WO2004039530A3 - Adaptive, rückkopplungsgesteuerte materialbearbeitung mit ultrakurzen laserpulsen - Google Patents

Adaptive, rückkopplungsgesteuerte materialbearbeitung mit ultrakurzen laserpulsen Download PDF

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Publication number
WO2004039530A3
WO2004039530A3 PCT/DE2003/003530 DE0303530W WO2004039530A3 WO 2004039530 A3 WO2004039530 A3 WO 2004039530A3 DE 0303530 W DE0303530 W DE 0303530W WO 2004039530 A3 WO2004039530 A3 WO 2004039530A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser pulses
processing
ultra
pulses
laser
Prior art date
Application number
PCT/DE2003/003530
Other languages
English (en)
French (fr)
Other versions
WO2004039530A2 (de
Inventor
Thomas Baumert
Andreas Assion
Matthias Wollenhaupt
Original Assignee
Univ Kassel
Thomas Baumert
Andreas Assion
Matthias Wollenhaupt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kassel, Thomas Baumert, Andreas Assion, Matthias Wollenhaupt filed Critical Univ Kassel
Publication of WO2004039530A2 publication Critical patent/WO2004039530A2/de
Publication of WO2004039530A3 publication Critical patent/WO2004039530A3/de

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Die vorliegende Erfindung liegt auf dem Gebiet der Materialbearbeitung mit Laserpulsen. Sie betrifft Verfahren und Vorrichtung zur mikrostrukturierten, ablativen Bearbeitung von Material (22), wobei die Bearbeitung des Materials in einem oder mehreren aufeinander folgenden Prozessschritten durch einzelne Laserpulse (14) erfolgt. Erfindungsgemäss werden ultrakurze Laserpulse mit Hilfe eines Phasenmodulators (12) gezielt geformt, das Material (22) damit bestrahlt, und die Qualität des durch die Bestrahlung erfolgten Arbeitsprozesses computertechnisch (32) erfasst und bewertet. Dies kann beispielsweise mit Hilfe eines Signals aus der laserinduzierten breakdown-Spektroskopie (LIBS) durchgeführt werden. Erfindungsgemäss wird dieses Auswertesignal von einem ptimierungsalgorithmus bewertet, und die gewonnene Information wird direkt zur Berechnung weiterer, möglicherweise geeigneterer Laserpulsformen benutzt, die iterativ wiederum durch den computergesteuerten (34, 36) Phasenmodulator (12) eingestellt werden. Diese neuen Laserpulse (14) werden wieder auf das Material (22) gestrahlt, und zwar so, dass die gleichen Bedingungen auf dem Material (22) vorherrschen, wie bei dem vorangegangenen Puls (14). Die Iteration wird solange fortgeführt, bis ein Optimum der Effizienz bei der Bearbeitung des Materials gefunden ist.
PCT/DE2003/003530 2002-10-25 2003-10-23 Adaptive, rückkopplungsgesteuerte materialbearbeitung mit ultrakurzen laserpulsen WO2004039530A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10250015.0 2002-10-25
DE10250015A DE10250015B3 (de) 2002-10-25 2002-10-25 Adaptive, rückkopplungsgesteuerte Materialbearbeitung mit ultrakurzen Laserpulsen

Publications (2)

Publication Number Publication Date
WO2004039530A2 WO2004039530A2 (de) 2004-05-13
WO2004039530A3 true WO2004039530A3 (de) 2004-11-18

Family

ID=32185277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003530 WO2004039530A2 (de) 2002-10-25 2003-10-23 Adaptive, rückkopplungsgesteuerte materialbearbeitung mit ultrakurzen laserpulsen

Country Status (2)

