JP2018532595A5 - - Google Patents

Download PDF

Info

Publication number
JP2018532595A5
JP2018532595A5 JP2018512536A JP2018512536A JP2018532595A5 JP 2018532595 A5 JP2018532595 A5 JP 2018532595A5 JP 2018512536 A JP2018512536 A JP 2018512536A JP 2018512536 A JP2018512536 A JP 2018512536A JP 2018532595 A5 JP2018532595 A5 JP 2018532595A5
Authority
JP
Japan
Prior art keywords
group
spot positions
laser
component
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018512536A
Other languages
English (en)
Japanese (ja)
Other versions
JP6921057B2 (ja
JP2018532595A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2016/050804 external-priority patent/WO2017044646A1/en
Publication of JP2018532595A publication Critical patent/JP2018532595A/ja
Publication of JP2018532595A5 publication Critical patent/JP2018532595A5/ja
Priority to JP2021122216A priority Critical patent/JP7404316B2/ja
Application granted granted Critical
Publication of JP6921057B2 publication Critical patent/JP6921057B2/ja
Priority to JP2023174408A priority patent/JP2023175958A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018512536A 2015-09-09 2016-09-08 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 Active JP6921057B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021122216A JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2023174408A JP2023175958A (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201562216102P 2015-09-09 2015-09-09
US62/216,102 2015-09-09
US201562241624P 2015-10-14 2015-10-14
US62/241,624 2015-10-14
US201562271446P 2015-12-28 2015-12-28
US62/271,446 2015-12-28
US201662294991P 2016-02-12 2016-02-12
US62/294,991 2016-02-12
US201662366984P 2016-07-26 2016-07-26
US62/366,984 2016-07-26
PCT/US2016/050804 WO2017044646A1 (en) 2015-09-09 2016-09-08 Laser processing apparatus, methods of laser-processing workpieces and related arrangements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021122216A Division JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

Publications (3)

Publication Number Publication Date
JP2018532595A JP2018532595A (ja) 2018-11-08
JP2018532595A5 true JP2018532595A5 (OSRAM) 2019-10-03
JP6921057B2 JP6921057B2 (ja) 2021-08-18

Family

ID=58240044

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018512536A Active JP6921057B2 (ja) 2015-09-09 2016-09-08 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2021122216A Active JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2023174408A Pending JP2023175958A (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021122216A Active JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2023174408A Pending JP2023175958A (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

Country Status (6)

