KR102123366B1 - 피드스루 구조를 가진 기판 지지체 - Google Patents

피드스루 구조를 가진 기판 지지체 Download PDF

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KR102123366B1
KR102123366B1 KR1020147030437A KR20147030437A KR102123366B1 KR 102123366 B1 KR102123366 B1 KR 102123366B1 KR 1020147030437 A KR1020147030437 A KR 1020147030437A KR 20147030437 A KR20147030437 A KR 20147030437A KR 102123366 B1 KR102123366 B1 KR 102123366B1
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openings
disposed
conductors
substrate
region
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Korean (ko)
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KR20150003229A (ko
Inventor
레온 볼포브스키
마유르 지. 쿨카니
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
KR1020147030437A 2012-03-30 2013-03-19 피드스루 구조를 가진 기판 지지체 Active KR102123366B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261617946P 2012-03-30 2012-03-30
US61/617,946 2012-03-30
US13/845,492 US9706605B2 (en) 2012-03-30 2013-03-18 Substrate support with feedthrough structure
US13/845,492 2013-03-18
PCT/US2013/032874 WO2013148406A1 (en) 2012-03-30 2013-03-19 Substrate support with feedthrough structure

Publications (2)

Publication Number Publication Date
KR20150003229A KR20150003229A (ko) 2015-01-08
KR102123366B1 true KR102123366B1 (ko) 2020-06-16

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ID=49233841

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KR1020147030437A Active KR102123366B1 (ko) 2012-03-30 2013-03-19 피드스루 구조를 가진 기판 지지체

Country Status (6)

Country Link
US (1) US9706605B2 (enExample)
JP (1) JP6211053B2 (enExample)
KR (1) KR102123366B1 (enExample)
CN (1) CN104247001B (enExample)
TW (1) TWI624901B (enExample)
WO (1) WO2013148406A1 (enExample)

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JP6276919B2 (ja) * 2013-02-01 2018-02-07 株式会社日立ハイテクノロジーズ プラズマ処理装置および試料台
US9698074B2 (en) 2013-09-16 2017-07-04 Applied Materials, Inc. Heated substrate support with temperature profile control
US9673025B2 (en) * 2015-07-27 2017-06-06 Lam Research Corporation Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
US10582570B2 (en) 2016-01-22 2020-03-03 Applied Materials, Inc. Sensor system for multi-zone electrostatic chuck
US10892179B2 (en) * 2016-11-08 2021-01-12 Lam Research Corporation Electrostatic chuck including clamp electrode assembly forming portion of Faraday cage for RF delivery and associated methods
US10079168B2 (en) * 2016-11-08 2018-09-18 Lam Research Corporation Ceramic electrostatic chuck including embedded Faraday cage for RF delivery and associated methods for operation, monitoring, and control
KR20190042831A (ko) 2017-10-17 2019-04-25 주식회사 이에스티 정전척 및 진공 챔버의 피드스루 기밀 구조
KR102124303B1 (ko) 2018-10-15 2020-06-18 세메스 주식회사 기판 처리 장치, 기판 지지 유닛 및 기판 처리 방법
WO2020189264A1 (ja) * 2019-03-18 2020-09-24 日本碍子株式会社 セラミックヒータ及びその製法
JP2021034347A (ja) * 2019-08-29 2021-03-01 株式会社デンソーウェーブ 複合ケーブル及びロボットシステム
US11270903B2 (en) * 2019-12-17 2022-03-08 Applied Materials, Inc. Multi zone electrostatic chuck
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
CN114121581B (zh) * 2020-08-27 2024-04-05 中微半导体设备(上海)股份有限公司 等离子体处理装置
KR102326329B1 (ko) 2021-03-30 2021-11-15 임하나 진공 챔버용 피드 스루 및 그 제조 방법
CN116387224A (zh) * 2021-12-22 2023-07-04 拓荆科技股份有限公司 真空吸附系统及方法
DE102024116164A1 (de) 2024-06-10 2025-12-11 Festo Se & Co. Kg System zur Bearbeitung eines Strukturkörpers
DE102024116166A1 (de) 2024-06-10 2025-12-11 Festo Se & Co. Kg System zur Bearbeitung eines Strukturkörpers

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JP2011222931A (ja) * 2009-12-28 2011-11-04 Tokyo Electron Ltd 載置台構造及び処理装置

Also Published As

Publication number Publication date
CN104247001A (zh) 2014-12-24
KR20150003229A (ko) 2015-01-08
US9706605B2 (en) 2017-07-11
US20130256966A1 (en) 2013-10-03
WO2013148406A1 (en) 2013-10-03
CN104247001B (zh) 2017-06-06
TWI624901B (zh) 2018-05-21
JP6211053B2 (ja) 2017-10-11
TW201347080A (zh) 2013-11-16
JP2015518275A (ja) 2015-06-25

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