SG10201809583VA - Heat exchanger for regulating temperature of polishing surface of polishing pad, polishing apparatus having such heat exchanger, polishing method for substrate using such heat exchanger, and computer-readable storage medium storing a program for regulating temperature of polishing surface of polishing pad - Google Patents

Heat exchanger for regulating temperature of polishing surface of polishing pad, polishing apparatus having such heat exchanger, polishing method for substrate using such heat exchanger, and computer-readable storage medium storing a program for regulating temperature of polishing surface of polishing pad

Info

Publication number
SG10201809583VA
SG10201809583VA SG10201809583VA SG10201809583VA SG10201809583VA SG 10201809583V A SG10201809583V A SG 10201809583VA SG 10201809583V A SG10201809583V A SG 10201809583VA SG 10201809583V A SG10201809583V A SG 10201809583VA SG 10201809583V A SG10201809583V A SG 10201809583VA
Authority
SG
Singapore
Prior art keywords
polishing
heat exchanger
regulating temperature
polishing pad
pad
Prior art date
Application number
SG10201809583VA
Inventor
Maruyama Toru
Motoshima Yasuyuki
Matsuo Hisanori
KABASAWA Masashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201809583VA publication Critical patent/SG10201809583VA/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

OF THE DISCLOSURE HEAT EXCHANGER FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD, POLISHING APPARATUS HAVING SUCH HEAT EXCHANGER, POLISHING METHOD FOR SUBSTRATE USING SUCH HEAT EXCHANGER, AND COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD A heat exchanger capable of preventing sticking of slurry is disclosed. The heat exchanger includes: a flow passage structure having a heating flow passage and a cooling flow passage formed therein; and a water-repellent material covering a side surface of the flow passage structure. A side surface of the heat exchanger is constituted by the water- repellent material. FIG. 4
SG10201809583VA 2017-10-31 2018-10-30 Heat exchanger for regulating temperature of polishing surface of polishing pad, polishing apparatus having such heat exchanger, polishing method for substrate using such heat exchanger, and computer-readable storage medium storing a program for regulating temperature of polishing surface of polishing pad SG10201809583VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017210186 2017-10-31
JP2018116659A JP7059117B2 (en) 2017-10-31 2018-06-20 To adjust the temperature of the polished surface of the polishing pad, the heat exchanger for adjusting the temperature of the polished surface of the polishing pad, the polishing device equipped with the heat exchanger, the method of polishing the substrate using the heat exchanger, and the temperature of the polished surface of the polishing pad. Computer-readable recording medium on which the program is recorded

Publications (1)

Publication Number Publication Date
SG10201809583VA true SG10201809583VA (en) 2019-05-30

Family

ID=66670980

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201809583VA SG10201809583VA (en) 2017-10-31 2018-10-30 Heat exchanger for regulating temperature of polishing surface of polishing pad, polishing apparatus having such heat exchanger, polishing method for substrate using such heat exchanger, and computer-readable storage medium storing a program for regulating temperature of polishing surface of polishing pad

Country Status (3)

Country Link
JP (1) JP7059117B2 (en)
SG (1) SG10201809583VA (en)
TW (1) TWI783069B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
CN114378634A (en) * 2022-01-11 2022-04-22 浙拖奔野（宁波）拖拉机制造有限公司 Machining device for production of continuously variable transmission
CN117067124B (en) * 2023-10-13 2023-12-26 歌玛磨具南通有限公司 Self-cooling grinding wheel

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
KR19980064180A (en) * 1996-12-19 1998-10-07 윌리엄비.켐플러 How to accelerate isothermal polishing of silicon wafers
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP2002237477A (en) 2001-02-09 2002-08-23 Matsushita Electric Ind Co Ltd Method of polishing work and polishing device
JP2003179021A (en) 2001-12-11 2003-06-27 Sony Corp Chemical/mechanical polisher
US7201647B2 (en) 2002-06-07 2007-04-10 Praxair Technology, Inc. Subpad having robust, sealed edges
JP4162001B2 (en) 2005-11-24 2008-10-08 株式会社東京精密 Wafer polishing apparatus and wafer polishing method
JP2007245266A (en) 2006-03-14 2007-09-27 Daikin Ind Ltd Cmp device
JP5628067B2 (en) * 2011-02-25 2014-11-19 株式会社荏原製作所 Polishing apparatus provided with temperature adjustment mechanism of polishing pad
JP5767898B2 (en) 2011-08-12 2015-08-26 株式会社東芝 Manufacturing method of semiconductor device
JP6161999B2 (en) 2013-08-27 2017-07-12 株式会社荏原製作所 Polishing method and polishing apparatus
JP6929072B2 (en) 2016-02-22 2021-09-01 株式会社荏原製作所 Equipment and methods for adjusting the surface temperature of the polishing pad

Also Published As

Publication number Publication date
TWI783069B (en) 2022-11-11
TW201922416A (en) 2019-06-16
JP2019081241A (en) 2019-05-30
JP7059117B2 (en) 2022-04-25

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