Country Link
US (3) US11077526B2 (OSRAM)
JP (3) JP6921057B2 (OSRAM)
KR (3) KR102781391B1 (OSRAM)
CN (3) CN116213918A (OSRAM)
TW (4) TWI726909B (OSRAM)
WO (1) WO2017044646A1 (OSRAM)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
CA3017735C (en) 2016-03-19 2023-03-14 Velodyne Lidar, Inc. Integrated illumination and detection for lidar based 3-d imaging
WO2017210418A1 (en) 2016-06-01 2017-12-07 Velodyne Lidar, Inc. Multiple pixel scanning lidar
EP3548295B1 (en) * 2016-12-02 2021-08-25 Videojet Technologies Inc. A system and method for laser marking substrates
JP7290571B2 (ja) 2017-03-31 2023-06-13 ベロダイン ライダー ユーエスエー，インコーポレイテッド 統合化されたｌｉｄａｒ照明出力制御
EP3398764A1 (en) * 2017-05-03 2018-11-07 Macsa ID, S.A. Cutting module for packaging machine for sachet-type packages made from flexible film
JP2020519881A (ja) 2017-05-08 2020-07-02 ベロダイン ライダー， インク． Ｌｉｄａｒデータ収集及び制御
WO2018213294A1 (en) * 2017-05-15 2018-11-22 The Trustees Of The University Of Pennsylvania Systems and methods for laser cleaving diamonds
EP3417982A1 (de) * 2017-06-21 2018-12-26 Heraeus Deutschland GmbH & Co. KG Laserschneiden von metall-keramik-substraten
JP7023629B2 (ja) * 2017-07-07 2022-02-22 株式会社ディスコ レーザー加工装置
GB2566477A (en) * 2017-09-14 2019-03-20 Nat Univ Ireland Galway Method of processing a target material
US11258377B2 (en) * 2017-09-19 2022-02-22 The United States Of America, As Represented By The Secretary Of The Navy Perturbation measurement, correction, and inducing system adapted to provide highly accurate perturbation measurements and reduce the effects of perturbations within the system
CN111133361B (zh) * 2017-09-22 2022-06-03 伊雷克托科学工业股份有限公司 具有相位移反射器的声光系统
DE102017009001A1 (de) * 2017-09-23 2019-03-28 Hochschule Mittweida (Fh) Verwendung eines Hochleistungs-Ultrakurzpulslasers zum Materialabtrag, Verfahren zum Materialabtrag und Einrichtung zum Materialabtrag eines Festkörpers und/oder wenigstens einer darauf befindlichen Schicht
US11415675B2 (en) * 2017-10-09 2022-08-16 Luminar, Llc Lidar system with adjustable pulse period
US11415676B2 (en) 2017-10-09 2022-08-16 Luminar, Llc Interlaced scan patterns for lidar system
US11975405B2 (en) * 2017-11-20 2024-05-07 Ipg Photonics Corporation System and method laser for processing of materials
US11294041B2 (en) * 2017-12-08 2022-04-05 Velodyne Lidar Usa, Inc. Systems and methods for improving detection of a return signal in a light ranging and detection system
JP7019412B2 (ja) * 2017-12-25 2022-02-15 日本電産マシンツール株式会社 制御装置、レーザ加工機、レーザ加工機の制御方法、およびプログラム
JP7083645B2 (ja) * 2018-01-11 2022-06-13 Ｊｓｗアクティナシステム株式会社 レーザ処理装置、レーザ処理方法及び半導体装置の製造方法
JP6740267B2 (ja) * 2018-02-19 2020-08-12 ファナック株式会社 レーザ加工装置
CN112074370B (zh) * 2018-06-05 2023-03-14 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法以及使用其加工工件的方法
US11971507B2 (en) 2018-08-24 2024-04-30 Velodyne Lidar Usa, Inc. Systems and methods for mitigating optical crosstalk in a light ranging and detection system
EP3850656A4 (en) * 2018-09-10 2022-06-22 Fluidigm Canada Inc. APPARATUS AND METHOD FOR HIGH SPEED MODULATION SAMPLE IMAGING
US10712434B2 (en) * 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
DE102018133553A1 (de) * 2018-12-21 2020-06-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Gegenstand mit einem Metallsubstrat und einem Kanal im Metallsubstrat sowie Verfahren zu dessen Herstellung
EP3674427A1 (en) * 2018-12-28 2020-07-01 Etxe-Tar, S.A. Method and system for heating using an energy beam
