JP5355043B2 - 露光装置およびデバイス製造方法 - Google Patents

露光装置およびデバイス製造方法 Download PDF

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Publication number
JP5355043B2
JP5355043B2 JP2008288268A JP2008288268A JP5355043B2 JP 5355043 B2 JP5355043 B2 JP 5355043B2 JP 2008288268 A JP2008288268 A JP 2008288268A JP 2008288268 A JP2008288268 A JP 2008288268A JP 5355043 B2 JP5355043 B2 JP 5355043B2
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Japan
Prior art keywords
stage
gas chamber
exposure apparatus
substrate
valve
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Expired - Fee Related
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JP2008288268A
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Japanese (ja)
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JP2010114397A (ja
JP2010114397A5 (enExample
Inventor
通雄 柳澤
敬清 由井
真知子 水島
正道 桑原
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Canon Inc
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Canon Inc
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008288268A 2008-11-10 2008-11-10 露光装置およびデバイス製造方法 Expired - Fee Related JP5355043B2 (ja)

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JP2008288268A JP5355043B2 (ja) 2008-11-10 2008-11-10 露光装置およびデバイス製造方法

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JP2008288268A JP5355043B2 (ja) 2008-11-10 2008-11-10 露光装置およびデバイス製造方法

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JP2010114397A JP2010114397A (ja) 2010-05-20
JP2010114397A5 JP2010114397A5 (enExample) 2012-01-12
JP5355043B2 true JP5355043B2 (ja) 2013-11-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10755930B2 (en) 2016-02-16 2020-08-25 Ev Group E. Thallner Gmbh Method and device for bonding of substrates

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6176771B2 (ja) * 2010-12-28 2017-08-09 住友大阪セメント株式会社 静電チャック装置
NL2009378A (en) * 2011-10-07 2013-04-09 Asml Netherlands Bv Lithographic apparatus and method of cooling a component in a lithographic apparatus.
JP6367382B2 (ja) * 2014-06-19 2018-08-01 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、対象物位置決めシステムおよびデバイス製造方法
WO2016066392A1 (en) 2014-10-28 2016-05-06 Asml Netherlands B.V. Component for a lithography tool, lithography apparatus, inspection tool and a method of manufacturing a device
KR102756397B1 (ko) * 2015-10-06 2025-01-16 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치의 물체를 유지하는 척과 클램프 및 리소그래피 장치의 클램프에 의해 유지되는 물체의 온도를 제어하는 방법
JP6637188B2 (ja) * 2016-02-24 2020-01-29 エーエスエムエル ネザーランズ ビー．ブイ． 基板ハンドリングシステムおよびリソグラフィ装置
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备
JP2020188284A (ja) * 2020-08-04 2020-11-19 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングするための方法および装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01152639A (ja) * 1987-12-10 1989-06-15 Canon Inc 吸着保持装置
JP4311711B2 (ja) * 2003-02-24 2009-08-12 キヤノン株式会社 露光装置及びデバイス製造方法
US20040244963A1 (en) * 2003-06-05 2004-12-09 Nikon Corporation Heat pipe with temperature control
JP4595431B2 (ja) * 2004-08-03 2010-12-08 凸版印刷株式会社 ドライエッチング方法及びドライエッチング装置
JP2009037391A (ja) * 2007-08-01 2009-02-19 Nikon Corp 温度調整装置、露光装置、アクチュエータ装置、保持装置、及びデバイス製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10755930B2 (en) 2016-02-16 2020-08-25 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
US10755929B2 (en) 2016-02-16 2020-08-25 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
US11101132B2 (en) 2016-02-16 2021-08-24 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
US11742205B2 (en) 2016-02-16 2023-08-29 Ev Group E. Thallner Gmbh Method and device for bonding of substrates

Also Published As

Publication number Publication date
JP2010114397A (ja) 2010-05-20

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