SG10201902954VA - Method of regulating a surface temperature of polishing pad, and polishing apparatus - Google Patents

Method of regulating a surface temperature of polishing pad, and polishing apparatus

Info

Publication number
SG10201902954VA
SG10201902954VA SG10201902954VA SG10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA SG 10201902954V A SG10201902954V A SG 10201902954VA
Authority
SG
Singapore
Prior art keywords
flow
rate control
control valve
surface temperature
polishing pad
Prior art date
Application number
Inventor
Kamiki Keisuke
Komatsu Mitsunori
KABASAWA Masashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201902954VA publication Critical patent/SG10201902954VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

OF THE DISCLOSURE METHOD OF REGULATING A SURFACE TEMPERATURE OF POLISHING PAD, AND POLISHING APPARATUS A method capable of precisely regulating a surface temperature of a polishing pad is disclosed. The method includes: deteiniining a heating-side manipulation range by removing a dead band of a first flow-rate control valve from a range of manipulated variable for the first flow-rate control valve; setting a first manipulated variable, selected from the heating-side manipulation range, to the first flow-rate control valve; determines a cooling-side manipulation range by removing a dead band of a second flow-rate control valve from a range of manipulated variable for the second flow-rate control valve; setting a second manipulated variable, selected from the cooling-side manipulation range, to the second flow-rate control valve; and supplying a heating fluid and a cooling fluid that have passed through the flow-rate control valves to a heat exchanger to regulate a surface temperature of a polishing pad. FIG. 25
SG10201902954V 2018-04-06 2019-04-02 Method of regulating a surface temperature of polishing pad, and polishing apparatus SG10201902954VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018073579A JP2019181607A (en) 2018-04-06 2018-04-06 Method for adjustment of surface temperature of abrasive pad, and polishing device

Publications (1)

Publication Number Publication Date
SG10201902954VA true SG10201902954VA (en) 2019-11-28

Family

ID=68097838

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201902954V SG10201902954VA (en) 2018-04-06 2019-04-02 Method of regulating a surface temperature of polishing pad, and polishing apparatus

Country Status (3)

Country Link
US (1) US20190308293A1 (en)
JP (1) JP2019181607A (en)
SG (1) SG10201902954VA (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7236990B2 (en) * 2019-12-09 2023-03-10 株式会社荏原製作所 System and polishing equipment for adjusting the surface temperature of the pad
CN112589669A (en) * 2020-12-09 2021-04-02 苏州斯尔特微电子有限公司 Feeding mechanism for wafer grinding

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04203605A (en) * 1990-11-30 1992-07-24 Hitachi Constr Mach Co Ltd Pilot operated type flow control logic valve
JP6929072B2 (en) * 2016-02-22 2021-09-01 株式会社荏原製作所 Equipment and methods for adjusting the surface temperature of the polishing pad
JP6782139B2 (en) * 2016-09-29 2020-11-11 アズビル株式会社 Mass flow controller

Also Published As

Publication number Publication date
JP2019181607A (en) 2019-10-24
US20190308293A1 (en) 2019-10-10

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