TWI624901B - 具有饋通結構的基材支撐件 - Google Patents

具有饋通結構的基材支撐件 Download PDF

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Publication number
TWI624901B
TWI624901B TW102110082A TW102110082A TWI624901B TW I624901 B TWI624901 B TW I624901B TW 102110082 A TW102110082 A TW 102110082A TW 102110082 A TW102110082 A TW 102110082A TW I624901 B TWI624901 B TW I624901B
Authority
TW
Taiwan
Prior art keywords
disposed
openings
conductive mesh
conductors
region
Prior art date
Application number
TW102110082A
Other languages
English (en)
Chinese (zh)
Other versions
TW201347080A (zh
Inventor
沃福斯基里昂
古卡霖梅尤
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201347080A publication Critical patent/TW201347080A/zh
Application granted granted Critical
Publication of TWI624901B publication Critical patent/TWI624901B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
TW102110082A 2012-03-30 2013-03-21 具有饋通結構的基材支撐件 TWI624901B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261617946P 2012-03-30 2012-03-30
US61/617,946 2012-03-30
US13/845,492 US9706605B2 (en) 2012-03-30 2013-03-18 Substrate support with feedthrough structure
US13/845,492 2013-03-18

Publications (2)

Publication Number Publication Date
TW201347080A TW201347080A (zh) 2013-11-16
TWI624901B true TWI624901B (zh) 2018-05-21

Family

ID=49233841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110082A TWI624901B (zh) 2012-03-30 2013-03-21 具有饋通結構的基材支撐件

Country Status (6)

Country Link
US (1) US9706605B2 (enExample)
JP (1) JP6211053B2 (enExample)
KR (1) KR102123366B1 (enExample)
CN (1) CN104247001B (enExample)
TW (1) TWI624901B (enExample)
WO (1) WO2013148406A1 (enExample)

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US10892179B2 (en) * 2016-11-08 2021-01-12 Lam Research Corporation Electrostatic chuck including clamp electrode assembly forming portion of Faraday cage for RF delivery and associated methods
KR20190042831A (ko) 2017-10-17 2019-04-25 주식회사 이에스티 정전척 및 진공 챔버의 피드스루 기밀 구조
KR102124303B1 (ko) 2018-10-15 2020-06-18 세메스 주식회사 기판 처리 장치, 기판 지지 유닛 및 기판 처리 방법
CN113632588B (zh) * 2019-03-18 2024-06-25 日本碍子株式会社 陶瓷加热器及其制法
JP2021034347A (ja) * 2019-08-29 2021-03-01 株式会社デンソーウェーブ 複合ケーブル及びロボットシステム
US11270903B2 (en) * 2019-12-17 2022-03-08 Applied Materials, Inc. Multi zone electrostatic chuck
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
KR102326329B1 (ko) 2021-03-30 2021-11-15 임하나 진공 챔버용 피드 스루 및 그 제조 방법
CN116387224A (zh) * 2021-12-22 2023-07-04 拓荆科技股份有限公司 真空吸附系统及方法
JP2024076737A (ja) * 2022-11-25 2024-06-06 京セラ株式会社 試料保持具
DE102024116166A1 (de) 2024-06-10 2025-12-11 Festo Se & Co. Kg System zur Bearbeitung eines Strukturkörpers
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI821686B (zh) * 2020-08-27 2023-11-11 大陸商中微半導體設備（上海）股份有限公司 電漿處理裝置

Also Published As

Publication number Publication date
KR102123366B1 (ko) 2020-06-16
US20130256966A1 (en) 2013-10-03
KR20150003229A (ko) 2015-01-08
CN104247001A (zh) 2014-12-24
JP6211053B2 (ja) 2017-10-11
WO2013148406A1 (en) 2013-10-03
TW201347080A (zh) 2013-11-16
JP2015518275A (ja) 2015-06-25
CN104247001B (zh) 2017-06-06
US9706605B2 (en) 2017-07-11

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