201111106 六、發明說明： 【發明所屬之技術領域】 本發明係關於金鋼石線鋸及該金鋼石線鋸之製造方 法。 【先前技術】 製造各種半導體裝置時，係將單結晶、多結晶、或由 非晶質矽、水晶等所構成之例如柱狀素材錠塊，藉由切割 加工切斷加工成預定厚度尺寸之薄板（晶圓）。用於將這種 高脆性材料以高精確度且低價格切斷之加工方法，有嘗試 使用將硏磨粒例如金鋼石等超硏磨粒固定在線鋸外周面之 固定硏磨粒型線鋸之方法。 此種構成有下述專利文獻1〜4。 下述專利文獻1係揭示有關於線鋸及其製造方法之發 明’其係超硏磨粒堅固地固定於線鋸且不會脫落，獲得粗 度一定且高切斷精確度之線鋸。 又’下述專利文獻2係揭示有關於線鋸之製造方法及製 造裝置之發明，其係形成低密度硏磨粒分布之電沈積線鋸。 又’下述專利文獻3係揭示有關於線鋸及其製造方法之 發明，其係加工能率高且不易斷線，而且製造效率高的線 鋸。 又’下述專利文獻4係揭示有關於電沈積線鋸工具及其 製造方法之發明，其係鋒利度優異之電沈積線鋸工具。 但是’上述專利文獻1〜4所示之線鋸及電沈積線鋸工 具’線鋸之鍍敷金屬皆爲Ni、Cu等，因此不具有充分之硬 度’而有使用時鋒利度差、容易斷線之問題。201111106 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a diamond wire saw and a method of manufacturing the diamond wire saw. [Prior Art] When manufacturing various semiconductor devices, for example, a single crystal, a polycrystal, or a columnar material ingot composed of amorphous germanium, crystal, or the like is cut into a sheet having a predetermined thickness by a cutting process. (wafer). A processing method for cutting such a high-brittle material with high precision and low price, and attempting to use a fixed honing type wire saw for fixing the outer peripheral surface of a wire saw with a superabrasive grain such as a honing grain such as diamond. The method. Such a configuration includes the following Patent Documents 1 to 4. The following Patent Document 1 discloses an invention relating to a wire saw and a method of manufacturing the same. The superabrasive grain is firmly fixed to a wire saw and does not fall off, and a wire saw having a constant thickness and high cutting accuracy is obtained. Further, Patent Document 2 listed below discloses an invention of a method and a manufacturing apparatus for a wire saw, which is an electrodeposited wire saw which forms a low-density honing grain distribution. Further, the following Patent Document 3 discloses an invention relating to a wire saw and a method of manufacturing the same, which is a wire saw having a high processing energy rate and which is not easily broken, and which has high manufacturing efficiency. Further, the following Patent Document 4 discloses an invention relating to an electrodeposited wire saw tool and a method of manufacturing the same, which is an electrodeposited wire saw tool excellent in sharpness. However, the wire saws of the wire saw and the electrodeposited wire saw tool 'wire saw shown in the above Patent Documents 1 to 4 are all made of Ni, Cu, etc., so they do not have sufficient hardness, and the sharpness is poor and easy to break when used. The problem with the line.
