ軸及び前記第2の追加の曲げ軸で折り曲げられる、カバー。
- 請求項1に記載のカバーであって、前記フレキシブル信号経路は、ファブリックを備え、前記フレキシブル信号経路は、前記ファブリック上の金属の層を備える、カバー。
- 請求項3に記載のカバーであって、前記金属の層は、金属配線を形成するようにパターニングされている、カバー。
- 請求項4に記載のカバーであって、前記コネクタは、第1の接点と、第2の接点と、第3の接点とを備え、前記金属配線は、前記第1の接点に結合された第1の金属配線と、前記第2の接点に結合された第2の金属配線と、前記第3の接点に結合された第3の金属配線とを備える、カバー。
- 請求項1に記載のカバーであって、前記キーボードは、プリント回路と、前記プリント回路上のキースイッチのアレイとを備える、カバー。
- 請求項6に記載のカバーであって、前記プリント回路は、互いに反対側にある上面及び下面を有し、前記上面に前記キースイッチが位置し、前記下面に電気接点が位置し、前記カバーは、
前記電気接点を前記フレキシブル信号経路に結合する導電性接着剤をさらに備える、カバー。 - 請求項7に記載のカバーであって、前記導電性接着剤を少なくとも部分的に囲む絶縁性接着剤をさらに備える、カバー。
- 請求項7に記載のカバーであって、前記キースイッチのアレイに重なるファブリック層をさらに備える、カバー。
- 請求項1に記載のカバーであって、前記本体は、追加の曲げ軸に沿って折り曲がり、前記フレキシブル信号経路は、前記追加の曲げ軸と交わる、カバー。
- タブレットコンピュータのためのカバーであって、
フレキシブルヒンジによって分離された第1の部分及び第2の部分を有する筐体と、
前記第1の部分にあるキーボードと、
前記第2の部分にある補強材と、
前記筐体の外面上の電気接点であって、前記フレキシブルヒンジは、前記第2の部分の第1の端部に位置し、前記電気接点は、前記第2の部分の、反対側にある第2の端部に位置する、電気接点と、
前記フレキシブルヒンジ及び前記補強材に重なる導電性信号経路と、を備え、
前記導電性信号経路は、前記キーボードに結合された第1の端部と、前記電気接点に結合された第2の端部とを有する、カバー。 - 請求項11に記載のカバーであって、
第1の追加のフレキシブルヒンジ及び第2の追加のフレキシブルヒンジと、
第1の追加の補強材及び第2の追加の補強材と、をさらに備え、
前記フレキシブルヒンジ、前記第1の追加のフレキシブルヒンジ及び前記第2の追加のフレキシブルヒンジは、前記第2の部分において前記補強材、前記第1の追加の補強材及び前記第2の追加の補強材とともに散在する、カバー。 - 請求項11に記載のカバーであって、前記導電性信号経路は、ファブリック構造上の金属層を備える、カバー。
- 請求項13に記載のカバーであって、前記金属層は、前記ファブリック構造の開口を貫通する、カバー。
- 請求項11に記載のカバーであって、前記フレキシブルヒンジは、前記筐体が曲げ軸の周りで折り曲がることを可能にし、前記導電性信号経路は、前記曲げ軸に直交する、カバー。
- 電子デバイスのためのカバーであって、
曲げ軸に沿って折り曲がる筐体と、
前記筐体の外面上のコネクタと、
キーボードと、
前記キーボードを覆う第1のファブリック層と、
前記曲げ軸と交わる第2のファブリック層であって、前記キーボードと前記コネクタとの間に結合された金属配線を含む第2のファブリック層と、
を備え、
前記金属配線はそれぞれ、前記曲げ軸に直交する方向に延在する、カバー。 - 請求項16に記載のカバーであって、前記筐体は、第1の追加の曲げ軸及び第2の追加の曲げ軸に沿って折り曲がり、前記第2のファブリック層は、前記第1の追加の曲げ軸及び前記第2の追加の曲げ軸と交わる、カバー。
- 請求項16に記載のカバーであって、前記第2のファブリック層は、織られたファブリックを備え、前記金属配線は、パターニングされた金属の層から形成される、カバー。
- 請求項16に記載のカバーであって、前記キーボードは、前記金属配線に結合された電気接点を有するプリント回路を備える、カバー。
- 請求項19に記載のカバーであって、前記電気接点を前記金属配線に結合する導電性接着剤をさらに備える、カバー。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/843,617 | 2015-09-02 | ||
US14/843,617 US9883583B2 (en) | 2015-09-02 | 2015-09-02 | Fabric signal path structures for flexible devices |
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JP2018511251A Division JP6802261B2 (ja) | 2015-09-02 | 2016-07-06 | フレキシブルデバイス用ファブリック信号経路構造 |
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JP2021012701A JP2021012701A (ja) | 2021-02-04 |
JP2021012701A5 JP2021012701A5 (ja) | 2021-03-18 |
JP7116129B2 true JP7116129B2 (ja) | 2022-08-09 |
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JP2020149158A Active JP7116129B2 (ja) | 2015-09-02 | 2020-09-04 | フレキシブルデバイス用ファブリック信号経路構造 |
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Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9588551B1 (en) * | 2015-09-02 | 2017-03-07 | Apple Inc. | Fabric electronic device housings |
US10993635B1 (en) | 2016-03-22 | 2021-05-04 | Flextronics Ap, Llc | Integrating biosensor to compression shirt textile and interconnect method |
US10400364B1 (en) * | 2016-09-20 | 2019-09-03 | Apple Inc. | Fabrics with conductive paths |
US10466804B2 (en) * | 2017-01-12 | 2019-11-05 | Microsoft Technology Licensing, Llc | Composite unibody keyboard |
US11323794B2 (en) | 2017-03-20 | 2022-05-03 | Buderflys Technologies, Inc. | Personal hearing device |
