JP2018530150A5 - - Google Patents

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Publication number
JP2018530150A5
JP2018530150A5 JP2018512877A JP2018512877A JP2018530150A5 JP 2018530150 A5 JP2018530150 A5 JP 2018530150A5 JP 2018512877 A JP2018512877 A JP 2018512877A JP 2018512877 A JP2018512877 A JP 2018512877A JP 2018530150 A5 JP2018530150 A5 JP 2018530150A5
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JP
Japan
Prior art keywords
sensor
sensor assembly
substrate support
support surface
disposed
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Application number
JP2018512877A
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English (en)
Japanese (ja)
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JP2018530150A (ja
JP6878413B2 (ja
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Priority claimed from US14/852,485 external-priority patent/US10879046B2/en
Application filed filed Critical
Publication of JP2018530150A publication Critical patent/JP2018530150A/ja
Publication of JP2018530150A5 publication Critical patent/JP2018530150A5/ja
Priority to JP2021075947A priority Critical patent/JP7112565B2/ja
Application granted granted Critical
Publication of JP6878413B2 publication Critical patent/JP6878413B2/ja
Priority to JP2022116938A priority patent/JP7443430B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018512877A 2015-09-11 2016-08-01 リアルタイムの力および膜応力制御を備えた基板支持体 Active JP6878413B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021075947A JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/852,485 US10879046B2 (en) 2015-09-11 2015-09-11 Substrate support with real time force and film stress control
US14/852,485 2015-09-11
PCT/US2016/044989 WO2017044201A1 (en) 2015-09-11 2016-08-01 Substrate support with real time force and film stress control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021075947A Division JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体

Publications (3)

Publication Number Publication Date
JP2018530150A JP2018530150A (ja) 2018-10-11
JP2018530150A5 true JP2018530150A5 (enExample) 2019-09-12
JP6878413B2 JP6878413B2 (ja) 2021-05-26

Family

ID=58237095

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018512877A Active JP6878413B2 (ja) 2015-09-11 2016-08-01 リアルタイムの力および膜応力制御を備えた基板支持体
JP2021075947A Active JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A Active JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021075947A Active JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A Active JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Country Status (7)

Country Link
US (4) US10879046B2 (enExample)
JP (3) JP6878413B2 (enExample)
KR (2) KR102696914B1 (enExample)
CN (3) CN117976601A (enExample)
SG (1) SG10202002453XA (enExample)
TW (3) TWI670792B (enExample)
WO (1) WO2017044201A1 (enExample)

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US10927461B2 (en) * 2018-08-31 2021-02-23 Applied Materials, Inc. Gas diffuser support structure for reduced particle generation
CN109231152B (zh) * 2018-09-30 2020-06-16 重庆大学 利用光纤Fabry-Perot干涉仪测量夹持力和夹爪位移的微夹钳
CN109129410B (zh) * 2018-09-30 2021-07-27 重庆大学 夹爪为光纤Fabry-Perot干涉仪且可夹持力自传感的微夹钳
JP7209515B2 (ja) * 2018-11-27 2023-01-20 東京エレクトロン株式会社 基板保持機構および成膜装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
CN119725065A (zh) * 2019-05-14 2025-03-28 玛特森技术公司 末端执行器和用于处理工件的系统
US11415463B2 (en) * 2019-06-04 2022-08-16 Applied Materials, Inc. Contactless workpiece temperature sensor
JP7625540B2 (ja) * 2019-06-07 2025-02-03 ラム リサーチ コーポレーション マルチステーション半導体処理における独立して調整可能な流路コンダクタンス
JP7681587B2 (ja) * 2019-11-22 2025-05-22 ラム リサーチ コーポレーション コインスロットおよびボールロックセラミックリフトピンホルダ
CN215925072U (zh) * 2020-09-24 2022-03-01 株式会社国际电气 基板处理装置
WO2022173720A1 (en) * 2021-02-09 2022-08-18 Fuse Energy Technologies Corp. Adjustable probe for plasma diagnostics
CN116917533B (zh) * 2021-02-19 2026-01-09 应用材料公司 基板支撑件、处理基板的方法、以及处理系统
US11851761B2 (en) * 2021-04-16 2023-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool
US20230141012A1 (en) * 2021-11-09 2023-05-11 Applied Materials, Inc. Pressure puck diagnostic wafer
CN116476193B (zh) * 2023-03-24 2024-01-05 上海数造机电科技股份有限公司 基于静电吸附的陶瓷3d打印构建平台、方法及系统
CN116552611B (zh) * 2023-05-11 2025-11-25 盛吉盛(宁波)半导体科技有限公司 一种用于支撑与搬运静电卡盘组件的底座工装
US12449738B2 (en) * 2023-06-20 2025-10-21 Applied Materials, Inc. Rotary substrate support for aligning a substrate
WO2025155847A1 (en) * 2024-01-18 2025-07-24 Watlow Electric Manufacturing Company Electrical termination for ceramic pedestal with embedded electrical components

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