JP2018187740A - ソーワイヤー及び切断装置 - Google Patents
ソーワイヤー及び切断装置 Download PDFInfo
- Publication number
- JP2018187740A JP2018187740A JP2017094233A JP2017094233A JP2018187740A JP 2018187740 A JP2018187740 A JP 2018187740A JP 2017094233 A JP2017094233 A JP 2017094233A JP 2017094233 A JP2017094233 A JP 2017094233A JP 2018187740 A JP2018187740 A JP 2018187740A
- Authority
- JP
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- Prior art keywords
- wire
- saw
- tungsten
- metal wire
- saw wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 74
- 239000002184 metal Substances 0.000 claims abstract description 74
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000007747 plating Methods 0.000 claims abstract description 55
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 46
- 239000006061 abrasive grain Substances 0.000 claims abstract description 33
- 239000010937 tungsten Substances 0.000 claims abstract description 26
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 25
- 229910001080 W alloy Inorganic materials 0.000 claims abstract description 6
- 229910052702 rhenium Inorganic materials 0.000 claims description 6
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 6
- 229910000691 Re alloy Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 46
- 238000010438 heat treatment Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 20
- 238000000137 annealing Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000005491 wire drawing Methods 0.000 description 14
- 229910003460 diamond Inorganic materials 0.000 description 12
- 239000010432 diamond Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003795 desorption Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
[切断装置]
まず、本実施の形態に係るソーワイヤーを備える切断装置の概要について、図1を用いて説明する。図1は、本実施の形態に係る切断装置1の斜視図である。
図3は、本実施の形態に係るソーワイヤー10の断面図である。具体的には、図3は、ソーワイヤー10の延在方向に直交する断面を拡大した図である。
以下では、上記特徴を有するソーワイヤー10の製造方法について説明する。ソーワイヤー10の製造方法は、細線化された金属線100を作製する工程と、金属線100に複数の砥粒130を固着させる工程とを含んでいる。
ここで、ニッケルめっき層110を形成した後の熱処理の温度と、ニッケルめっき層110の脱離(めっき剥がれ)との関係について説明する。
以上のように、本実施の形態に係るソーワイヤー10は、複数の砥粒130が表面に付着したソーワイヤーであって、タングステンからなる金属線100と、金属線100の表面に設けられたニッケルめっき層110と、金属線100とニッケルめっき層110との界面に設けられた、ニッケル及びタングステンの密着層120とを備え、ニッケルめっき層110は、ソーワイヤー10が捻られた場合に、密着層120によって金属線100から剥がれない。また、例えば、金属線100の線径は、80μm以下である。
以上、本発明に係るソーワイヤー及び切断装置について、上記の実施の形態に基づいて説明したが、本発明は、上記の実施の形態に限定されるものではない。
10 ソーワイヤー
100 金属線
110 ニッケルめっき層
120 密着層
130 ダイヤモンド粒子(砥粒)
Claims (4)
- 複数の砥粒が表面に付着したソーワイヤーであって、
タングステン又はタングステン合金からなる金属線と、
前記金属線の表面に設けられたニッケルめっき層と、
前記金属線と前記ニッケルめっき層との界面に設けられた、ニッケル及びタングステンの密着層とを備え、
前記ニッケルめっき層は、前記ソーワイヤーが捻られた場合に、前記密着層によって前記金属線から剥がれない
ソーワイヤー。 - 前記金属線の線径は、80μm以下である
請求項1に記載のソーワイヤー。 - 前記タングステン合金は、レニウムとタングステンとの合金であり、
前記タングステン合金におけるレニウムの含有率は、0.1wt%以上10wt%以下である
請求項1又は2に記載のソーワイヤー。 - 請求項1〜3のいずれか1項に記載のソーワイヤーを備える切断装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017094233A JP7241294B2 (ja) | 2017-05-10 | 2017-05-10 | ソーワイヤー及び切断装置 |
CN201810161022.4A CN108858839B (zh) | 2017-05-10 | 2018-02-27 | 锯线及切断装置 |
CN201820273485.5U CN208812300U (zh) | 2017-05-10 | 2018-02-27 | 锯线及切断装置 |
US15/974,918 US10722962B2 (en) | 2017-05-10 | 2018-05-09 | Saw wire and cutting apparatus |
JP2022169345A JP2022186852A (ja) | 2017-05-10 | 2022-10-21 | ソーワイヤー及び切断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017094233A JP7241294B2 (ja) | 2017-05-10 | 2017-05-10 | ソーワイヤー及び切断装置 |
Related Child Applications (1)