TW201836447A (zh) * | 2017-03-24 | 2018-10-01 | 致伸科技股份有限公司 | 具擴充功能之薄膜線路結構 |
KR102495240B1 (ko) * | 2018-07-30 | 2023-02-03 | 삼성전자주식회사 | Led 백라이트 케이스 |
US10985484B1 (en) * | 2018-10-01 | 2021-04-20 | Flex Ltd. | Electronic conductive interconnection for bridging across irregular areas in a textile product |
WO2020096579A1 (en) * | 2018-11-06 | 2020-05-14 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
US11675440B2 (en) | 2019-09-30 | 2023-06-13 | Microsoft Technology Licensing, Llc | Solvent free textile coating |
US11239710B2 (en) | 2019-09-30 | 2022-02-01 | Microsoft Technology Licensing, Llc | Charging system including orientation control |
KR20210047585A (ko) | 2019-10-22 | 2021-04-30 | 삼성전자주식회사 | 폴더블 전자 장치를 위한 보호 커버 |
US11672096B2 (en) * | 2020-04-24 | 2023-06-06 | Microsoft Technology Licensing, Llc | Seamless textile covered enclosure |
DE102020213995A1 (de) * | 2020-11-06 | 2022-05-12 | Volkswagen Aktiengesellschaft | Antennenvorrichtung |
JP6997407B1 (ja) | 2021-06-16 | 2022-01-17 | 富士通クライアントコンピューティング株式会社 | スタンド付きキーボード及び電子機器 |
JP7563322B2 (ja) | 2021-07-27 | 2024-10-08 | 株式会社オートネットワーク技術研究所 | コネクタ |
KR20230020071A (ko) * | 2021-08-02 | 2023-02-10 | 삼성디스플레이 주식회사 | 표시장치 및 이를 포함하는 전자장치 |
US12079045B2 (en) | 2021-09-21 | 2024-09-03 | Microsoft Technology Licensing, Llc | Fabric hinged device |
US11721934B2 (en) * | 2021-12-23 | 2023-08-08 | Bayerische Motoren Werke Aktiengesellschaft | Hidden power and data connectors for accessories |
CN114740952B (zh) * | 2022-04-02 | 2023-12-19 | 西安中诺通讯有限公司 | 一种具有折叠屏的智能终端及其控制方法、装置 |
CN114870256A (zh) * | 2022-04-08 | 2022-08-09 | 苏州维伟思医疗科技有限公司 | 植入式发生器及其应用的植入式心脏医疗设备 |
JP7144707B1 (ja) * | 2022-04-22 | 2022-09-30 | 富士通クライアントコンピューティング株式会社 | 電子機器および電子機器システム |
US12299218B2 (en) | 2023-06-11 | 2025-05-13 | Remarkable As | Active pen-stylus precise eraser |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110096513A1 (en) | 2009-10-23 | 2011-04-28 | Phil-Sang Kim | Expansion module for mobile device and mobile device having the same |
JP2013084246A (ja) | 2011-09-30 | 2013-05-09 | Sony Corp | 保護カバー及び情報処理装置 |
JP2014512552A (ja) | 2011-01-31 | 2014-05-22 | アップル インコーポレイテッド | 可撓性ディスプレイを有するカバーアタッチメント |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3116348A1 (de) | 1980-04-28 | 1982-09-09 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "elektrische verbindungseinrichtung" |
JPS6127089Y2 (ja) * | 1980-09-03 | 1986-08-13 | ||
JPS61107792A (ja) * | 1984-10-31 | 1986-05-26 | 東芝シリコ−ン株式会社 | 回路基布の形成方法 |
JPS61224393A (ja) * | 1985-03-28 | 1986-10-06 | ダイソー株式会社 | メッキ回路基板の製法 |
JPS61224392A (ja) * | 1985-03-29 | 1986-10-06 | 松下電器産業株式会社 | 導電性スキ−ジ |
JPH10161785A (ja) * | 1996-11-28 | 1998-06-19 | Nec Yonezawa Ltd | メンブレンキーボード |
JPH1115924A (ja) * | 1997-06-19 | 1999-01-22 | Olympus Optical Co Ltd | 情報カード処理装置 |
US6307751B1 (en) | 1998-06-01 | 2001-10-23 | Wearlogic, Inc. | Flexible circuit assembly |
GB2365132B (en) | 2000-03-30 | 2003-01-08 | Electrotextiles Co Ltd | Manual input apparatus and processor |
GB0129968D0 (en) | 2001-12-14 | 2002-02-06 | Nel Technologies Ltd | Flexible heater |
