JP2015518275A5 - - Google Patents
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- Publication number
- JP2015518275A5 JP2015518275A5 JP2015503364A JP2015503364A JP2015518275A5 JP 2015518275 A5 JP2015518275 A5 JP 2015518275A5 JP 2015503364 A JP2015503364 A JP 2015503364A JP 2015503364 A JP2015503364 A JP 2015503364A JP 2015518275 A5 JP2015518275 A5 JP 2015518275A5
- Authority
- JP
- Japan
- Prior art keywords
- disposed
- region
- openings
- conductors
- conductive mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 27
- 239000004020 conductor Substances 0.000 claims 23
- 230000005672 electromagnetic field Effects 0.000 claims 8
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000012544 monitoring process Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261617946P | 2012-03-30 | 2012-03-30 | |
| US61/617,946 | 2012-03-30 | ||
| US13/845,492 US9706605B2 (en) | 2012-03-30 | 2013-03-18 | Substrate support with feedthrough structure |
| US13/845,492 | 2013-03-18 | ||
| PCT/US2013/032874 WO2013148406A1 (en) | 2012-03-30 | 2013-03-19 | Substrate support with feedthrough structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015518275A JP2015518275A (ja) | 2015-06-25 |
| JP2015518275A5 true JP2015518275A5 (enExample) | 2016-05-19 |
| JP6211053B2 JP6211053B2 (ja) | 2017-10-11 |
Family
ID=49233841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015503364A Active JP6211053B2 (ja) | 2012-03-30 | 2013-03-19 | フィードスルー構造体を備える基板支持体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9706605B2 (enExample) |
| JP (1) | JP6211053B2 (enExample) |
| KR (1) | KR102123366B1 (enExample) |
| CN (1) | CN104247001B (enExample) |
| TW (1) | TWI624901B (enExample) |
| WO (1) | WO2013148406A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5973731B2 (ja) * | 2012-01-13 | 2016-08-23 | 東京エレクトロン株式会社 | プラズマ処理装置及びヒータの温度制御方法 |
| US9543186B2 (en) | 2013-02-01 | 2017-01-10 | Applied Materials, Inc. | Substrate support with controlled sealing gap |
| JP6276919B2 (ja) * | 2013-02-01 | 2018-02-07 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置および試料台 |
| US9698074B2 (en) | 2013-09-16 | 2017-07-04 | Applied Materials, Inc. | Heated substrate support with temperature profile control |
| US9673025B2 (en) * | 2015-07-27 | 2017-06-06 | Lam Research Corporation | Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control |
| US10582570B2 (en) * | 2016-01-22 | 2020-03-03 | Applied Materials, Inc. | Sensor system for multi-zone electrostatic chuck |
| US10892179B2 (en) * | 2016-11-08 | 2021-01-12 | Lam Research Corporation | Electrostatic chuck including clamp electrode assembly forming portion of Faraday cage for RF delivery and associated methods |
| US10079168B2 (en) * | 2016-11-08 | 2018-09-18 | Lam Research Corporation | Ceramic electrostatic chuck including embedded Faraday cage for RF delivery and associated methods for operation, monitoring, and control |
| KR20190042831A (ko) | 2017-10-17 | 2019-04-25 | 주식회사 이에스티 | 정전척 및 진공 챔버의 피드스루 기밀 구조 |
| KR102124303B1 (ko) | 2018-10-15 | 2020-06-18 | 세메스 주식회사 | 기판 처리 장치, 기판 지지 유닛 및 기판 처리 방법 |
| CN113632588B (zh) * | 2019-03-18 | 2024-06-25 | 日本碍子株式会社 | 陶瓷加热器及其制法 |
| JP2021034347A (ja) * | 2019-08-29 | 2021-03-01 | 株式会社デンソーウェーブ | 複合ケーブル及びロボットシステム |
| US11270903B2 (en) * | 2019-12-17 | 2022-03-08 | Applied Materials, Inc. | Multi zone electrostatic chuck |
| US11551951B2 (en) | 2020-05-05 | 2023-01-10 | Applied Materials, Inc. | Methods and systems for temperature control for a substrate |
| CN114121581B (zh) * | 2020-08-27 | 2024-04-05 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置 |
| KR102326329B1 (ko) | 2021-03-30 | 2021-11-15 | 임하나 | 진공 챔버용 피드 스루 및 그 제조 방법 |
| CN116387224A (zh) * | 2021-12-22 | 2023-07-04 | 拓荆科技股份有限公司 | 真空吸附系统及方法 |
| DE102024116166A1 (de) | 2024-06-10 | 2025-12-11 | Festo Se & Co. Kg | System zur Bearbeitung eines Strukturkörpers |
| DE102024116164A1 (de) | 2024-06-10 | 2025-12-11 | Festo Se & Co. Kg | System zur Bearbeitung eines Strukturkörpers |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4394712A (en) | 1981-03-18 | 1983-07-19 | General Electric Company | Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers |
| JPS63125311U (enExample) | 1987-02-09 | 1988-08-16 | ||
| JPH0521381A (ja) | 1991-07-10 | 1993-01-29 | Sony Corp | 半導体製造装置 |
| DE4302695A1 (de) * | 1993-02-01 | 1994-08-04 | Eilentropp Kg | Elektrische Heizung |