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
US12061263B2 (en) 2019-01-07 2024-08-13 Velodyne Lidar Usa, Inc. Systems and methods for a configurable sensor system
TWI892641B (zh) * 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
US12103110B2 (en) * 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen
US12304001B2 (en) * 2019-04-02 2025-05-20 Asmpt Singapore Pte. Ltd. Optimised laser cutting
CN111822868B (zh) * 2019-04-19 2022-06-17 大族激光科技产业集团股份有限公司 激光飞行打标机、打标系统及打标方法
CN110238547B (zh) * 2019-05-09 2020-12-18 西安理工大学 一种用于测量大功率激光焦点位置的系统及测量方法
FR3096511B1 (fr) * 2019-05-22 2021-07-02 Amplitude Systemes Monture de composant optique et système de commande de faisceau lumineux associé
JP7428481B2 (ja) * 2019-06-07 2024-02-06 住友重機械工業株式会社 レーザアニール方法及びレーザ制御装置
US20220168847A1 (en) * 2019-06-10 2022-06-02 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN112091210A (zh) * 2019-06-17 2020-12-18 广东汉邦激光科技有限公司 3d激光成型装置及3d激光成型方法
DE102019116803A1 (de) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks
US10613203B1 (en) 2019-07-01 2020-04-07 Velodyne Lidar, Inc. Interference mitigation for light detection and ranging
DE102019214684A1 (de) * 2019-09-25 2021-03-25 Q.ant GmbH Verfahren zum Herstellen von Mikrostrukturen an einem optischen Kristall
US20210094232A1 (en) * 2019-09-30 2021-04-01 Ricoh Company, Ltd. Irradiation target flying apparatus, three-dimensional modeling apparatus, and irradiation target flying method
DE102019215000A1 (de) * 2019-09-30 2021-04-01 Robert Bosch Gmbh Mikroschweißverfahren flexibler und dünner Folien, bspw. für den Einsatz in elektrischen und elektronischen Vorrichtungen
US11069537B2 (en) * 2019-10-18 2021-07-20 Hamilton Sundstrand Corporation Method for delidding a hermetically sealed circuit package
US11999014B2 (en) * 2019-11-22 2024-06-04 Medtronic, Inc. Laser cutting system
CN110970794B (zh) * 2019-12-20 2020-10-30 中国科学院半导体研究所 用于提高激光器功率的声光q开关、谐振腔和脉冲激光器
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
CN115516469B (zh) 2020-03-02 2026-05-01 原子计算公司 可扩展的基于中性原子的量子计算
EP4115351A4 (en) 2020-03-02 2024-05-08 Atom Computing Inc. SCALABLE NEUTRAL ATOMIC-BASED QUANTUM COMPUTING
US12064830B2 (en) * 2020-03-12 2024-08-20 Rohr, Inc. Substrate perforation system and method using beamlets
US11194048B1 (en) 2020-05-13 2021-12-07 Luminar, Llc Lidar system with high-resolution scan pattern
CN111889457B (zh) * 2020-07-29 2021-09-03 武汉翔明激光科技有限公司 一种大幅面自动化激光清洗装置及方法
CN114592224A (zh) * 2020-12-03 2022-06-07 泰科电子(上海)有限公司 回流熔融系统和导电端子生产系统
CN112721425A (zh) * 2020-12-28 2021-04-30 淳华科技(昆山)有限公司 防焊印刷机
JP7660598B2 (ja) * 2021-01-27 2025-04-11 ギガフォトン株式会社 レーザ加工方法、及びレーザ加工システム
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
JP7594925B2 (ja) * 2021-02-05 2024-12-05 株式会社ディスコ レーザー加工装置
TWI754553B (zh) * 2021-02-25 2022-02-01 東捷科技股份有限公司 焊接設備
DE102021106769A1 (de) 2021-03-19 2022-09-22 Pulsar Photonics Gmbh Verfahren und Fertigungssystem zur Fertigung eines Flachprodukts mit einer perforierten Struktur, Flachprodukt sowie Verwendung des Flachprodukts in einem Mikrofilter
US11555895B2 (en) 2021-04-20 2023-01-17 Innovusion, Inc. Dynamic compensation to polygon and motor tolerance using galvo control profile
GB2606725B (en) * 2021-05-17 2023-11-01 Thermo Fisher Scient Ecublens Sarl ARC scanning methods for laser induced breakdown spectroscopy applications
US11662440B2 (en) * 2021-05-21 2023-05-30 Innovusion, Inc. Movement profiles for smart scanning using galvonometer mirror inside LiDAR scanner