DE10161527A1 (de) * | 2001-12-14 | 2003-07-03 | Infineon Technologies Ag | Aufbau- und Verbindungstechnik in textilen Strukturen |
JP2005317836A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
WO2006030230A1 (en) | 2004-09-16 | 2006-03-23 | Sentrix Technology Limited | Switches and devices for textile artcles |
US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
KR20070071935A (ko) * | 2005-12-30 | 2007-07-04 | 브이케이 주식회사 | 액정클리너가 일체로 구비된 휴대용 키패드 |
US20100203789A1 (en) * | 2006-01-17 | 2010-08-12 | Seiren Co., Ltd. | Electrically conductive gasket material |
US8022307B2 (en) * | 2006-07-10 | 2011-09-20 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fabric circuits and method of manufacturing fabric circuits |
CN101240475B (zh) | 2007-02-08 | 2012-07-25 | 深圳市冠旭电子有限公司 | 电子织物 |
WO2008120138A1 (en) * | 2007-03-29 | 2008-10-09 | Koninklijke Philips Electronics N.V. | Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile |
JP5136479B2 (ja) * | 2009-03-17 | 2013-02-06 | 株式会社デンソーウェーブ | ロボットの回転関節用配線装置 |
US8467179B2 (en) * | 2010-01-28 | 2013-06-18 | Cruxcase, Llc | Tablet computer case and associated methods |
EP2413572B1 (en) | 2010-07-30 | 2015-09-02 | BlackBerry Limited | Mobile wireless communications device with spatial diversity antenna and related methods |
WO2013103082A1 (ja) * | 2012-01-06 | 2013-07-11 | ソニー株式会社 | 外部構造体及び電子機器 |
US9075566B2 (en) | 2012-03-02 | 2015-07-07 | Microsoft Technoogy Licensing, LLC | Flexible hinge spine |
US9684382B2 (en) | 2012-06-13 | 2017-06-20 | Microsoft Technology Licensing, Llc | Input device configuration having capacitive and pressure sensors |
PT2893781T (pt) | 2012-09-06 | 2021-07-09 | Saati Spa | Método para produzir circuitos flexíveis |
TWM459753U (zh) * | 2012-10-11 | 2013-08-21 | Fu-Yi Hsu | 保護套 |
US9048597B2 (en) | 2012-10-19 | 2015-06-02 | Apple Inc. | Structures for securing printed circuit connectors |
US9526285B2 (en) | 2012-12-18 | 2016-12-27 | Intel Corporation | Flexible computing fabric |
US9287336B2 (en) | 2013-02-26 | 2016-03-15 | Apple Inc. | Displays with shared flexible substrates |
CN104252197B (zh) | 2013-06-26 | 2019-02-05 | 联想(北京)有限公司 | 一种电子设备及电子设备组件 |
JP2015018469A (ja) * | 2013-07-12 | 2015-01-29 | 日本電信電話株式会社 | 接続部品 |
CN104010446B (zh) | 2014-05-30 | 2017-05-24 | 西安工程大学 | 微滴喷射与化学沉积技术制备柔性导电线路的方法及装置 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110096513A1 (en) | 2009-10-23 | 2011-04-28 | Phil-Sang Kim | Expansion module for mobile device and mobile device having the same |
JP2014512552A (ja) | 2011-01-31 | 2014-05-22 | アップル インコーポレイテッド | 可撓性ディスプレイを有するカバーアタッチメント |
JP2013084246A (ja) | 2011-09-30 | 2013-05-09 | Sony Corp | 保護カバー及び情報処理装置 |
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WO2017039830A1 (en) | 2017-03-09 |
CN205847721U (zh) | 2016-12-28 |
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US20170060192A1 (en) | 2017-03-02 |
KR102318729B1 (ko) | 2021-10-27 |
US10362670B2 (en) | 2019-07-23 |
JP6802261B2 (ja) | 2020-12-16 |
CN107920643A (zh) | 2018-04-17 |
KR20210025706A (ko) | 2021-03-09 |
JP2021012701A (ja) | 2021-02-04 |
US9883583B2 (en) | 2018-01-30 |
KR102223162B1 (ko) | 2021-03-05 |
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