| US5333095A (en) | 1993-05-03 | 1994-07-26 | Maxwell Laboratories, Inc., Sierra Capacitor Filter Division | Feedthrough filter capacitor assembly for human implant |
| JPH07106319A (ja) | 1993-09-30 | 1995-04-21 | Hitachi Electron Eng Co Ltd | Cvd反応炉の加熱装置の電磁遮蔽方法 |
| US5820448A (en) * | 1993-12-27 | 1998-10-13 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
| JPH07316811A (ja) | 1994-05-23 | 1995-12-05 | Hitachi Ltd | 多点温度モニタによる温度制御方法及び半導体製造装置 |
| JP3204861B2 (ja) | 1994-11-09 | 2001-09-04 | 日立電子エンジニアリング株式会社 | 高周波遮蔽ヒータ |
| JPH0946875A (ja) | 1995-07-27 | 1997-02-14 | Mitsubishi Cable Ind Ltd | 電磁遮蔽を施したコネクタ付同軸ケーブル |
| US5667622A (en) * | 1995-08-25 | 1997-09-16 | Siemens Aktiengesellschaft | In-situ wafer temperature control apparatus for single wafer tools |
| US5905627A (en) | 1997-09-10 | 1999-05-18 | Maxwell Energy Products, Inc. | Internally grounded feedthrough filter capacitor |
| US6991526B2 (en) * | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
| JP2002025912A (ja) | 2000-07-04 | 2002-01-25 | Sumitomo Electric Ind Ltd | 半導体製造装置用サセプタとそれを用いた半導体製造装置 |
| JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
| JP4282221B2 (ja) | 2000-12-14 | 2009-06-17 | 日本碍子株式会社 | サセプターのチャンバーへの取付構造およびサセプターのチャンバーへの支持部材 |
| JP2002313144A (ja) | 2001-04-09 | 2002-10-25 | Omron Corp | サーボモータシステム |
| JP4502168B2 (ja) * | 2001-07-06 | 2010-07-14 | ルネサスエレクトロニクス株式会社 | 化学機械研磨装置および化学機械研磨方法 |
| US6863771B2 (en) * | 2001-07-25 | 2005-03-08 | Micron Technology, Inc. | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
| US7239219B2 (en) * | 2001-12-03 | 2007-07-03 | Microfabrica Inc. | Miniature RF and microwave components and methods for fabricating such components |
| WO2003049168A1 (en) * | 2001-12-06 | 2003-06-12 | Ebara Corporation | Substrate holding device and polishing device |
| TW541224B (en) * | 2001-12-14 | 2003-07-11 | Promos Technologies Inc | Chemical mechanical polishing (CMP) apparatus with temperature control |
| US6736720B2 (en) * | 2001-12-26 | 2004-05-18 | Lam Research Corporation | Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
| KR100511854B1 (ko) * | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
| EP1520321A1 (en) * | 2002-06-27 | 2005-04-06 | Memgen Corporation | Miniature rf and microwave components and methods for fabricating such components |
| JP3962661B2 (ja) | 2002-08-30 | 2007-08-22 | 三菱重工業株式会社 | 静電チャック支持機構及び支持台装置及びプラズマ処理装置 |
| KR100506934B1 (ko) * | 2003-01-10 | 2005-08-05 | 삼성전자주식회사 | 연마장치 및 이를 사용하는 연마방법 |
| WO2004082007A1 (ja) * | 2003-03-12 | 2004-09-23 | Tokyo Electron Limited | 半導体処理用の基板保持構造及びプラズマ処理装置 |
| JP2005079415A (ja) * | 2003-09-02 | 2005-03-24 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP4808453B2 (ja) * | 2005-08-26 | 2011-11-02 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| JP4838612B2 (ja) * | 2006-03-28 | 2011-12-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2007317772A (ja) | 2006-05-24 | 2007-12-06 | Shinko Electric Ind Co Ltd | 静電チャック装置 |
| JP4903610B2 (ja) | 2007-03-27 | 2012-03-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| DE102007041209B4 (de) * | 2007-08-31 | 2017-11-23 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Polierkopf, der Zonenkontrolle verwendet |
| KR101594636B1 (ko) * | 2008-03-05 | 2016-02-16 | 가부시키가이샤 이엠디 | 고주파 안테나 유닛 및 플라즈마 처리장치 |
| KR101560138B1 (ko) * | 2008-06-24 | 2015-10-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 저온 pecvd 애플리케이션을 위한 받침대 히터 |
| US8076580B2 (en) | 2009-06-08 | 2011-12-13 | CareFusion 209, Inc. | Cable for enhancing biopotential measurements and method of assembling the same |
| US8274017B2 (en) * | 2009-12-18 | 2012-09-25 | Applied Materials, Inc. | Multifunctional heater/chiller pedestal for wide range wafer temperature control |
| JP5604888B2 (ja) | 2009-12-21 | 2014-10-15 | 住友大阪セメント株式会社 | 静電チャックの製造方法 |
| JP2011222931A (ja) | 2009-12-28 | 2011-11-04 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| TWM423339U (en) * | 2011-10-05 | 2012-02-21 | Raytrend Technology Co Ltd | Signal shielding wire |
-
2013
- 2013-03-18 US US13/845,492 patent/US9706605B2/en active Active
- 2013-03-19 WO PCT/US2013/032874 patent/WO2013148406A1/en not_active Ceased
- 2013-03-19 KR KR1020147030437A patent/KR102123366B1/ko active Active
- 2013-03-19 CN CN201380016546.XA patent/CN104247001B/zh active Active
- 2013-03-19 JP JP2015503364A patent/JP6211053B2/ja active Active
- 2013-03-21 TW TW102110082A patent/TWI624901B/zh active
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