JPS54116172A - Manufacture for immersed type cathode - Google Patents

Manufacture for immersed type cathode

Info

Publication number
JPS54116172A
JPS54116172A JP2374578A JP2374578A JPS54116172A JP S54116172 A JPS54116172 A JP S54116172A JP 2374578 A JP2374578 A JP 2374578A JP 2374578 A JP2374578 A JP 2374578A JP S54116172 A JPS54116172 A JP S54116172A
Authority
JP
Japan
Prior art keywords
cathode
thin plate
tungsten
wire
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2374578A
Other languages
Japanese (ja)
Inventor
Yukio Takanashi
Toshiharu Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2374578A priority Critical patent/JPS54116172A/en
Publication of JPS54116172A publication Critical patent/JPS54116172A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

PURPOSE:To remarkably reduce the intermediate process, by slicing and dicing the perforated tungsten sintering rod with multiple saw in the forming process of the cathode body. CONSTITUTION:The perforated tungsten sintering rod 21 made thick to the utmost is sliced with the multiple wire saw 28 into thin plate 22. In this case, the deterioration in the electronic emission performance and that of insulation due to the efect of impurity can be prevented when an electron tube is assembled by using tungsten wire as the wire and tungsten carbide as abrassive particles. Further, Mo- Ru alloy is soldered on the surface of the thin plate 22, electron emission substance (emitter) 23 immersed on the surface under the hydrogen furnace to the cavity hole, forming the thin plate cathode collector 24. After polishing, when dicing is made with the multiple wire saw 28, a number of square cathode bodies 25 can be obtained. These are welded on the cap 24 of the cathode support cylinder 27, heater is attached inside the support cylinder, and the immerse type cathode can be finished.
JP2374578A 1978-03-02 1978-03-02 Manufacture for immersed type cathode Pending JPS54116172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2374578A JPS54116172A (en) 1978-03-02 1978-03-02 Manufacture for immersed type cathode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2374578A JPS54116172A (en) 1978-03-02 1978-03-02 Manufacture for immersed type cathode

Publications (1)

Publication Number Publication Date
JPS54116172A true JPS54116172A (en) 1979-09-10

Family

ID=12118839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2374578A Pending JPS54116172A (en) 1978-03-02 1978-03-02 Manufacture for immersed type cathode

Country Status (1)

Country Link
JP (1) JPS54116172A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018187740A (en) * 2017-05-10 2018-11-29 パナソニックＩｐマネジメント株式会社 Saw wire and cutting device
CN111231128A (en) * 2020-01-17 2020-06-05 苏州赛万玉山智能科技有限公司 Processing method of mobile terminal equipment cover plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132171A (en) * 1974-09-12 1976-03-18 Tokyo Shibaura Electric Co GANSHINGATAINKYOKUNOSEIZOHOHO
JPS5135189A (en) * 1974-09-13 1976-03-25 Lumalampan Ab NOKOBIKYOKINZOKUWAIYA

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132171A (en) * 1974-09-12 1976-03-18 Tokyo Shibaura Electric Co GANSHINGATAINKYOKUNOSEIZOHOHO
JPS5135189A (en) * 1974-09-13 1976-03-25 Lumalampan Ab NOKOBIKYOKINZOKUWAIYA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018187740A (en) * 2017-05-10 2018-11-29 パナソニックＩｐマネジメント株式会社 Saw wire and cutting device
JP2022186852A (en) * 2017-05-10 2022-12-15 パナソニックＩｐマネジメント株式会社 Saw wire and cutting device
CN111231128A (en) * 2020-01-17 2020-06-05 苏州赛万玉山智能科技有限公司 Processing method of mobile terminal equipment cover plate

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