KR101911553B1 - 박판형 워크의 연삭 방법 및 양두 평면 연삭기 - Google Patents

박판형 워크의 연삭 방법 및 양두 평면 연삭기 Download PDF

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Publication number
KR101911553B1
KR101911553B1 KR1020120069087A KR20120069087A KR101911553B1 KR 101911553 B1 KR101911553 B1 KR 101911553B1 KR 1020120069087 A KR1020120069087 A KR 1020120069087A KR 20120069087 A KR20120069087 A KR 20120069087A KR 101911553 B1 KR101911553 B1 KR 101911553B1
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South Korea
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carrier
static pressure
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carrier ring
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Korean (ko)
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KR20130006303A (ko
Inventor
아츠시 시바나카
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고요 기카이 고교 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020120069087A 2011-07-08 2012-06-27 박판형 워크의 연삭 방법 및 양두 평면 연삭기 Active KR101911553B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-152022 2011-07-08
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
KR20130006303A KR20130006303A (ko) 2013-01-16
KR101911553B1 true KR101911553B1 (ko) 2018-10-24

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Application Number Title Priority Date Filing Date
KR1020120069087A Active KR101911553B1 (ko) 2011-07-08 2012-06-27 박판형 워크의 연삭 방법 및 양두 평면 연삭기

Country Status (5)

Country Link
EP (1) EP2543475B1 (enExample)
JP (1) JP5627114B2 (enExample)
KR (1) KR101911553B1 (enExample)
SG (1) SG187316A1 (enExample)
TW (1) TWI604918B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724958B2 (ja) * 2012-07-03 2015-05-27 信越半導体株式会社 両頭研削装置及びワークの両頭研削方法
CN104259984A (zh) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 一种往复式双端面磨床往复送料板一浮一定式装置
CN104369058A (zh) * 2014-11-27 2015-02-25 石家庄轴设机电设备有限公司 滚子双端面磨床支撑及其使用方法
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009279704A (ja) * 2008-05-22 2009-12-03 Shin Etsu Handotai Co Ltd 両頭研削装置及びウェーハの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431681A (en) * 1965-07-23 1969-03-11 Landis Tool Co Work support shoe assembly
JP3673904B2 (ja) 1996-12-03 2005-07-20 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP3702379B2 (ja) 1996-12-13 2005-10-05 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP2002036078A (ja) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
JP3993856B2 (ja) * 2004-01-22 2007-10-17 光洋機械工業株式会社 両頭平面研削装置
JP4143563B2 (ja) * 2004-03-16 2008-09-03 住友重機械工業株式会社 ワーク保持装置及び両面加工装置
JP2010042488A (ja) * 2008-08-15 2010-02-25 Mori Seiki Co Ltd ワーク受け及びこれを備えた研削盤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009279704A (ja) * 2008-05-22 2009-12-03 Shin Etsu Handotai Co Ltd 両頭研削装置及びウェーハの製造方法

Also Published As

Publication number Publication date
EP2543475A3 (en) 2017-01-04
JP5627114B2 (ja) 2014-11-19
KR20130006303A (ko) 2013-01-16
JP2013018065A (ja) 2013-01-31
TWI604918B (zh) 2017-11-11
EP2543475B1 (en) 2019-03-27
EP2543475A2 (en) 2013-01-09
TW201313386A (zh) 2013-04-01
SG187316A1 (en) 2013-02-28

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