CN117500629A (zh) * 2021-06-21 2024-02-02 伊雷克托科学工业股份有限公司 包括射束分析系统的激光加工设备以及射束特性的测量和控制方法
TWI798762B (zh) * 2021-07-22 2023-04-11 台達電子工業股份有限公司 雷射焊錫系統及其光束整形方法
CN115673453A (zh) * 2021-07-22 2023-02-03 台达电子工业股份有限公司 激光焊锡系统及其光束整形方法
IL312370A (en) 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
IT202200004085A1 (it) * 2022-03-04 2023-09-04 Taumac S R L Attrezzatura per incisione/marcatura/saldatura di pezzi, particolarmente per oreficeria, bigiotteria e meccanica, e metodo di incisione/marcatura/saldatura di tali pezzi
WO2023203614A1 (ja) * 2022-04-18 2023-10-26 ヤマハ発動機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ
CN115190697B (zh) * 2022-07-19 2023-08-08 常州海弘电子有限公司 一种印制电路板通孔与盲孔快速金属化工艺
US12276897B2 (en) 2022-09-06 2025-04-15 Orbotech Ltd. Dynamic correction for an acousto-optic deflector
JP7470764B1 (ja) * 2022-10-14 2024-04-18 株式会社アマダ レーザ加工機、レーザ加工方法、加工プログラム作成方法、及び加工プログラムの構成方法
TW202423586A (zh) * 2022-10-27 2024-06-16 美商秀拉科技股份有限公司 雷射光束成形和圖案化的雷射製造系統及其方法
EP4662027A1 (en) * 2023-02-06 2025-12-17 Electro Scientific Industries, Inc. Method and apparatus for compensating for thermally-induced beam pointing errors in a laser-processing system
TWI861714B (zh) * 2023-02-08 2024-11-11 雷傑科技股份有限公司 雷射剝離方法及雷射剝離設備
KR20240143431A (ko) * 2023-03-24 2024-10-02 주식회사 엘지에너지솔루션 레이저 절단 장치
TWI869831B (zh) * 2023-04-25 2025-01-11 聚嶸科技股份有限公司 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
TWI902558B (zh) * 2023-04-25 2025-10-21 聚嶸科技股份有限公司 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
TWI856629B (zh) * 2023-04-27 2024-09-21 新代科技股份有限公司 雷射加工系統及其加工方法
CN116833552B (zh) * 2023-04-28 2026-02-24 聚嵘科技股份有限公司 用于切割复合材料的GHz脉冲串激光光源系统与方法
CN116833551B (zh) * 2023-04-28 2026-02-24 聚嵘科技股份有限公司 用于复合材料钻孔的GHz脉冲串激光光源系统与方法
DE102024116622A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Bauteil mit einer in einem Bauteilmaterial ausgebildeten Hohlstruktur zum Führen von Fluiden
KR102881796B1 (ko) * 2023-09-07 2025-11-05 한국생산기술연구원 극초단 레이저 펄스의 빔 형상 제어에 따른 금속 표면 흑색화 제어 시스템 및 방법
KR102706001B1 (ko) * 2023-09-14 2024-09-11 (주)퀀텀플라즈마 고속 스캐닝이 가능한 대면적 레이저 가공장치 및 가공방법
DE102023210846A1 (de) 2023-11-02 2025-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zu einem Betrieb einer Bearbeitungsvorrichtung, mit zumindest einer Bearbeitungseinheit, insbesondere Laserbohreinheit
JP7725180B1 (ja) * 2023-11-15 2025-08-19 西進商事株式会社 アブレーション方法および分析方法
CN120101686A (zh) * 2023-12-05 2025-06-06 三赢科技（深圳）有限公司 三维轮廓测量系统
CN117389200A (zh) * 2023-12-08 2024-01-12 迈为技术(珠海)有限公司 基于声光偏转器的激光控制系统、方法和计算机设备
DE102023135197A1 (de) * 2023-12-14 2025-06-18 TRUMPF Laser SE DWM in SSL zur Parallelisierung
DE102024110083B4 (de) * 2024-04-11 2025-11-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zur Formkorrektur eines optischen Bauelements mittels Laserstrahlung
US20260002874A1 (en) * 2024-06-28 2026-01-01 Wolfspeed, Inc. Multi-Channel Workpiece Inspection System
US20260026272A1 (en) * 2024-07-16 2026-01-22 Tokyo Electron Limited Substrate processing system using an optical pattern
CN118950609B (zh) * 2024-08-01 2025-09-19 哈尔滨工业大学 一种激光清洗控制方法、装置、电子设备及存储介质
CN119035829B (zh) * 2024-11-01 2025-01-24 河北鼎瓷电子科技有限公司 一种陶瓷封装基板制造设备及方法
CN120297542B (zh) * 2025-06-12 2025-09-16 深圳市智鼎自动化技术有限公司 复杂曲面的激光飞行加工轨迹规划方法及装置
CN120395147B (zh) * 2025-07-03 2025-09-19 江苏中迪节能科技有限公司 一种空冷器加工用智能型自动焊接设备
CN121340310B (zh) * 2025-12-18 2026-03-03 武汉翔明激光科技有限公司 一种获得均匀激光清洗效果的激光扫描轨迹规划方法

