|
US3360198A
(en)
|
1966-05-27 |
1967-12-26 |
Robertshaw Controls Co |
Pressure regulator for diaphragm gas valves
|
|
US3584785A
(en)
*
|
1969-03-24 |
1971-06-15 |
Garrett Corp |
Electronic anti-ice control
|
|
US3654948A
(en)
|
1970-11-02 |
1972-04-11 |
Honeywell Inc |
Balanced pressure regulator
|
|
CA973138A
(en)
*
|
1972-04-01 |
1975-08-19 |
Hisashi Motoyama |
Automatic temperature and humidity regulating apparatus
|
|
JPS48100747A
(enExample)
*
|
1972-04-01 |
1973-12-19 |
|
|
|
US4410030A
(en)
*
|
1972-10-04 |
1983-10-18 |
Skala Stephen F |
Pressure cooker with regulated vapor pressure
|
|
US4015615A
(en)
*
|
1975-06-13 |
1977-04-05 |
International Business Machines Corporation |
Fluid application system
|
|
US4090248A
(en)
*
|
1975-10-24 |
1978-05-16 |
Powers Regulator Company |
Supervisory and control system for environmental conditioning equipment
|
|
JPS604546B2
(ja)
*
|
1975-11-04 |
1985-02-05 |
ヴアルツ アルフレート |
放電燈ならびにその製造方法
|
|
US4535222A
(en)
*
|
1976-02-05 |
1985-08-13 |
Rockwell International Corporation |
Temperature control system
|
|
US4319628A
(en)
*
|
1979-07-13 |
1982-03-16 |
Southern California Gas Company |
Two liquid heat exchange system and safety valve to prevent contamination
|
|
US4367699A
(en)
*
|
1981-01-27 |
1983-01-11 |
Evc Associates Limited Partnership |
Boiling liquid engine cooling system
|
|
US4997677A
(en)
*
|
1987-08-31 |
1991-03-05 |
Massachusetts Institute Of Technology |
Vapor phase reactor for making multilayer structures
|
|
US4998862A
(en)
|
1989-10-02 |
1991-03-12 |
Ingersoll-Rand Company |
Air compressor pressure regulating valve system
|
|
US5072781A
(en)
*
|
1990-07-30 |
1991-12-17 |
United Technologies Corporation |
Temperature control system
|
|
US5761023A
(en)
*
|
1996-04-25 |
1998-06-02 |
Applied Materials, Inc. |
Substrate support with pressure zones having reduced contact area and temperature feedback
|
|
US5911833A
(en)
*
|
1997-01-15 |
1999-06-15 |
Lam Research Corporation |
Method of in-situ cleaning of a chuck within a plasma chamber
|
|
EP0976013B1
(de)
|
1997-04-18 |
2003-02-12 |
ZF FRIEDRICHSHAFEN Aktiengesellschaft |
Druckregelventil
|
|
NL1006040C2
(nl)
*
|
1997-05-13 |
1998-11-16 |
Spray Systems Europ Agrima Sse |
Luchtbevochtigingssysteem, werkwijze voor het bedrijven daarvan, alsmede toepassing daarvan voor het conditioneren van de lucht in een verf- of lakcabine.
|
|
JP3796332B2
(ja)
*
|
1997-09-29 |
2006-07-12 |
シーケーディ株式会社 |
ミキシングによる純水温度の制御装置
|
|
JP3276936B2
(ja)
*
|
1998-12-25 |
2002-04-22 |
アドバンス電気工業株式会社 |
流量コントロールバルブ
|
|
DE20004366U1
(de)
*
|
2000-03-10 |
2000-10-12 |
Heraeus Noblelight Gmbh, 63450 Hanau |
Strahlermodul zum Einsatz in ein Lampengehäuse
|
|
JP3921913B2
(ja)
*
|
2000-03-13 |
2007-05-30 |
株式会社日立製作所 |
ウエハ処理装置およびウエハ製造方法
|
|
US6353210B1
(en)
*
|
2000-04-11 |
2002-03-05 |
Applied Materials Inc. |
Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using and in-situ wafer temperature optical probe
|
|
US6905792B2
(en)
*
|
2000-10-13 |
2005-06-14 |
Honda Giken Kogyo Kabushiki Kaisha |
Cooling system and cooling process of fuel cell
|
|
JP4731027B2
(ja)
*
|
2001-03-15 |
2011-07-20 |
旭有機材工業株式会社 |
調節弁
|
|
US6739033B2
(en)
*
|
2001-03-29 |
2004-05-25 |
Scimed Life Systems, Inc. |
Thermal regulation of a coated work-piece during the reconfiguration of the coated work-piece
