KR102498784B1 - 고온 rf 애플리케이션들을 위한 정전 척 - Google Patents

고온 rf 애플리케이션들을 위한 정전 척 Download PDF

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KR102498784B1
KR102498784B1 KR1020177019111A KR20177019111A KR102498784B1 KR 102498784 B1 KR102498784 B1 KR 102498784B1 KR 1020177019111 A KR1020177019111 A KR 1020177019111A KR 20177019111 A KR20177019111 A KR 20177019111A KR 102498784 B1 KR102498784 B1 KR 102498784B1
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South Korea
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puck
inductor
pretend
blackout
substrate
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Korean (ko)
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KR20170093955A (ko
Inventor
라이언 핸슨
만주나타 코파
비제이 디. 파르케
존 씨. 포스터
케이트 에이. 밀러
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020177019111A 2014-12-11 2015-12-08 고온 rf 애플리케이션들을 위한 정전 척 Active KR102498784B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462090858P 2014-12-11 2014-12-11
US62/090,858 2014-12-11
PCT/US2015/064494 WO2016094404A1 (en) 2014-12-11 2015-12-08 Electrostatic chuck for high temperature rf applications
US14/962,446 US9984911B2 (en) 2014-12-11 2015-12-08 Electrostatic chuck design for high temperature RF applications
US14/962,446 2015-12-08

Publications (2)

Publication Number Publication Date
KR20170093955A KR20170093955A (ko) 2017-08-16
KR102498784B1 true KR102498784B1 (ko) 2023-02-09

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KR1020177019111A Active KR102498784B1 (ko) 2014-12-11 2015-12-08 고온 rf 애플리케이션들을 위한 정전 척

Country Status (5)

Country Link
US (1) US9984911B2 (enExample)
JP (2) JP6796066B2 (enExample)
KR (1) KR102498784B1 (enExample)
TW (1) TWI676235B (enExample)
WO (1) WO2016094404A1 (enExample)

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KR102322767B1 (ko) * 2017-03-10 2021-11-08 삼성디스플레이 주식회사 기판과 스테이지 간의 분리 기구가 개선된 기판 처리 장치 및 그것을 이용한 기판 처리 방법
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
US10693433B2 (en) * 2018-05-17 2020-06-23 Lam Research Corporation Electrostatic chuck filter box and mounting bracket
WO2020013938A1 (en) * 2018-07-07 2020-01-16 Applied Materials, Inc. Semiconductor processing apparatus for high rf power process
US11031273B2 (en) * 2018-12-07 2021-06-08 Applied Materials, Inc. Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
CN111383894B (zh) * 2018-12-29 2022-12-30 中微半导体设备(上海)股份有限公司 一种等离子处理器以及静电夹盘加热方法
WO2020200442A1 (en) * 2019-04-03 2020-10-08 Applied Materials, Inc. Sputter deposition source, sputter deposition apparatus, and method of powering a sputter deposition source
US11587773B2 (en) * 2019-05-24 2023-02-21 Applied Materials, Inc. Substrate pedestal for improved substrate processing
JP7292115B2 (ja) * 2019-06-07 2023-06-16 東京エレクトロン株式会社 温度調整装置及び温度制御方法。
JP7341043B2 (ja) * 2019-12-06 2023-09-08 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US11482444B2 (en) 2020-03-10 2022-10-25 Applied Materials, Inc. High temperature micro-zone electrostatic chuck
US11784080B2 (en) 2020-03-10 2023-10-10 Applied Materials, Inc. High temperature micro-zone electrostatic chuck

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JP2000507745A (ja) 1996-03-29 2000-06-20 ラム リサーチ コーポレイション 動的フィードバック静電ウエハ・チャック
JP2001338917A (ja) 2000-03-24 2001-12-07 Hitachi Ltd 半導体製造装置および処理方法、およびウエハ電位プローブ
JP2014112672A (ja) * 2012-11-30 2014-06-19 Lam Research Corporation 温度制御素子アレイを備えるｅｓｃ用の電力切替システム

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JP3306677B2 (ja) * 1993-05-12 2002-07-24 東京エレクトロン株式会社 自己バイアス測定方法及び装置並びに静電吸着装置
JP2976861B2 (ja) * 1994-09-30 1999-11-10 日本電気株式会社 静電チャック及びその製造方法
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JP4898718B2 (ja) * 2008-02-08 2012-03-21 東京エレクトロン株式会社 載置台及びプラズマ処理装置
EP2321846A4 (en) * 2008-08-12 2012-03-14 Applied Materials Inc ELECTROSTATIC FODDER ASSEMBLY
KR101123584B1 (ko) * 2009-09-17 2012-03-22 주성엔지니어링(주) 플라즈마 처리장치 및 처리방법
US20110209995A1 (en) * 2010-03-01 2011-09-01 Applied Materials, Inc. Physical Vapor Deposition With A Variable Capacitive Tuner and Feedback Circuit
JP6195519B2 (ja) * 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及びその使用方法
JP5740246B2 (ja) * 2011-08-15 2015-06-24 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
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Publication number Priority date Publication date Assignee Title
JP2000507745A (ja) 1996-03-29 2000-06-20 ラム リサーチ コーポレイション 動的フィードバック静電ウエハ・チャック
JP2001338917A (ja) 2000-03-24 2001-12-07 Hitachi Ltd 半導体製造装置および処理方法、およびウエハ電位プローブ
JP2014112672A (ja) * 2012-11-30 2014-06-19 Lam Research Corporation 温度制御素子アレイを備えるｅｓｃ用の電力切替システム

Also Published As

Publication number Publication date
WO2016094404A1 (en) 2016-06-16
TWI676235B (zh) 2019-11-01
JP2018501757A (ja) 2018-01-18
JP7069262B2 (ja) 2022-05-17
KR20170093955A (ko) 2017-08-16
JP2021002666A (ja) 2021-01-07
JP6796066B2 (ja) 2020-12-02
TW201633449A (zh) 2016-09-16
US9984911B2 (en) 2018-05-29
US20160172227A1 (en) 2016-06-16

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