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US479230A (en) * 1892-07-19 Compensator for signals
US4081653A (en) 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
US4328410A (en) 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
US4792930A (en) * 1987-05-29 1988-12-20 Hoya Corporation Acoustooptic device capable of internally cooling an acoustooptic element
US4912487A (en) 1988-03-25 1990-03-27 Texas Instruments Incorporated Laser scanner using focusing acousto-optic device
JPH0433788A (ja) 1990-05-25 1992-02-05 Mitsubishi Electric Corp レーザ穴明け方法
US5173441A (en) * 1991-02-08 1992-12-22 Micron Technology, Inc. Laser ablation deposition process for semiconductor manufacture
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
GB9324589D0 (en) * 1993-11-30 1994-01-19 Univ Southampton Beam shaping device
US5638267A (en) 1994-06-15 1997-06-10 Convolve, Inc. Method and apparatus for minimizing unwanted dynamics in a physical system
US5633747A (en) * 1994-12-21 1997-05-27 Tencor Instruments Variable spot-size scanning apparatus
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
EP0979398B1 (en) * 1996-06-04 2012-01-04 KLA-Tencor Corporation Optical scanning system for surface inspection
US5837962A (en) * 1996-07-15 1998-11-17 Overbeck; James W. Faster laser marker employing acousto-optic deflection
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
US5917300A (en) 1997-03-10 1999-06-29 Convolve, Inc. Method and apparatus for the control of gantry machines
US6314473B1 (en) 1998-03-05 2001-11-06 Convolve, Inc. System for removing selected unwanted frequenices in accordance with altered settings in a user interface of a data storage device
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US7014885B1 (en) * 1999-07-19 2006-03-21 The United States Of America As Represented By The Secretary Of The Navy Direct-write laser transfer and processing
SE516347C2 (sv) 1999-11-17 2001-12-17 Micronic Laser Systems Ab Laserskanningssystem och metod för mikrolitografisk skrivning
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
DE60114397T2 (de) 2000-01-11 2006-08-03 Electro Scientific Industries, Inc., Portland Verfahren und vorrichtung zur korrektur von abbe fehlern
TW504425B (en) * 2000-03-30 2002-10-01 Electro Scient Ind Inc Laser system and method for single pass micromachining of multilayer workpieces
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
DE10060407C2 (de) * 2000-12-05 2003-04-30 Lpkf Laser & Electronics Ag Vorrichtung zum Laserstrahlbohren
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US7245412B2 (en) 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
JP2003136266A (ja) 2001-10-29 2003-05-14 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
JP2003177553A (ja) * 2001-12-13 2003-06-27 Dainippon Screen Mfg Co Ltd レーザ描画方法とその装置
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
JP4270891B2 (ja) 2003-01-21 2009-06-03 三洋電機株式会社 Ｅｌ表示装置のレーザーリペア方法
US7358157B2 (en) 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
DE10249868B3 (de) * 2002-10-25 2004-04-29 Siemens Ag Verfahren zum Bohren von Löchern in einem aus Polymermaterial mit Glasfaserverstärkung gebildeten Substrat
JP4143391B2 (ja) * 2002-12-02 2008-09-03 Ｎｅｃエンジニアリング株式会社 マルチビーム・マルチヘッド描画装置
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US6809289B2 (en) * 2003-03-05 2004-10-26 The Hong Kong Polytechnic University Method of drilling a circuit board
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
CN2667723Y (zh) 2003-09-19 2004-12-29 富士康(昆山)电脑接插件有限公司 电连接器组件
JP4348199B2 (ja) * 2004-01-16 2009-10-21 日立ビアメカニクス株式会社 レーザ加工方法およびレーザ加工装置
US7133182B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems
WO2006009818A2 (en) * 2004-06-18 2006-01-26 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US7366378B2 (en) * 2004-10-29 2008-04-29 Matsushita Electric Industrial Co., Ltd. Ultrafast laser machining system and method for forming diffractive structures in optical fibers
US20060114948A1 (en) 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