|
|
US20030001510A1
(en)
*
|
2001-06-27 |
2003-01-02 |
Christian Vahab |
Magneto-hydrodynamic power cell using atomic conversion of energy, plasma and field ionization
|
|
US7198073B2
(en)
*
|
2002-07-26 |
2007-04-03 |
Gfi, Innovations |
Methodology and apparatus for storing and dispensing liquid components to create custom formulations
|
|
DE10244527B4
(de)
*
|
2002-09-25 |
2013-05-08 |
Zf Friedrichshafen Ag |
Proportional-Druckregelventil
|
|
AU2003300845B2
(en)
*
|
2002-12-09 |
2008-04-10 |
Hudson Technologies, Inc. |
Method and apparatus for optimizing refrigeration systems
|
|
JP3801570B2
(ja)
|
2003-02-24 |
2006-07-26 |
Ｓｍｃ株式会社 |
流量制御装置
|
|
US20040261712A1
(en)
*
|
2003-04-25 |
2004-12-30 |
Daisuke Hayashi |
Plasma processing apparatus
|
|
CN100454200C
(zh)
*
|
2003-06-09 |
2009-01-21 |
喜开理株式会社 |
相对压力控制系统和相对流量控制系统
|
|
US7237578B2
(en)
*
|
2004-07-21 |
2007-07-03 |
Nordson Corporation |
Rechargeable dispensing head
|
|
US7115833B2
(en)
*
|
2004-11-03 |
2006-10-03 |
The Esab Group, Inc. |
Metering system and method for supplying gas to a torch
|
|
KR20070089197A
(ko)
*
|
2004-11-22 |
2007-08-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
배치 처리 챔버를 사용한 기판 처리 기기
|
|
US7435447B2
(en)
*
|
2005-02-15 |
2008-10-14 |
Tokyo Electron Limited |
Method and system for determining flow conditions in a high pressure processing system
|
|
US20060255012A1
(en)
*
|
2005-05-10 |
2006-11-16 |
Gunilla Jacobson |
Removal of particles from substrate surfaces using supercritical processing
|
|
JP2007024069A
(ja)
*
|
2005-07-12 |
2007-02-01 |
Advance Denki Kogyo Kk |
空圧式流量調節弁
|
|
US8092638B2
(en)
*
|
2005-10-11 |
2012-01-10 |
Applied Materials Inc. |
Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution
|
|
JP4694341B2
(ja)
*
|
2005-10-13 |
2011-06-08 |
シーケーディ株式会社 |
流体制御弁
|
|
JP4854317B2
(ja)
*
|
2006-01-31 |
2012-01-18 |
東京エレクトロン株式会社 |
基板処理方法
|
|
JP4933789B2
(ja)
*
|
2006-02-13 |
2012-05-16 |
東京エレクトロン株式会社 |
基板処理装置、基板処理方法及び記憶媒体
|
|
US8343280B2
(en)
*
|
2006-03-28 |
2013-01-01 |
Tokyo Electron Limited |
Multi-zone substrate temperature control system and method of operating
|
|
JP4668119B2
(ja)
*
|
2006-05-08 |
2011-04-13 |
シーケーディ株式会社 |
流量制御装置
|
|
US7841385B2
(en)
*
|
2006-06-26 |
2010-11-30 |
International Business Machines Corporation |
Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
|
|
US8151872B2
(en)
*
|
2007-03-16 |
2012-04-10 |
Centipede Systems, Inc. |
Method and apparatus for controlling temperature
|
|
US20090095221A1
(en)
*
|
2007-10-16 |
2009-04-16 |
Alexander Tam |
Multi-gas concentric injection showerhead
|
|
US7976631B2
(en)
*
|
2007-10-16 |
2011-07-12 |
Applied Materials, Inc. |
Multi-gas straight channel showerhead
|
|
PL2215406T3
(pl)
*
|
2007-10-22 |
2018-03-30 |
Bertelli & Partners S.R.L. |
Urządzenie z wielofunkcyjnym zaworem bezpieczeństwa z wbudowanym proporcjonalnym regulatorem ciśnienia
|
|
US7972444B2
(en)
*
|
2007-11-07 |
2011-07-05 |
Mattson Technology, Inc. |
Workpiece support with fluid zones for temperature control
|
|
WO2009085672A2
(en)
*
|
2007-12-21 |
2009-07-09 |
Lam Research Corporation |
Fabrication of a silicon structure and deep silicon etch with profile control
|
|
JP5200551B2
(ja)
*
|
2008-01-18 |
2013-06-05 |
東京エレクトロン株式会社 |
