JP2014522574A5 - - Google Patents

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Publication number
JP2014522574A5
JP2014522574A5 JP2014513530A JP2014513530A JP2014522574A5 JP 2014522574 A5 JP2014522574 A5 JP 2014522574A5 JP 2014513530 A JP2014513530 A JP 2014513530A JP 2014513530 A JP2014513530 A JP 2014513530A JP 2014522574 A5 JP2014522574 A5 JP 2014522574A5
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JP
Japan
Prior art keywords
fluid
substrate
substrate support
ports
support body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014513530A
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English (en)
Japanese (ja)
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JP6091496B2 (ja
JP2014522574A (ja
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Publication date
Priority claimed from US13/152,157 external-priority patent/US20120309115A1/en
Application filed filed Critical
Publication of JP2014522574A publication Critical patent/JP2014522574A/ja
Publication of JP2014522574A5 publication Critical patent/JP2014522574A5/ja
Application granted granted Critical
Publication of JP6091496B2 publication Critical patent/JP6091496B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014513530A 2011-06-02 2012-05-11 基板を支持および制御する装置および方法 Active JP6091496B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/152,157 2011-06-02
US13/152,157 US20120309115A1 (en) 2011-06-02 2011-06-02 Apparatus and methods for supporting and controlling a substrate
PCT/US2012/037473 WO2012166322A1 (en) 2011-06-02 2012-05-11 Apparatus and methods for supporting and controlling a substrate

Publications (3)

Publication Number Publication Date
JP2014522574A JP2014522574A (ja) 2014-09-04
JP2014522574A5 true JP2014522574A5 (enExample) 2015-07-02
JP6091496B2 JP6091496B2 (ja) 2017-03-08

Family

ID=47259736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014513530A Active JP6091496B2 (ja) 2011-06-02 2012-05-11 基板を支持および制御する装置および方法

Country Status (6)

Country Link
US (1) US20120309115A1 (enExample)
JP (1) JP6091496B2 (enExample)
KR (1) KR102007994B1 (enExample)
CN (1) CN103582941B (enExample)
TW (1) TWI587366B (enExample)
WO (1) WO2012166322A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011055061A1 (de) * 2011-11-04 2013-05-08 Aixtron Se CVD-Reaktor bzw. Substrathalter für einen CVD-Reaktor
WO2013162842A1 (en) * 2012-04-25 2013-10-31 Applied Materials, Inc. Wafer edge measurement and control
KR101543690B1 (ko) * 2014-01-29 2015-08-21 세메스 주식회사 기판처리장치 및 방법
CN107667418B (zh) * 2015-06-05 2022-03-01 应用材料公司 用于降低基板温度非均匀性的改良式装置
JP2019075477A (ja) * 2017-10-17 2019-05-16 株式会社ディスコ チャックテーブル機構
JP7178177B2 (ja) * 2018-03-22 2022-11-25 東京エレクトロン株式会社 基板処理装置
WO2019231614A1 (en) * 2018-05-31 2019-12-05 Applied Materials, Inc. Extreme uniformity heated substrate support assembly
US12437979B2 (en) * 2020-03-06 2025-10-07 Applied Materials, Inc. Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring
TWI869928B (zh) * 2020-03-20 2025-01-11 荷蘭商Ａｓｍｌ荷蘭公司 用於檢查晶圓之系統及其相關非暫時性電腦可讀媒體
KR102831548B1 (ko) * 2020-07-20 2025-07-10 세메스 주식회사 지지 유닛 및 이를 이용한 기판 리프팅 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW262566B (enExample) * 1993-07-02 1995-11-11 Tokyo Electron Co Ltd
US5558111A (en) * 1995-02-02 1996-09-24 International Business Machines Corporation Apparatus and method for carrier backing film reconditioning
US6183565B1 (en) * 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
JP4151749B2 (ja) * 1998-07-16 2008-09-17 東京エレクトロンＡｔ株式会社 プラズマ処理装置およびその方法
KR100412262B1 (ko) * 2001-01-31 2003-12-31 삼성전자주식회사 베이크 장치
US20020144786A1 (en) * 2001-04-05 2002-10-10 Angstron Systems, Inc. Substrate temperature control in an ALD reactor
WO2002101806A1 (de) * 2001-06-08 2002-12-19 Aixtron Ag Verfahren und vorrichtung zur kurzzeitigen thermischen behandlung von flachen g egenständen
KR20070006768A (ko) * 2004-03-17 2007-01-11 코레플로우 사이언티픽 솔루션스 리미티드 비접촉 열 플랫폼
EP1776300A4 (en) * 2004-04-14 2011-05-11 Coreflow Scient Solutions Ltd CONTACTLESS SUPPORT PLATFORMS FOR SPACING ADJUSTMENT
JP4485374B2 (ja) * 2005-01-25 2010-06-23 東京エレクトロン株式会社 冷却処理装置
DE102006018514A1 (de) * 2006-04-21 2007-10-25 Aixtron Ag Vorrichtung und Verfahren zur Steuerung der Oberflächentemperatur eines Substrates in einer Prozesskammer
WO2008112673A2 (en) * 2007-03-12 2008-09-18 Tokyo Electron Limited Dynamic temperature backside gas control for improved within-substrate processing uniformity
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
KR100877102B1 (ko) * 2007-05-28 2009-01-09 주식회사 하이닉스반도체 열처리 장치 및 이를 이용한 열처리 방법
TWI505370B (zh) * 2008-11-06 2015-10-21 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
US8388853B2 (en) * 2009-02-11 2013-03-05 Applied Materials, Inc. Non-contact substrate processing
US20110061810A1 (en) * 2009-09-11 2011-03-17 Applied Materials, Inc. Apparatus and Methods for Cyclical Oxidation and Etching
KR101084235B1 (ko) * 2009-12-15 2011-11-16 삼성모바일디스플레이주식회사 비정질 실리콘 결정화 장치

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