WO2008157666A1 (en) * 2007-06-19 2008-12-24 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Sub-micron laser direct write
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
JP4937011B2 (ja) 2007-06-26 2012-05-23 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
EP2252426A4 (en) 2008-03-21 2014-08-06 Imra America Inc METHOD AND SYSTEMS FOR PROCESSING A LASER BASED MATERIAL
US8374206B2 (en) 2008-03-31 2013-02-12 Electro Scientific Industries, Inc. Combining multiple laser beams to form high repetition rate, high average power polarized laser beam
US8598490B2 (en) 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
US7982160B2 (en) * 2008-03-31 2011-07-19 Electro Scientific Industries, Inc. Photonic clock stabilized laser comb processing
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
EP2377375B1 (en) * 2008-12-13 2016-01-27 M-Solv Limited Method and apparatus for laser machining relatively narrow and relatively wide structures
GB0900036D0 (en) * 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
US8663754B2 (en) * 2009-03-09 2014-03-04 Imra America, Inc. Pulsed laser micro-deposition pattern formation
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US8680429B2 (en) * 2009-11-10 2014-03-25 Instrument Associates LLC Laser beam scribing system
DE102010025968B4 (de) 2010-07-02 2016-06-02 Schott Ag Erzeugung von Mikrolöchern
TWI430000B (zh) 2010-07-02 2014-03-11 Ind Tech Res Inst 平面顯示器之修補方法與系統
KR101973660B1 (ko) * 2010-10-22 2019-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
US8896909B2 (en) 2010-11-04 2014-11-25 Micronic Ab Method and device scanning a two-dimensional brush through an acousto-optic deflector (AOD) having an extended field in a scanning direction
JP2012115899A (ja) * 2010-11-09 2012-06-21 Amada Co Ltd レーザ切断加工方法及びレーザ加工装置
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
TWI608886B (zh) * 2011-07-05 2017-12-21 電子科學工業股份有限公司 用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法
DE102012207220A1 (de) * 2012-04-30 2013-10-31 Robert Bosch Gmbh Verfahren zur Bearbeitung eines Werkstücks mit Laserstrahlung
US9259802B2 (en) 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
KR20150073973A (ko) * 2012-10-22 2015-07-01 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 물품을 마킹하기 위한 방법 및 장치
KR102208818B1 (ko) * 2012-11-20 2021-01-28 삼성디스플레이 주식회사 레이저 가공 장치
CN103056517A (zh) 2012-12-28 2013-04-24 江苏大学 一种三维激光清洗装置
WO2014110276A1 (en) 2013-01-11 2014-07-17 Electro Scientific Industries, Inc. Laser pulse energy control systems and methods
DE102013201968B4 (de) 2013-02-07 2014-08-28 BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung
US9842665B2 (en) 2013-02-21 2017-12-12 Nlight, Inc. Optimization of high resolution digitally encoded laser scanners for fine feature marking
KR102245812B1 (ko) 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법
JP6516722B2 (ja) 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
KR102245810B1 (ko) 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 라우트 프로세싱을 위한 레이저 시스템들 및 방법들
KR20150126603A (ko) 2013-03-15 2015-11-12 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 테이퍼 제어를 위한 빔 각도 및 작업물 이동의 공조
WO2014153280A1 (en) * 2013-03-22 2014-09-25 Merck Sharp & Dohme Corp. 2-pyridyl carboxamide-containing spleen tyrosine kinase (syk) inhibitors
CN103418913A (zh) * 2013-08-13 2013-12-04 中国航空工业集团公司北京航空制造工程研究所 一种超短脉冲激光加工小孔装置及小孔加工方法
WO2015108991A2 (en) 2014-01-17 2015-07-23 Imra America, Inc. Laser-based modification of transparent materials
US9434006B2 (en) * 2014-09-23 2016-09-06 Attostat, Inc. Composition containing spherical and coral-shaped nanoparticles and method of making same
JP2016068149A (ja) * 2014-10-02 2016-05-09 株式会社ディスコ レーザー加工装置
EP3261796A4 (en) * 2015-02-23 2018-12-19 Electro Scientific Industries, Inc. Laser systems and methods for large area modification
KR102309213B1 (ko) * 2015-03-06 2021-10-05 인텔 코포레이션 레이저 빔 조향용 음향 광학 편향기 및 거울
CN108700661A (zh) * 2016-03-17 2018-10-23 伊雷克托科学工业股份有限公司 在镭射加工系统中的像平面的定位
CN111867842B (zh) * 2017-11-15 2021-05-25 格拉纳特研究有限公司 金属熔滴喷射系统

