JP2018501757A5 - - Google Patents

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Publication number
JP2018501757A5
JP2018501757A5 JP2017529626A JP2017529626A JP2018501757A5 JP 2018501757 A5 JP2018501757 A5 JP 2018501757A5 JP 2017529626 A JP2017529626 A JP 2017529626A JP 2017529626 A JP2017529626 A JP 2017529626A JP 2018501757 A5 JP2018501757 A5 JP 2018501757A5
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JP
Japan
Prior art keywords
pack
chuck
inductor
electrodes
electrostatic chuck
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Application number
JP2017529626A
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English (en)
Japanese (ja)
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JP2018501757A (ja
JP6796066B2 (ja
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Priority claimed from PCT/US2015/064494 external-priority patent/WO2016094404A1/en
Publication of JP2018501757A publication Critical patent/JP2018501757A/ja
Publication of JP2018501757A5 publication Critical patent/JP2018501757A5/ja
Application granted granted Critical
Publication of JP6796066B2 publication Critical patent/JP6796066B2/ja
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JP2017529626A 2014-12-11 2015-12-08 高温ｒｆ用途のための静電チャック Active JP6796066B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462090858P 2014-12-11 2014-12-11
US62/090,858 2014-12-11
PCT/US2015/064494 WO2016094404A1 (en) 2014-12-11 2015-12-08 Electrostatic chuck for high temperature rf applications
US14/962,446 US9984911B2 (en) 2014-12-11 2015-12-08 Electrostatic chuck design for high temperature RF applications
US14/962,446 2015-12-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020146736A Division JP7069262B2 (ja) 2014-12-11 2020-09-01 高温ｒｆ用途のための静電チャック

Publications (3)

Publication Number Publication Date
JP2018501757A JP2018501757A (ja) 2018-01-18
JP2018501757A5 true JP2018501757A5 (enExample) 2019-01-24
JP6796066B2 JP6796066B2 (ja) 2020-12-02

Family

ID=56108058

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017529626A Active JP6796066B2 (ja) 2014-12-11 2015-12-08 高温ｒｆ用途のための静電チャック
JP2020146736A Active JP7069262B2 (ja) 2014-12-11 2020-09-01 高温ｒｆ用途のための静電チャック

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020146736A Active JP7069262B2 (ja) 2014-12-11 2020-09-01 高温ｒｆ用途のための静電チャック

Country Status (5)

Country Link
US (1) US9984911B2 (enExample)
JP (2) JP6796066B2 (enExample)
KR (1) KR102498784B1 (enExample)
TW (1) TWI676235B (enExample)
WO (1) WO2016094404A1 (enExample)

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US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
US10693433B2 (en) * 2018-05-17 2020-06-23 Lam Research Corporation Electrostatic chuck filter box and mounting bracket
WO2020013938A1 (en) * 2018-07-07 2020-01-16 Applied Materials, Inc. Semiconductor processing apparatus for high rf power process
US11031273B2 (en) * 2018-12-07 2021-06-08 Applied Materials, Inc. Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
CN111383894B (zh) * 2018-12-29 2022-12-30 中微半导体设备(上海)股份有限公司 一种等离子处理器以及静电夹盘加热方法
WO2020200442A1 (en) * 2019-04-03 2020-10-08 Applied Materials, Inc. Sputter deposition source, sputter deposition apparatus, and method of powering a sputter deposition source
US11587773B2 (en) * 2019-05-24 2023-02-21 Applied Materials, Inc. Substrate pedestal for improved substrate processing
JP7292115B2 (ja) * 2019-06-07 2023-06-16 東京エレクトロン株式会社 温度調整装置及び温度制御方法。
JP7341043B2 (ja) * 2019-12-06 2023-09-08 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US11482444B2 (en) 2020-03-10 2022-10-25 Applied Materials, Inc. High temperature micro-zone electrostatic chuck
US11784080B2 (en) 2020-03-10 2023-10-10 Applied Materials, Inc. High temperature micro-zone electrostatic chuck

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JP4898718B2 (ja) * 2008-02-08 2012-03-21 東京エレクトロン株式会社 載置台及びプラズマ処理装置
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