JP7116129B2 - フレキシブルデバイス用ファブリック信号経路構造 - Google Patents
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- G06F1/1662—Details related to the integrated keyboard
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
- A45C2011/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for portable computing devices, e.g. laptop, tablet, netbook, game boy, navigation system, calculator
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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Description
本出願は、一般に、電子デバイスに関し、より具体的には、電子デバイス用のフレキシブルな信号経路構造に関するものである。
Claims (20)
- 電子デバイスのためのカバーであって、
第1の部分及び第2の部分を有する本体であって、前記第2の部分は、互いに反対側にある第1の端部及び第2の端部を有し、前記第1の端部は、前記第1の部分に結合されており、前記本体は、前記第1の部分と前記第2の部分との間の曲げ軸に沿って折り曲がり、前記本体は、外面を有する、本体と、
前記本体の前記第1の部分上のキーボードと、
前記本体の前記第2の部分の前記第2の端部上のコネクタであって、前記コネクタは、前記本体の前記外面に位置する、コネクタと、
前記曲げ軸と交わり、前記キーボードを前記コネクタに結合するフレキシブル信号経路と、
を備えるカバー。 - 請求項1に記載のカバーであって、前記本体は、前記曲げ軸に平行な第1の追加の曲げ軸及び第2の追加の曲げ軸に沿って折り曲がり、前記第1の追加の曲げ軸は、前記曲げ軸と前記第2の追加の曲げ軸との間にあり、前記カバーは、前記カバーが前記電子デバイスを支え前記電子デバイスに接続するスタンド位置に構成可能であり、前記カバーが前記スタンド位置である場合に、前記カバーは、前記曲げ軸で開かれ、前記第1の追加の曲げ軸及び前記第2の追加の曲げ軸で折り曲げられる、カバー。
- 請求項1に記載のカバーであって、前記フレキシブル信号経路は、ファブリックを備え、前記フレキシブル信号経路は、前記ファブリック上の金属の層を備える、カバー。
- 請求項3に記載のカバーであって、前記金属の層は、金属配線を形成するようにパターニングされている、カバー。
- 請求項4に記載のカバーであって、前記コネクタは、第1の接点と、第2の接点と、第3の接点とを備え、前記金属配線は、前記第1の接点に結合された第1の金属配線と、前記第2の接点に結合された第2の金属配線と、前記第3の接点に結合された第3の金属配線とを備える、カバー。
- 請求項1に記載のカバーであって、前記キーボードは、プリント回路と、前記プリント回路上のキースイッチのアレイとを備える、カバー。
- 請求項6に記載のカバーであって、前記プリント回路は、互いに反対側にある上面及び下面を有し、前記上面に前記キースイッチが位置し、前記下面に電気接点が位置し、前記カバーは、
前記電気接点を前記フレキシブル信号経路に結合する導電性接着剤をさらに備える、カバー。 - 請求項7に記載のカバーであって、前記導電性接着剤を少なくとも部分的に囲む絶縁性接着剤をさらに備える、カバー。
- 請求項7に記載のカバーであって、前記キースイッチのアレイに重なるファブリック層をさらに備える、カバー。
- 請求項1に記載のカバーであって、前記本体は、追加の曲げ軸に沿って折り曲がり、前記フレキシブル信号経路は、前記追加の曲げ軸と交わる、カバー。
- タブレットコンピュータのためのカバーであって、
フレキシブルヒンジによって分離された第1の部分及び第2の部分を有する筐体と、
前記第1の部分にあるキーボードと、
前記第2の部分にある補強材と、
前記筐体の外面上の電気接点であって、前記フレキシブルヒンジは、前記第2の部分の第1の端部に位置し、前記電気接点は、前記第2の部分の、反対側にある第2の端部に位置する、電気接点と、
前記フレキシブルヒンジ及び前記補強材に重なる導電性信号経路と、を備え、
前記導電性信号経路は、前記キーボードに結合された第1の端部と、前記電気接点に結合された第2の端部とを有する、カバー。 - 請求項11に記載のカバーであって、
第1の追加のフレキシブルヒンジ及び第2の追加のフレキシブルヒンジと、
第1の追加の補強材及び第2の追加の補強材と、をさらに備え、
前記フレキシブルヒンジ、前記第1の追加のフレキシブルヒンジ及び前記第2の追加のフレキシブルヒンジは、前記第2の部分において前記補強材、前記第1の追加の補強材及び前記第2の追加の補強材とともに散在する、カバー。 - 請求項11に記載のカバーであって、前記導電性信号経路は、ファブリック構造上の金属層を備える、カバー。
- 請求項13に記載のカバーであって、前記金属層は、前記ファブリック構造の開口を貫通する、カバー。
- 請求項11に記載のカバーであって、前記フレキシブルヒンジは、前記筐体が曲げ軸の周りで折り曲がることを可能にし、前記導電性信号経路は、前記曲げ軸に直交する、カバー。
- 電子デバイスのためのカバーであって、
曲げ軸に沿って折り曲がる筐体と、
前記筐体の外面上のコネクタと、
キーボードと、
前記キーボードを覆う第1のファブリック層と、
前記曲げ軸と交わる第2のファブリック層であって、前記キーボードと前記コネクタとの間に結合された金属配線を含む第2のファブリック層と、
を備え、
前記金属配線はそれぞれ、前記曲げ軸に直交する方向に延在する、カバー。 - 請求項16に記載のカバーであって、前記筐体は、第1の追加の曲げ軸及び第2の追加の曲げ軸に沿って折り曲がり、前記第2のファブリック層は、前記第1の追加の曲げ軸及び前記第2の追加の曲げ軸と交わる、カバー。
- 請求項16に記載のカバーであって、前記第2のファブリック層は、織られたファブリックを備え、前記金属配線は、パターニングされた金属の層から形成される、カバー。
- 請求項16に記載のカバーであって、前記キーボードは、前記金属配線に結合された電気接点を有するプリント回路を備える、カバー。
- 請求項19に記載のカバーであって、前記電気接点を前記金属配線に結合する導電性接着剤をさらに備える、カバー。
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US14/843,617 | 2015-09-02 | ||
US14/843,617 US9883583B2 (en) | 2015-09-02 | 2015-09-02 | Fabric signal path structures for flexible devices |
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JP2018511251A Division JP6802261B2 (ja) | 2015-09-02 | 2016-07-06 | フレキシブルデバイス用ファブリック信号経路構造 |
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JP2021012701A JP2021012701A (ja) | 2021-02-04 |
JP2021012701A5 JP2021012701A5 (ja) | 2021-03-18 |
JP7116129B2 true JP7116129B2 (ja) | 2022-08-09 |
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JP2020149158A Active JP7116129B2 (ja) | 2015-09-02 | 2020-09-04 | フレキシブルデバイス用ファブリック信号経路構造 |
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JP (2) | JP6802261B2 (ja) |
KR (2) | KR102318729B1 (ja) |
CN (3) | CN107920643A (ja) |
WO (1) | WO2017039830A1 (ja) |
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US10362670B2 (en) | 2019-07-23 |
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CN107920643A (zh) | 2018-04-17 |
US20180168027A1 (en) | 2018-06-14 |
CN115061538A (zh) | 2022-09-16 |
US9883583B2 (en) | 2018-01-30 |
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WO2017039830A1 (en) | 2017-03-09 |
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