気化原料供給装置、成膜装置及び気化原料供給方法
|
|
JP2009202921A
(ja)
*
|
2008-02-29 |
2009-09-10 |
Atsense Inc |
燃料混合装置
|
|
US8726838B2
(en)
|
2010-03-31 |
2014-05-20 |
Intermolecular, Inc. |
Combinatorial plasma enhanced deposition and etch techniques
|
|
US8532832B2
(en)
|
2008-09-23 |
2013-09-10 |
Be Aerospace, Inc. |
Method and apparatus for thermal exchange with two-phase media
|
|
US20100116788A1
(en)
*
|
2008-11-12 |
2010-05-13 |
Lam Research Corporation |
Substrate temperature control by using liquid controlled multizone substrate support
|
|
DE102008062290A1
(de)
*
|
2008-12-15 |
2010-06-24 |
Abb Technology Ag |
Verfahren zur Diagnose des Verschleißzustandes einer Ventilanordnung zur Steuerung eines Prozessmediumflusses
|
|
KR101691044B1
(ko)
*
|
2009-02-04 |
2016-12-29 |
맷슨 테크놀로지, 인크. |
기판의 표면에 걸친 온도 프로파일을 방사상으로 튜닝하는 정전 척 시스템 및 방법
|
|
US7985188B2
(en)
*
|
2009-05-13 |
2011-07-26 |
Cv Holdings Llc |
Vessel, coating, inspection and processing apparatus
|
|
US8278224B1
(en)
*
|
2009-09-24 |
2012-10-02 |
Novellus Systems, Inc. |
Flowable oxide deposition using rapid delivery of process gases
|
|
US8361231B2
(en)
*
|
2009-09-30 |
2013-01-29 |
Ckd Corporation |
Liquid vaporization system
|
|
JP5519992B2
(ja)
*
|
2009-10-14 |
2014-06-11 |
東京エレクトロン株式会社 |
基板載置台の温度制御システム及びその温度制御方法
|
|
US8742665B2
(en)
*
|
2009-11-18 |
2014-06-03 |
Applied Materials, Inc. |
Plasma source design
|
|
JP5490659B2
(ja)
*
|
2009-12-09 |
2014-05-14 |
東京エレクトロン株式会社 |
基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体
|
|
US9338871B2
(en)
|
2010-01-29 |
2016-05-10 |
Applied Materials, Inc. |
Feedforward temperature control for plasma processing apparatus
|
|
US8916793B2
(en)
*
|
2010-06-08 |
2014-12-23 |
Applied Materials, Inc. |
Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
|
|
WO2011149615A2
(en)
*
|
2010-05-24 |
2011-12-01 |
Applied Materials, Inc. |
Hybrid hotwire chemical vapor deposition and plasma enhanced chemical vapor deposition method and apparatus
|
|
US8410393B2
(en)
*
|
2010-05-24 |
2013-04-02 |
Lam Research Corporation |
Apparatus and method for temperature control of a semiconductor substrate support
|
|
US8847103B2
(en)
*
|
2010-07-16 |
2014-09-30 |
Hypertherm, Inc. |
Electronic pressure regulator
|
|
US8580693B2
(en)
|
2010-08-27 |
2013-11-12 |
Applied Materials, Inc. |
Temperature enhanced electrostatic chucking in plasma processing apparatus
|
|
US9719169B2
(en)
*
|
2010-12-20 |
2017-08-01 |
Novellus Systems, Inc. |
System and apparatus for flowable deposition in semiconductor fabrication
|
|
JP5703038B2
(ja)
*
|
2011-01-26 |
2015-04-15 |
株式会社日立ハイテクノロジーズ |
プラズマ処理装置
|
|
CN103123906A
(zh)
|
2011-11-18 |
2013-05-29 |
中芯国际集成电路制造(北京)有限公司 |
用于处理晶圆的反应装置、静电吸盘和晶圆温度控制方法
|
|
US10537013B2
(en)
|
2012-04-23 |
2020-01-14 |
Applied Materials, Inc. |
Distributed electro-static chuck cooling
|
|
TW201422155A
(zh)
*
|
2012-07-06 |
2014-06-16 |
Arigos Biomedical Inc |
以氣體灌注快速冷卻與升溫預防玻璃質化組織受熱-力破壞的方法與裝置
|
|
US9916967B2
(en)
*
|
2013-03-13 |
2018-03-13 |
Applied Materials, Inc. |
Fast response fluid control system
|
|
JP6287139B2
(ja)
*
|
2013-12-04 |
2018-03-07 |
富士通株式会社 |
電子システム及び電子システムの制御方法
|
|
US10079165B2
(en)
*
|
2014-05-20 |
2018-09-18 |
Applied Materials, Inc. |
Electrostatic chuck with independent zone cooling and reduced crosstalk
|