EP2543475A3 - Method for grinding thin sheet-like workpiece and double-end surface grinder - Google Patents

Method for grinding thin sheet-like workpiece and double-end surface grinder Download PDF

Info

Publication number
EP2543475A3
EP2543475A3 EP12175279.4A EP12175279A EP2543475A3 EP 2543475 A3 EP2543475 A3 EP 2543475A3 EP 12175279 A EP12175279 A EP 12175279A EP 2543475 A3 EP2543475 A3 EP 2543475A3
Authority
EP
European Patent Office
Prior art keywords
carrier
workpiece
static pressure
double
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12175279.4A
Other languages
German (de)
French (fr)
Other versions
EP2543475A2 (en
EP2543475B1 (en
Inventor
Atsushi Shibanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Publication of EP2543475A2 publication Critical patent/EP2543475A2/en
Publication of EP2543475A3 publication Critical patent/EP2543475A3/en
Application granted granted Critical
Publication of EP2543475B1 publication Critical patent/EP2543475B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Abstract

[Object] To reduce influences of external forces that are to be applied to a carrier ring and improve workpiece grinding precision, and maintain high grinding precision over a long period of time without problems such as wear, etc.
[Solution Means] In a double-end surface grinder that grinds both surfaces of a thin sheet-like workpiece W by a pair of grinding wheels 3 while rotating the workpiece W via a carrier 4 in a state where the workpiece W fitted to the carrier 4 is supported by static pressures of a pair of static pressure pads 1 in a non-contact manner, a plurality of static pressure carrier guides 6a and 6b that support a carrier ring 5 on the outer periphery of the carrier 4 by static pressures in a non-contact manner are provided in the circumferential direction. The carrier ring 5 has a cylindrical outer peripheral surface 12, and in proximity to the outer peripheral surface 12, static pressure carrier guides 6a and 6b are disposed at substantially even intervals. The static pressure carrier guides 6a and 6b may be fixed or floatable.
EP12175279.4A 2011-07-08 2012-07-06 Method for grinding thin sheet-like workpiece and double-end surface grinder Active EP2543475B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (en) 2011-07-08 2011-07-08 Thin plate workpiece grinding method and double-head surface grinding machine

Publications (3)

Publication Number Publication Date
EP2543475A2 EP2543475A2 (en) 2013-01-09
EP2543475A3 true EP2543475A3 (en) 2017-01-04
EP2543475B1 EP2543475B1 (en) 2019-03-27

Family

ID=46507898

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12175279.4A Active EP2543475B1 (en) 2011-07-08 2012-07-06 Method for grinding thin sheet-like workpiece and double-end surface grinder

Country Status (5)

Country Link
EP (1) EP2543475B1 (en)
JP (1) JP5627114B2 (en)
KR (1) KR101911553B1 (en)
SG (1) SG187316A1 (en)
TW (1) TWI604918B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724958B2 (en) * 2012-07-03 2015-05-27 信越半導体株式会社 Double-head grinding apparatus and double-head grinding method for workpiece
CN104259984A (en) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 Floating and fixing device for reciprocating feed plate of reciprocating parallel surface grinding machine
CN104369058A (en) * 2014-11-27 2015-02-25 石家庄轴设机电设备有限公司 Roller parallel surface grinding machine support and application method thereof
CN115741453B (en) * 2022-11-30 2024-02-27 大连理工大学 Intelligent double-sided grinder with multiple fused sensors

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036078A (en) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd Double face grinding device for thin disk work
US20110039476A1 (en) * 2008-05-22 2011-02-17 Shin-Etsu Handotai Co., Ltd. Double-disc grinding apparatus and method for producing wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431681A (en) * 1965-07-23 1969-03-11 Landis Tool Co Work support shoe assembly
JP3673904B2 (en) 1996-12-03 2005-07-20 光洋機械工業株式会社 Double-side grinding machine for thin disk-shaped workpieces
JP3702379B2 (en) 1996-12-13 2005-10-05 光洋機械工業株式会社 Double-side grinding machine for thin disk-shaped workpieces
JP3993856B2 (en) * 2004-01-22 2007-10-17 光洋機械工業株式会社 Double-head surface grinding machine
JP4143563B2 (en) * 2004-03-16 2008-09-03 住友重機械工業株式会社 Work holding device and double-sided processing device
JP2010042488A (en) * 2008-08-15 2010-02-25 Mori Seiki Co Ltd Workpiece receiver and grinding machine including the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036078A (en) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd Double face grinding device for thin disk work
US20110039476A1 (en) * 2008-05-22 2011-02-17 Shin-Etsu Handotai Co., Ltd. Double-disc grinding apparatus and method for producing wafer

Also Published As

Publication number Publication date
JP2013018065A (en) 2013-01-31
TWI604918B (en) 2017-11-11
SG187316A1 (en) 2013-02-28
KR101911553B1 (en) 2018-10-24
KR20130006303A (en) 2013-01-16
JP5627114B2 (en) 2014-11-19
EP2543475A2 (en) 2013-01-09
TW201313386A (en) 2013-04-01
EP2543475B1 (en) 2019-03-27

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