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JP2022169345A Division JP2022186852A (ja) | 2017-05-10 | 2022-10-21 | ソーワイヤー及び切断装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018187740A true JP2018187740A (ja) | 2018-11-29 |
JP7241294B2 JP7241294B2 (ja) | 2023-03-17 |
Family
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JP2017094233A Active JP7241294B2 (ja) | 2017-05-10 | 2017-05-10 | ソーワイヤー及び切断装置 |
JP2022169345A Pending JP2022186852A (ja) | 2017-05-10 | 2022-10-21 | ソーワイヤー及び切断装置 |
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JP2022169345A Pending JP2022186852A (ja) | 2017-05-10 | 2022-10-21 | ソーワイヤー及び切断装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10722962B2 (ja) |
JP (2) | JP7241294B2 (ja) |
CN (2) | CN208812300U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022259927A1 (ja) * | 2021-06-11 | 2022-12-15 | パナソニックIpマネジメント株式会社 | ソーワイヤ用電着線及び金属線、並びに、ソーワイヤ用電着線の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6249319B1 (ja) * | 2017-03-30 | 2017-12-20 | パナソニックIpマネジメント株式会社 | ソーワイヤー及び切断装置 |
JP7241294B2 (ja) * | 2017-05-10 | 2023-03-17 | パナソニックIpマネジメント株式会社 | ソーワイヤー及び切断装置 |
US11358232B2 (en) * | 2017-10-16 | 2022-06-14 | Stewart-Macdonald Manufacturing Company | Rounded nut files for stringed instruments |
JP6751900B2 (ja) * | 2018-01-29 | 2020-09-09 | パナソニックIpマネジメント株式会社 | 金属線及びソーワイヤー |
CN109591210B (zh) * | 2018-12-29 | 2024-03-29 | 盛利维尔(常州)金属材料有限公司 | 一种金刚石线锯及其制备方法 |
CN112086221B (zh) * | 2020-09-17 | 2021-11-26 | 江西瑞顺超细铜线科技协同创新有限公司 | 一种银合金铜线及其制备方法 |
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JPS5135189A (ja) * | 1974-09-13 | 1976-03-25 | Lumalampan Ab | Nokobikyokinzokuwaiya |
US4139659A (en) * | 1975-06-02 | 1979-02-13 | Lumalampan Ab | Thin composite wire saw with surface cutting crystals |
JPS54116172A (en) * | 1978-03-02 | 1979-09-10 | Toshiba Corp | Manufacture for immersed type cathode |
JPH02145214A (ja) * | 1988-11-24 | 1990-06-04 | Sumitomo Electric Ind Ltd | 放電加工用電極線 |
JP2007203393A (ja) * | 2006-01-31 | 2007-08-16 | Nippon Seisen Co Ltd | ソーワイヤー及びその製造方法 |
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-
2017
- 2017-05-10 JP JP2017094233A patent/JP7241294B2/ja active Active
-
2018
- 2018-02-27 CN CN201820273485.5U patent/CN208812300U/zh active Active
- 2018-02-27 CN CN201810161022.4A patent/CN108858839B/zh active Active
- 2018-05-09 US US15/974,918 patent/US10722962B2/en active Active
-
2022
- 2022-10-21 JP JP2022169345A patent/JP2022186852A/ja active Pending
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US4139659A (en) * | 1975-06-02 | 1979-02-13 | Lumalampan Ab | Thin composite wire saw with surface cutting crystals |
JPS54116172A (en) * | 1978-03-02 | 1979-09-10 | Toshiba Corp | Manufacture for immersed type cathode |
JPH02145214A (ja) * | 1988-11-24 | 1990-06-04 | Sumitomo Electric Ind Ltd | 放電加工用電極線 |
JP2007203393A (ja) * | 2006-01-31 | 2007-08-16 | Nippon Seisen Co Ltd | ソーワイヤー及びその製造方法 |
JP2010201541A (ja) * | 2009-03-02 | 2010-09-16 | Sumitomo Electric Ind Ltd | ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022259927A1 (ja) * | 2021-06-11 | 2022-12-15 | パナソニックIpマネジメント株式会社 | ソーワイヤ用電着線及び金属線、並びに、ソーワイヤ用電着線の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108858839A (zh) | 2018-11-23 |
CN208812300U (zh) | 2019-05-03 |
US10722962B2 (en) | 2020-07-28 |
US20180326517A1 (en) | 2018-11-15 |
CN108858839B (zh) | 2022-06-21 |
JP2022186852A (ja) | 2022-12-15 |
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