JP2014534614A5 - - Google Patents

Download PDF

Info

Publication number
JP2014534614A5
JP2014534614A5 JP2014533402A JP2014533402A JP2014534614A5 JP 2014534614 A5 JP2014534614 A5 JP 2014534614A5 JP 2014533402 A JP2014533402 A JP 2014533402A JP 2014533402 A JP2014533402 A JP 2014533402A JP 2014534614 A5 JP2014534614 A5 JP 2014534614A5
Authority
JP
Japan
Prior art keywords
cooling
electrostatic chuck
plate
disposed
cooling plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014533402A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014534614A (ja
JP6223983B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/057949 external-priority patent/WO2013049589A1/en
Publication of JP2014534614A publication Critical patent/JP2014534614A/ja
Publication of JP2014534614A5 publication Critical patent/JP2014534614A5/ja
Application granted granted Critical
Publication of JP6223983B2 publication Critical patent/JP6223983B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014533402A 2011-09-30 2012-09-28 温度制御付き静電チャック Active JP6223983B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201161542068P 2011-09-30 2011-09-30
US61/542,068 2011-09-30
US201161542746P 2011-10-03 2011-10-03
US61/542,746 2011-10-03
PCT/US2012/057949 WO2013049589A1 (en) 2011-09-30 2012-09-28 Electrostatic chuck with temperature control
US13/630,196 2012-09-28
US13/630,196 US8971009B2 (en) 2011-09-30 2012-09-28 Electrostatic chuck with temperature control

Publications (3)

Publication Number Publication Date
JP2014534614A JP2014534614A (ja) 2014-12-18
JP2014534614A5 true JP2014534614A5 (enExample) 2015-11-12
JP6223983B2 JP6223983B2 (ja) 2017-11-01

Family

ID=47996440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014533402A Active JP6223983B2 (ja) 2011-09-30 2012-09-28 温度制御付き静電チャック

Country Status (5)

Country Link
US (1) US8971009B2 (enExample)
JP (1) JP6223983B2 (enExample)
KR (1) KR102103136B1 (enExample)
CN (1) CN103843129B (enExample)
WO (1) WO2013049589A1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
KR20190132561A (ko) * 2012-01-06 2019-11-27 노벨러스 시스템즈, 인코포레이티드 적응형 열 교환 방법 및 균일한 열 교환을 위한 시스템
JP5973731B2 (ja) 2012-01-13 2016-08-23 東京エレクトロン株式会社 プラズマ処理装置及びヒータの温度制御方法
US9404176B2 (en) 2012-06-05 2016-08-02 Applied Materials, Inc. Substrate support with radio frequency (RF) return path
JP5975755B2 (ja) * 2012-06-28 2016-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
WO2015013143A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An end effector for transferring a substrate
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
KR101905158B1 (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
US9196514B2 (en) * 2013-09-06 2015-11-24 Applied Materials, Inc. Electrostatic chuck with variable pixilated heating
US10460968B2 (en) 2013-12-02 2019-10-29 Applied Materials, Inc. Electrostatic chuck with variable pixelated magnetic field
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10431435B2 (en) 2014-08-01 2019-10-01 Applied Materials, Inc. Wafer carrier with independent isolated heater zones
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
CN104400298B (zh) * 2014-12-15 2017-01-25 天津科信磁性机械有限公司 水冷式磁力模块及其操作方法
US10497606B2 (en) * 2015-02-09 2019-12-03 Applied Materials, Inc. Dual-zone heater for plasma processing
US10249526B2 (en) * 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US10770270B2 (en) 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
TWI835063B (zh) * 2016-07-28 2024-03-11 荷蘭商Ａｓｍｌ荷蘭公司 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition
US10867816B2 (en) * 2016-12-13 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for wafer backside cooling
TWI617813B (zh) * 2017-02-09 2018-03-11 矽品精密工業股份有限公司 檢測設備
US11011355B2 (en) 2017-05-12 2021-05-18 Lam Research Corporation Temperature-tuned substrate support for substrate processing systems
JP6924618B2 (ja) * 2017-05-30 2021-08-25 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
US11149345B2 (en) * 2017-12-11 2021-10-19 Applied Materials, Inc. Cryogenically cooled rotatable electrostatic chuck
WO2019231614A1 (en) 2018-05-31 2019-12-05 Applied Materials, Inc. Extreme uniformity heated substrate support assembly
JP7133992B2 (ja) * 2018-06-07 2022-09-09 東京エレクトロン株式会社 基板載置台及び基板処理装置
JP7279156B2 (ja) * 2018-10-11 2023-05-22 北京北方華創微電子装備有限公司 静電チャックおよび反応チャンバ
CN111048460B (zh) * 2018-10-11 2025-07-29 北京北方华创微电子装备有限公司 静电卡盘及反应腔室
JP7199200B2 (ja) * 2018-11-01 2023-01-05 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法
US12300473B2 (en) * 2019-03-08 2025-05-13 Applied Materials, Inc. Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber
KR102472864B1 (ko) * 2019-08-06 2022-12-02 주식회사 미코세라믹스 정전척 히터 및 그 제조방법
US11424096B2 (en) * 2019-11-05 2022-08-23 Applied Materials, Inc. Temperature controlled secondary electrode for ion control at substrate edge
CN112951695B (zh) * 2019-11-26 2023-09-29 中微半导体设备(上海)股份有限公司 冷却管组件、冷却装置和等离子体处理设备
CN111607785A (zh) 2020-05-26 2020-09-01 北京北方华创微电子装备有限公司 一种加热装置及半导体加工设备
US11610799B2 (en) * 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
CN112509954B (zh) * 2021-02-04 2021-06-08 北京中硅泰克精密技术有限公司 半导体工艺设备及其承载装置
KR102368832B1 (ko) 2021-07-08 2022-03-02 에이피티씨 주식회사 다중 가열 영역 구조의 정전 척
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system
US20250118586A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Electrostatically secured substrate support assembly
US20250293009A1 (en) * 2024-03-13 2025-09-18 Applied Materials, Inc. Advanced thermal management system (atm) for pedestal temperature control in high power pecvd chamber

