JP2013018065A5 - - Google Patents

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Publication number
JP2013018065A5
JP2013018065A5 JP2011152022A JP2011152022A JP2013018065A5 JP 2013018065 A5 JP2013018065 A5 JP 2013018065A5 JP 2011152022 A JP2011152022 A JP 2011152022A JP 2011152022 A JP2011152022 A JP 2011152022A JP 2013018065 A5 JP2013018065 A5 JP 2013018065A5
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JP
Japan
Prior art keywords
carrier
static pressure
fixing
pin
fixed
Prior art date
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Granted
Application number
JP2011152022A
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English (en)
Japanese (ja)
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JP5627114B2 (ja
JP2013018065A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2011152022A external-priority patent/JP5627114B2/ja
Priority to JP2011152022A priority Critical patent/JP5627114B2/ja
Priority to SG2012046975A priority patent/SG187316A1/en
Priority to KR1020120069087A priority patent/KR101911553B1/ko
Priority to EP12175279.4A priority patent/EP2543475B1/en
Priority to TW101124333A priority patent/TWI604918B/zh
Publication of JP2013018065A publication Critical patent/JP2013018065A/ja
Publication of JP2013018065A5 publication Critical patent/JP2013018065A5/ja
Publication of JP5627114B2 publication Critical patent/JP5627114B2/ja
Application granted granted Critical
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JP2011152022A 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤 Active JP5627114B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤
SG2012046975A SG187316A1 (en) 2011-07-08 2012-06-22 Method for grinding thin sheet-like workpiece and double-end surface grinder
KR1020120069087A KR101911553B1 (ko) 2011-07-08 2012-06-27 박판형 워크의 연삭 방법 및 양두 평면 연삭기
TW101124333A TWI604918B (zh) 2011-07-08 2012-07-06 薄板狀工件之研磨方法及雙面平面磨床
EP12175279.4A EP2543475B1 (en) 2011-07-08 2012-07-06 Method for grinding thin sheet-like workpiece and double-end surface grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2013018065A JP2013018065A (ja) 2013-01-31
JP2013018065A5 true JP2013018065A5 (enExample) 2013-09-26
JP5627114B2 JP5627114B2 (ja) 2014-11-19

Family

ID=46507898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011152022A Active JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Country Status (5)

Country Link
EP (1) EP2543475B1 (enExample)
JP (1) JP5627114B2 (enExample)
KR (1) KR101911553B1 (enExample)
SG (1) SG187316A1 (enExample)
TW (1) TWI604918B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724958B2 (ja) * 2012-07-03 2015-05-27 信越半導体株式会社 両頭研削装置及びワークの両頭研削方法
CN104259984A (zh) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 一种往复式双端面磨床往复送料板一浮一定式装置
CN104369058A (zh) * 2014-11-27 2015-02-25 石家庄轴设机电设备有限公司 滚子双端面磨床支撑及其使用方法
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431681A (en) * 1965-07-23 1969-03-11 Landis Tool Co Work support shoe assembly
JP3673904B2 (ja) 1996-12-03 2005-07-20 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP3702379B2 (ja) 1996-12-13 2005-10-05 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP2002036078A (ja) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
JP3993856B2 (ja) * 2004-01-22 2007-10-17 光洋機械工業株式会社 両頭平面研削装置
JP4143563B2 (ja) * 2004-03-16 2008-09-03 住友重機械工業株式会社 ワーク保持装置及び両面加工装置
JP4780142B2 (ja) * 2008-05-22 2011-09-28 信越半導体株式会社 ウェーハの製造方法
JP2010042488A (ja) * 2008-08-15 2010-02-25 Mori Seiki Co Ltd ワーク受け及びこれを備えた研削盤

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