JP2015518275A5 - - Google Patents

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Publication number
JP2015518275A5
JP2015518275A5 JP2015503364A JP2015503364A JP2015518275A5 JP 2015518275 A5 JP2015518275 A5 JP 2015518275A5 JP 2015503364 A JP2015503364 A JP 2015503364A JP 2015503364 A JP2015503364 A JP 2015503364A JP 2015518275 A5 JP2015518275 A5 JP 2015518275A5
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Japan
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disposed
region
openings
conductors
conductive mesh
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JP2015503364A
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Japanese (ja)
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JP6211053B2 (ja
JP2015518275A (ja
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Priority claimed from US13/845,492 external-priority patent/US9706605B2/en
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JP2015503364A 2012-03-30 2013-03-19 フィードスルー構造体を備える基板支持体 Active JP6211053B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261617946P 2012-03-30 2012-03-30
US61/617,946 2012-03-30
US13/845,492 US9706605B2 (en) 2012-03-30 2013-03-18 Substrate support with feedthrough structure
US13/845,492 2013-03-18
PCT/US2013/032874 WO2013148406A1 (en) 2012-03-30 2013-03-19 Substrate support with feedthrough structure

Publications (3)

Publication Number Publication Date
JP2015518275A JP2015518275A (ja) 2015-06-25
JP2015518275A5 true JP2015518275A5 (enExample) 2016-05-19
JP6211053B2 JP6211053B2 (ja) 2017-10-11

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ID=49233841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015503364A Active JP6211053B2 (ja) 2012-03-30 2013-03-19 フィードスルー構造体を備える基板支持体

Country Status (6)

Country Link
US (1) US9706605B2 (enExample)
JP (1) JP6211053B2 (enExample)
KR (1) KR102123366B1 (enExample)
CN (1) CN104247001B (enExample)
TW (1) TWI624901B (enExample)
WO (1) WO2013148406A1 (enExample)

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