Similar Documents

Publication Publication Date Title
TWI718127B (zh) 用於顫化雷射射束以沿著射束軌跡在工件中形成特徵的方法
JP7404316B2 (ja) レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
CN110494255B (zh) 使用相移焦线激光加工透明工件的装置和方法
JP6773822B2 (ja) Ａｏｄラウト加工用レーザシステム及び方法
KR102705403B1 (ko) 투명 작업편의 레이저 처리의 능동적 제어
EP3313605B1 (en) Method of laser blackening of a surface, wherein the laser has a specific power density and a specific pulse duration
JP2017501884A (ja) サファイア基体をレーザによってレーザ切断する方法、および一続きの欠陥を有するエッジを有するサファイアを含む物品
Bornschlegel et al. In-situ analysis of ultrashort pulsed laser ablation with pulse bursts
JP2022536649A (ja) レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
CN104703748A (zh) 用于加工工件的方法及设备
WO2015008482A1 (ja) レーザ加工装置、レーザ加工方法、及びレーザ発振装置
KR20190025721A (ko) 작업물을 레이저 가공하는 레이저 가공 장치 및 방법
KR101897337B1 (ko) 레이저 광선이 다중으로 편향되는 기판을 레이저 가공하기 위한 방법 및 장치
CN111805094A (zh) 优化的激光切割
US20050236380A1 (en) Ultrashort pulse laser processing method
US20210331273A1 (en) Laser processing apparatus and methods of laser-processing workpieces
JP2019508256A5 (OSRAM)
JP7387791B2 (ja) レーザ加工装置
JP6944703B2 (ja) 脆性材料基板の改質層形成方法
WO2024118415A1 (en) Methods of seperating a substrate
WO2004039530A3 (de) Adaptive, rückkopplungsgesteuerte materialbearbeitung mit ultrakurzen laserpulsen
JP7096000B2 (ja) レーザ加工装置及びレーザ加工方法
JP2024504652A5 (OSRAM)
Rebentrost et al. Fundamental investigations of burst pulse laser ablation on WC-Co composites: P. Rebentrost et al.
CN114144383A (zh) 使用开放式压力组件从透明母片分离透明制品的方法