Country Link
DE (1) DE10250015B3 (de)
WO (1) WO2004039530A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103900998A (zh) * 2014-03-21 2014-07-02 中国科学院近代物理研究所 精确靶点定位的激光诱导击穿光谱元素分析仪及其方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2371290C2 (ru) * 2004-06-08 2009-10-27 Таг Хойер Са Способ изготовления микро- и наномеханических компонентов, содержащий этап абляции с помощью фемтолазера
CH705707B1 (fr) * 2004-06-08 2013-05-15 Lvmh Swiss Mft Sa Procédé de fabrication de composants de transmission synchrone et asynchrone et composants de transmission synchrone et asynchrone obtenus selon ce procédé.
DE102005039833A1 (de) * 2005-08-22 2007-03-01 Rowiak Gmbh Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen
US7867688B2 (en) * 2006-05-30 2011-01-11 Eastman Kodak Company Laser ablation resist
CN100446909C (zh) * 2006-12-08 2008-12-31 华中科技大学 不锈钢悬臂梁的飞秒激光加工方法
DE102007006302A1 (de) 2007-02-08 2008-08-14 Mtu Aero Engines Gmbh Verfahren zur Oberflächenverfestigung metallischer Bauteile
DE102018120022A1 (de) 2018-08-16 2020-02-20 Günter Dittmar Verfahren zur Überwachung eines Materialbearbeitungsprozesses eines Werkstückes mit einem Laserstrahl und Vorrichtung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4320408A1 (de) * 1993-06-21 1994-12-22 Fraunhofer Ges Forschung Verfahren zur Prozeßkontrolle und -regelung bei der Oberflächenbearbeitung von Werkstücken mit gepulster Laserstrahlung
WO1995027587A1 (en) * 1994-04-08 1995-10-19 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5720894A (en) * 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
US5969335A (en) * 1996-09-20 1999-10-19 Matsushita Electric Industrial Co., Ltd. Laser control system for use in laser processing machine utilizing laser-induced plasma detecting system
WO2000067003A1 (en) * 1999-05-03 2000-11-09 The Regents Of The University Of California Composition analysis by scanning femtosecond laser ultraprobing (casflu)
US6268586B1 (en) * 1998-04-30 2001-07-31 The Regents Of The University Of California Method and apparatus for improving the quality and efficiency of ultrashort-pulse laser machining
WO2001083155A1 (de) * 2000-04-27 2001-11-08 Laser Zentrum Hannover E.V. Laser-bearbeitung von materialien
WO2002016070A2 (en) * 2000-08-21 2002-02-28 National Research Council Of Canada Methods for creating optical structures in dielectrics using controlled energy deposition from a femtosecond laser

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19717912A1 (de) * 1996-04-24 1997-11-13 Optikzentrum Nrw Gmbh Oz Verfahren zur Strukturierung von Oberflächen
WO2002061799A2 (en) * 2001-01-30 2002-08-08 Board Of Trustees Operating Michigan State University Control system and apparatus for use with laser excitation or ionization

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4320408A1 (de) * 1993-06-21 1994-12-22 Fraunhofer Ges Forschung Verfahren zur Prozeßkontrolle und -regelung bei der Oberflächenbearbeitung von Werkstücken mit gepulster Laserstrahlung
WO1995027587A1 (en) * 1994-04-08 1995-10-19 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5720894A (en) * 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
US5969335A (en) * 1996-09-20 1999-10-19 Matsushita Electric Industrial Co., Ltd. Laser control system for use in laser processing machine utilizing laser-induced plasma detecting system
US6268586B1 (en) * 1998-04-30 2001-07-31 The Regents Of The University Of California Method and apparatus for improving the quality and efficiency of ultrashort-pulse laser machining
WO2000067003A1 (en) * 1999-05-03 2000-11-09 The Regents Of The University Of California Composition analysis by scanning femtosecond laser ultraprobing (casflu)
WO2001083155A1 (de) * 2000-04-27 2001-11-08 Laser Zentrum Hannover E.V. Laser-bearbeitung von materialien
WO2002016070A2 (en) * 2000-08-21 2002-02-28 National Research Council Of Canada Methods for creating optical structures in dielectrics using controlled energy deposition from a femtosecond laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103900998A (zh) * 2014-03-21 2014-07-02 中国科学院近代物理研究所 精确靶点定位的激光诱导击穿光谱元素分析仪及其方法

Also Published As

Publication number Publication date
DE10250015B3 (de) 2004-09-16
WO2004039530A2 (de) 2004-05-13

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