JP2010114397A5 - - Google Patents

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Publication number
JP2010114397A5
JP2010114397A5 JP2008288268A JP2008288268A JP2010114397A5 JP 2010114397 A5 JP2010114397 A5 JP 2010114397A5 JP 2008288268 A JP2008288268 A JP 2008288268A JP 2008288268 A JP2008288268 A JP 2008288268A JP 2010114397 A5 JP2010114397 A5 JP 2010114397A5
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JP
Japan
Prior art keywords
exposure apparatus
stage
gas chamber
substrate
adjusting means
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Application number
JP2008288268A
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English (en)
Japanese (ja)
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JP5355043B2 (ja
JP2010114397A (ja
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Priority to JP2008288268A priority Critical patent/JP5355043B2/ja
Priority claimed from JP2008288268A external-priority patent/JP5355043B2/ja
Publication of JP2010114397A publication Critical patent/JP2010114397A/ja
Publication of JP2010114397A5 publication Critical patent/JP2010114397A5/ja
Application granted granted Critical
Publication of JP5355043B2 publication Critical patent/JP5355043B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008288268A 2008-11-10 2008-11-10 露光装置およびデバイス製造方法 Expired - Fee Related JP5355043B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008288268A JP5355043B2 (ja) 2008-11-10 2008-11-10 露光装置およびデバイス製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008288268A JP5355043B2 (ja) 2008-11-10 2008-11-10 露光装置およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2010114397A JP2010114397A (ja) 2010-05-20
JP2010114397A5 true JP2010114397A5 (enExample) 2012-01-12
JP5355043B2 JP5355043B2 (ja) 2013-11-27

Family

ID=42302708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008288268A Expired - Fee Related JP5355043B2 (ja) 2008-11-10 2008-11-10 露光装置およびデバイス製造方法

Country Status (1)

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JP (1) JP5355043B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6176771B2 (ja) * 2010-12-28 2017-08-09 住友大阪セメント株式会社 静電チャック装置
NL2009378A (en) * 2011-10-07 2013-04-09 Asml Netherlands Bv Lithographic apparatus and method of cooling a component in a lithographic apparatus.
US10191396B2 (en) 2014-06-19 2019-01-29 Asml Netherlands B.V. Lithographic apparatus, object positioning system and device manufacturing method
WO2016066392A1 (en) 2014-10-28 2016-05-06 Asml Netherlands B.V. Component for a lithography tool, lithography apparatus, inspection tool and a method of manufacturing a device
USRE49066E1 (en) 2015-10-06 2022-05-10 Asml Holding N.V. Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus
CN117373954A (zh) * 2016-02-16 2024-01-09 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法与设备
WO2017144277A1 (en) * 2016-02-24 2017-08-31 Asml Netherlands B.V. Substrate handling system and lithographic apparatus
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备
JP2020188284A (ja) * 2020-08-04 2020-11-19 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングするための方法および装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01152639A (ja) * 1987-12-10 1989-06-15 Canon Inc 吸着保持装置
JP4311711B2 (ja) * 2003-02-24 2009-08-12 キヤノン株式会社 露光装置及びデバイス製造方法
US20040244963A1 (en) * 2003-06-05 2004-12-09 Nikon Corporation Heat pipe with temperature control
JP4595431B2 (ja) * 2004-08-03 2010-12-08 凸版印刷株式会社 ドライエッチング方法及びドライエッチング装置
JP2009037391A (ja) * 2007-08-01 2009-02-19 Nikon Corp 温度調整装置、露光装置、アクチュエータ装置、保持装置、及びデバイス製造方法

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