JP6091496B2 - 基板を支持および制御する装置および方法 - Google Patents

基板を支持および制御する装置および方法 Download PDF

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Publication number
JP6091496B2
JP6091496B2 JP2014513530A JP2014513530A JP6091496B2 JP 6091496 B2 JP6091496 B2 JP 6091496B2 JP 2014513530 A JP2014513530 A JP 2014513530A JP 2014513530 A JP2014513530 A JP 2014513530A JP 6091496 B2 JP6091496 B2 JP 6091496B2
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Prior art keywords
substrate
fluid
substrate support
support body
profile
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JP2014513530A
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Japanese (ja)
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JP2014522574A5 (enExample
JP2014522574A (ja
Inventor
ブレイク クールメル，
ブレイク クールメル，
ジョゼフ エム． ラニッシュ，
ジョゼフ エム． ラニッシュ，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014513530A 2011-06-02 2012-05-11 基板を支持および制御する装置および方法 Active JP6091496B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/152,157 2011-06-02
US13/152,157 US20120309115A1 (en) 2011-06-02 2011-06-02 Apparatus and methods for supporting and controlling a substrate
PCT/US2012/037473 WO2012166322A1 (en) 2011-06-02 2012-05-11 Apparatus and methods for supporting and controlling a substrate

Publications (3)

Publication Number Publication Date
JP2014522574A JP2014522574A (ja) 2014-09-04
JP2014522574A5 JP2014522574A5 (enExample) 2015-07-02
JP6091496B2 true JP6091496B2 (ja) 2017-03-08

Family

ID=47259736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014513530A Active JP6091496B2 (ja) 2011-06-02 2012-05-11 基板を支持および制御する装置および方法

Country Status (6)

Country Link
US (1) US20120309115A1 (enExample)
JP (1) JP6091496B2 (enExample)
KR (1) KR102007994B1 (enExample)
CN (1) CN103582941B (enExample)
TW (1) TWI587366B (enExample)
WO (1) WO2012166322A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011055061A1 (de) * 2011-11-04 2013-05-08 Aixtron Se CVD-Reaktor bzw. Substrathalter für einen CVD-Reaktor
CN104137249B (zh) * 2012-04-25 2017-11-14 应用材料公司 晶片边缘的测量和控制
KR101543690B1 (ko) * 2014-01-29 2015-08-21 세메스 주식회사 기판처리장치 및 방법
KR102323363B1 (ko) * 2015-06-05 2021-11-09 어플라이드 머티어리얼스, 인코포레이티드 기판 온도 불균일성을 감소시키기 위한 개선된 장치
JP2019075477A (ja) * 2017-10-17 2019-05-16 株式会社ディスコ チャックテーブル機構
JP7178177B2 (ja) * 2018-03-22 2022-11-25 東京エレクトロン株式会社 基板処理装置
WO2019231614A1 (en) * 2018-05-31 2019-12-05 Applied Materials, Inc. Extreme uniformity heated substrate support assembly
US12437979B2 (en) * 2020-03-06 2025-10-07 Applied Materials, Inc. Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring
TWI811650B (zh) 2020-03-20 2023-08-11 荷蘭商Ａｓｍｌ荷蘭公司 靜電吸盤控制系統及其相關非暫時性電腦可讀媒體
KR102831548B1 (ko) * 2020-07-20 2025-07-10 세메스 주식회사 지지 유닛 및 이를 이용한 기판 리프팅 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW262566B (enExample) * 1993-07-02 1995-11-11 Tokyo Electron Co Ltd
US5558111A (en) * 1995-02-02 1996-09-24 International Business Machines Corporation Apparatus and method for carrier backing film reconditioning
US6183565B1 (en) * 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
JP4151749B2 (ja) * 1998-07-16 2008-09-17 東京エレクトロンＡｔ株式会社 プラズマ処理装置およびその方法
KR100412262B1 (ko) * 2001-01-31 2003-12-31 삼성전자주식회사 베이크 장치
US20020144786A1 (en) * 2001-04-05 2002-10-10 Angstron Systems, Inc. Substrate temperature control in an ALD reactor
EP1393360A1 (de) * 2001-06-08 2004-03-03 Aixtron AG Verfahren und vorrichtung zur kurzzeitigen thermischen behandlung von flachen gegenständen
US7603028B2 (en) * 2004-03-17 2009-10-13 Coreflow Scientific Solutions Ltd. Non-contact thermal platforms
WO2005099350A2 (en) * 2004-04-14 2005-10-27 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment
JP4485374B2 (ja) * 2005-01-25 2010-06-23 東京エレクトロン株式会社 冷却処理装置
DE102006018514A1 (de) * 2006-04-21 2007-10-25 Aixtron Ag Vorrichtung und Verfahren zur Steuerung der Oberflächentemperatur eines Substrates in einer Prozesskammer
WO2008112673A2 (en) * 2007-03-12 2008-09-18 Tokyo Electron Limited Dynamic temperature backside gas control for improved within-substrate processing uniformity
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
KR100877102B1 (ko) * 2007-05-28 2009-01-09 주식회사 하이닉스반도체 열처리 장치 및 이를 이용한 열처리 방법
TWI505370B (zh) * 2008-11-06 2015-10-21 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
DE112010000737T5 (de) * 2009-02-11 2013-01-17 Applied Materials, Inc. Nichtkontakt-Bearbeitung von Substraten
US20110061810A1 (en) * 2009-09-11 2011-03-17 Applied Materials, Inc. Apparatus and Methods for Cyclical Oxidation and Etching
KR101084235B1 (ko) * 2009-12-15 2011-11-16 삼성모바일디스플레이주식회사 비정질 실리콘 결정화 장치

Also Published As

Publication number Publication date
CN103582941A (zh) 2014-02-12
CN103582941B (zh) 2016-08-17
KR102007994B1 (ko) 2019-08-06
WO2012166322A1 (en) 2012-12-06
KR20140033420A (ko) 2014-03-18
TWI587366B (zh) 2017-06-11
TW201250789A (en) 2012-12-16
JP2014522574A (ja) 2014-09-04
US20120309115A1 (en) 2012-12-06

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