JP5627114B2 - 薄板状ワークの研削方法及び両頭平面研削盤 - Google Patents

薄板状ワークの研削方法及び両頭平面研削盤 Download PDF

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Publication number
JP5627114B2
JP5627114B2 JP2011152022A JP2011152022A JP5627114B2 JP 5627114 B2 JP5627114 B2 JP 5627114B2 JP 2011152022 A JP2011152022 A JP 2011152022A JP 2011152022 A JP2011152022 A JP 2011152022A JP 5627114 B2 JP5627114 B2 JP 5627114B2
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Japan
Prior art keywords
carrier
static pressure
carrier ring
ring
guide
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JP2011152022A
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English (en)
Japanese (ja)
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JP2013018065A (ja
JP2013018065A5 (enExample
Inventor
篤志 芝中
篤志 芝中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Priority to JP2011152022A priority Critical patent/JP5627114B2/ja
Priority to SG2012046975A priority patent/SG187316A1/en
Priority to KR1020120069087A priority patent/KR101911553B1/ko
Priority to TW101124333A priority patent/TWI604918B/zh
Priority to EP12175279.4A priority patent/EP2543475B1/en
Publication of JP2013018065A publication Critical patent/JP2013018065A/ja
Publication of JP2013018065A5 publication Critical patent/JP2013018065A5/ja
Application granted granted Critical
Publication of JP5627114B2 publication Critical patent/JP5627114B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011152022A 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤 Active JP5627114B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤
SG2012046975A SG187316A1 (en) 2011-07-08 2012-06-22 Method for grinding thin sheet-like workpiece and double-end surface grinder
KR1020120069087A KR101911553B1 (ko) 2011-07-08 2012-06-27 박판형 워크의 연삭 방법 및 양두 평면 연삭기
TW101124333A TWI604918B (zh) 2011-07-08 2012-07-06 薄板狀工件之研磨方法及雙面平面磨床
EP12175279.4A EP2543475B1 (en) 2011-07-08 2012-07-06 Method for grinding thin sheet-like workpiece and double-end surface grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2013018065A JP2013018065A (ja) 2013-01-31
JP2013018065A5 JP2013018065A5 (enExample) 2013-09-26
JP5627114B2 true JP5627114B2 (ja) 2014-11-19

Family

ID=46507898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011152022A Active JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Country Status (5)

Country Link
EP (1) EP2543475B1 (enExample)
JP (1) JP5627114B2 (enExample)
KR (1) KR101911553B1 (enExample)
SG (1) SG187316A1 (enExample)
TW (1) TWI604918B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724958B2 (ja) * 2012-07-03 2015-05-27 信越半導体株式会社 両頭研削装置及びワークの両頭研削方法
CN104259984A (zh) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 一种往复式双端面磨床往复送料板一浮一定式装置
CN104369058A (zh) * 2014-11-27 2015-02-25 石家庄轴设机电设备有限公司 滚子双端面磨床支撑及其使用方法
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431681A (en) * 1965-07-23 1969-03-11 Landis Tool Co Work support shoe assembly
JP3673904B2 (ja) 1996-12-03 2005-07-20 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP3702379B2 (ja) 1996-12-13 2005-10-05 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP2002036078A (ja) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
JP3993856B2 (ja) * 2004-01-22 2007-10-17 光洋機械工業株式会社 両頭平面研削装置
JP4143563B2 (ja) * 2004-03-16 2008-09-03 住友重機械工業株式会社 ワーク保持装置及び両面加工装置
JP4780142B2 (ja) * 2008-05-22 2011-09-28 信越半導体株式会社 ウェーハの製造方法
JP2010042488A (ja) * 2008-08-15 2010-02-25 Mori Seiki Co Ltd ワーク受け及びこれを備えた研削盤

Also Published As

Publication number Publication date
EP2543475A3 (en) 2017-01-04
KR101911553B1 (ko) 2018-10-24
KR20130006303A (ko) 2013-01-16
JP2013018065A (ja) 2013-01-31
TWI604918B (zh) 2017-11-11
EP2543475B1 (en) 2019-03-27
EP2543475A2 (en) 2013-01-09
TW201313386A (zh) 2013-04-01
SG187316A1 (en) 2013-02-28

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