SG10201902954VA - Method of regulating a surface temperature of polishing pad, and polishing apparatus - Google Patents
Method of regulating a surface temperature of polishing pad, and polishing apparatusInfo
- Publication number
- SG10201902954VA SG10201902954VA SG10201902954VA SG10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA
- Authority
- SG
- Singapore
- Prior art keywords
- flow
- rate control
- control valve
- surface temperature
- polishing pad
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 4
- 230000001105 regulatory effect Effects 0.000 title abstract 3
- 239000012809 cooling fluid Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
OF THE DISCLOSURE METHOD OF REGULATING A SURFACE TEMPERATURE OF POLISHING PAD, AND POLISHING APPARATUS A method capable of precisely regulating a surface temperature of a polishing pad is disclosed. The method includes: deteiniining a heating-side manipulation range by removing a dead band of a first flow-rate control valve from a range of manipulated variable for the first flow-rate control valve; setting a first manipulated variable, selected from the heating-side manipulation range, to the first flow-rate control valve; determines a cooling-side manipulation range by removing a dead band of a second flow-rate control valve from a range of manipulated variable for the second flow-rate control valve; setting a second manipulated variable, selected from the cooling-side manipulation range, to the second flow-rate control valve; and supplying a heating fluid and a cooling fluid that have passed through the flow-rate control valves to a heat exchanger to regulate a surface temperature of a polishing pad. FIG. 25
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018073579A JP2019181607A (en) | 2018-04-06 | 2018-04-06 | Method for adjustment of surface temperature of abrasive pad, and polishing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201902954VA true SG10201902954VA (en) | 2019-11-28 |
Family
ID=68097838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201902954V SG10201902954VA (en) | 2018-04-06 | 2019-04-02 | Method of regulating a surface temperature of polishing pad, and polishing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US20190308293A1 (en) |
JP (1) | JP2019181607A (en) |
SG (1) | SG10201902954VA (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7236990B2 (en) * | 2019-12-09 | 2023-03-10 | 株式会社荏原製作所 | System and polishing equipment for adjusting the surface temperature of the pad |
CN112589669A (en) * | 2020-12-09 | 2021-04-02 | 苏州斯尔特微电子有限公司 | Feeding mechanism for wafer grinding |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04203605A (en) * | 1990-11-30 | 1992-07-24 | Hitachi Constr Mach Co Ltd | Pilot operated type flow control logic valve |
JP6929072B2 (en) * | 2016-02-22 | 2021-09-01 | 株式会社荏原製作所 | Equipment and methods for adjusting the surface temperature of the polishing pad |
JP6782139B2 (en) * | 2016-09-29 | 2020-11-11 | アズビル株式会社 | Mass flow controller |
-
2018
- 2018-04-06 JP JP2018073579A patent/JP2019181607A/en active Pending
-
2019
- 2019-04-02 SG SG10201902954V patent/SG10201902954VA/en unknown
- 2019-04-03 US US16/374,108 patent/US20190308293A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2019181607A (en) | 2019-10-24 |
US20190308293A1 (en) | 2019-10-10 |
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