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06342842A (ja) * 1993-05-31 1994-12-13 Tokyo Electron Ltd 処理装置における貼り合わせ構造
US5511799A (en) * 1993-06-07 1996-04-30 Applied Materials, Inc. Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
JP3297771B2 (ja) * 1993-11-05 2002-07-02 ソニー株式会社 半導体製造装置
JPH09195037A (ja) * 1996-01-09 1997-07-29 Ulvac Japan Ltd 加熱冷却装置及びこれを用いた真空処理装置
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6033478A (en) * 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
GB2325939B (en) * 1997-01-02 2001-12-19 Cvc Products Inc Thermally conductive chuck for vacuum processor
JPH11307513A (ja) 1998-04-20 1999-11-05 Sony Corp 絶縁体基板対応プラズマ処理装置
US6081414A (en) * 1998-05-01 2000-06-27 Applied Materials, Inc. Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
JP3980187B2 (ja) * 1998-07-24 2007-09-26 日本碍子株式会社 半導体保持装置、その製造方法およびその使用方法
JP2001021281A (ja) * 1999-07-09 2001-01-26 Mitsubishi Electric Corp 均熱装置
DE60045384D1 (de) * 1999-09-29 2011-01-27 Tokyo Electron Ltd Mehrzonenwiderstandsheizung
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
EP1098354A2 (en) * 1999-11-08 2001-05-09 Applied Materials, Inc. Apparatus for controlling temperature in a semiconductor processing system
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
KR100387524B1 (ko) * 2001-01-26 2003-06-18 삼성전자주식회사 반도체 웨이퍼 위치 상태 감지 시스템과 이를 이용하는 반도체장치 제조 설비 및 그에 따른 웨이퍼 위치 상태 감지방법
JP3825277B2 (ja) * 2001-05-25 2006-09-27 東京エレクトロン株式会社 加熱処理装置
WO2005059991A1 (en) * 2003-12-19 2005-06-30 Mattson Technology Canada Inc. Apparatuses and methods for suppressing thermally induced motion of a workpiece
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
JP2007088411A (ja) * 2005-06-28 2007-04-05 Hitachi High-Technologies Corp 静電吸着装置およびウエハ処理装置ならびにプラズマ処理方法
US20070044914A1 (en) * 2005-08-30 2007-03-01 Katsuji Matano Vacuum processing apparatus
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US9275887B2 (en) * 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US7649729B2 (en) * 2007-10-12 2010-01-19 Applied Materials, Inc. Electrostatic chuck assembly
WO2010019430A2 (en) * 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
KR101658758B1 (ko) * 2009-02-20 2016-09-21 엔지케이 인슐레이터 엘티디 세라믹스-금속 접합체 및 그 제조 방법
US8274017B2 (en) * 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control

Similar Documents

Publication Publication Date Title
JP2014534614A5 (enExample)
JP6594960B2 (ja) ペデスタルの流体による熱制御
US11417561B2 (en) Edge ring for a substrate processing chamber
WO2013042027A3 (en) Thermal plate with planar thermal zones for semiconductor processing
JP2013045989A5 (enExample)
CN104988472B (zh) 半导体镀膜设备控温系统
US20140251214A1 (en) Heated substrate support with flatness control
US8975817B2 (en) Pressure controlled heat pipe temperature control plate
TWI456638B (zh) 具有區域依賴性熱效率之溫度受控電漿製程腔室部件
JP2017512379A5 (enExample)
WO2011136974A3 (en) Process chambers having shared resources and methods of use thereof
KR102335646B1 (ko) 온도 조정 장치
TW201246444A (en) High temperature electrostatic chuck with radial thermal chokes
TW200616139A (en) Method and apparatus for controlling temperature of a substrate
JP2013535842A5 (enExample)
JP2012204806A5 (ja) パターン形成方法、処理容器内の部材の温度制御方法、基板処理システム、フォーカスリングの温度制御方法及び基板のエッチング方法
CN113169111A (zh) 具有改良的热耦合以用于热敏感处理的静电吸盘
CN104934345A (zh) 一种等离子体装置
CN104928651A (zh) 一种温流室出气的可控温加热盘
CN101419929A (zh) 静电卡盘
CN107533997B (zh) 工件固持加热设备
JP2014236145A (ja) 熱処理装置および加熱プレート冷却方法
TWM619803U (zh) 可調整晶圓溫度的承載盤及應用該承載盤的薄膜沉積裝置
CN106637139A (zh) 一种稳流室空腔可控温基体托架结构
CN102456604A (zh) 卡盘及其制造方法、具有该卡盘的晶片处理设备