-4- 201111106 又’在上述專利文獻1所示之線鋸，由於係超硏磨粒藉 由鏟敷層而固定於線鋸表面之構成，因此超硏磨粒被物理 性地埋入於鍍敷層，故有保持性低之問題。 又，在上述專利文獻2、3所示之線鋸，以使用金屬被 覆於硏磨粒表面之被覆硏磨粒，不僅可物理性地保持鍍敷 層，還具有化學性亦被保持之優點。但是，硏磨粒之.保持 性提高，但被覆硏磨粒之金屬層厚皆厚，而有使用時鋒利 度受損之問題。 先行技術文獻 專利文獻 專利文獻1 日本特開平9-150314號公報 專利文獻2 日本特許第4 1 5 7724號公報 專利文獻3 日本特開2004-50301號公報 專利文獻4 日本特開2006-181701號公報 【發明內容】 因此本發明係爲了解決上述先前的問題點而硏發者， 其課題在於提供具有充分之硬度、使用時鋒利度良好、並 且不易斷線之金鋼石線鋸及該金鋼石線鋸之製造方法。 又’本發明之課題在於提供金鋼石線鋸及該金鋼石線鋸之 製造方法，其係以提高被分散保持的金鋼石硏磨粒之保持 性的金屬薄膜被覆在金屬製芯線的外表面全體之方式，使 用時無損於鋒利度。 根據上述本發明之第1特徴，由於鑛敷層係含有鎢之鎳 合金之構成’因此作爲金鋼石線鋸將能夠是具有充分之硬 度者。因此’能夠是使用時鋒利度良好並且不易斷線之金 201111106 鋼石線鋸。 又，本發明之金鋼石線鋸係除了上述本發明之第1特徴 以外’其第2特徴爲鎳合金含有lwt% ~60wt%之鎢。 根據上述本發明之第2特徴，除了上述本發明之第1特 徵的作用效果以外，由於鎳合金係含有lwt %〜60wt%之鎢 的構成，因此構成金鋼石線鋸之鍍敷層能夠作爲良好的皮 膜。 第3特徴係本發明之金鋼石線鋸係以鍍敷層被覆金屬 製芯線之外表面，並將金鋼石硏磨粒分散保持於該鍍敷層 中而成之金鋼石線鋸，其中由該鍍敷層及該金鋼石硏磨粒 所構成之金鋼石線鋸的外表面全體係被金屬薄膜所被覆 著。 根據上述本發明之第3特徴，係以鍍敷層被覆金屬製芯 線之外表面，並將金鋼石硏磨粒分散保持於該鍍敷層中而 成之金鋼石線鋸，並且係以金屬薄膜被覆前述鍍敷層及前 述金鋼石硏磨粒所構成之金鋼石線鋸的外表面全體之構 成，因此金鋼石硏磨粒係除了鍍敷層以外，又被金屬薄膜 保持，所以能夠成爲金鋼石硏磨粒之保持性高的金鋼石線 鋸。 又，本發明之金鋼石線鋸係除了上述本發明之第3特徵 以外，其第4特徴係金屬薄膜之厚度爲O.OOl/zm-l/zm。 根據上述本發明之第4特徴，除了上述本發明之第3特 徴的作用效果以外，由於係金屬薄膜之厚度爲0.001 M m~l /z m之構成，因此能夠成爲具有金鋼石硏磨粒之保持性，並 且使用時無損於鋒利度之金鋼石線鋸。 201111106 又，本發明之金鋼石線鋸係除了上述本發明之第3或第 4特徴以外，其第5特徴係金屬薄膜爲由選自Al、Mo、Nb、 Si、Ti、V、W、Y、Zr之1種或2種以上之元素所構成之合 金。 根據上述本發明之第5特徴，除了上述本發明之第3或 第4特徵的作用效果以外，由於係金屬薄膜爲由選自A1、 Mo、Nb、Si、Ti、V、W、Y、Zr之1種或2種以上之元素所 構成之合金之構成，因此能夠成爲具有高硬度之金屬薄 膜，且能夠成爲使用時無損於鋒利度之金鋼石線鋸。 又，本發明之金鋼石線鋸係除了上述本發明之第3〜第5 任一項之特徴以外，其第6特徵係金鋼石硏磨粒之平均粒徑 爲 1 // m~6 0 // m。 根據上述本發明之第6特徴，除了上述本發明之第3~ 第5任一項之特徴的作用效果以外，係金鋼石硏磨粒之平均 粒徑爲1 μ m~60 # m之構成，因此能夠成爲硏磨粒徑夠小， 硏磨粒不易脫落之金鋼石線鋸。 又，本發明之金鋼石線鋸係除了上述本發明之第3~第6 任一項之特徴以外，其第7特徵係金屬製芯線之外表面的金 鋼石硏磨粒之被覆率爲金屬製芯線之外表面全體面積的1 % » 任 6 第 3 外 第之 之線 明芯 發製 本屬 述金 上係 了於 除由 ’外 徵以 7#果 第效 之用 明 發 本 述 上 據 根 作 的 徴 特 之 項 體覆斷 全被易 面之不 表粒轉 外磨扭 之硏的 線石中 芯鋼用 製金使 屬將對 金夠是 爲能s' 率此特 覆因爲 被，成 之成能 粒構而 磨之， 硏 ％ 圍 石35範 鋼f 小 金ί：在 的 的 $ 面積限 表面率 201111106 線之金鋼石線鋸。 又，第8特徵爲本發明之金鋼石線鋸之製造方法係製造 在金屬製芯線的外表面分散地保持有金鋼石硏磨粒的金鋼 石線鋸之方法，其具有使用鎳-鎢浴，對前述金屬製芯線進 行電鎪之金鋼石硏磨粒電沈積步驟，其中該鎳-鎢浴係使金 鋼石硏磨粒分散在溶有鎳與鎢的溶液中而成。 根據上述本發明之第8特徴，由於係製造在金屬製芯線 的外表面分散地保持有金鋼石硏磨粒的金鋼石線鋸之方 法，其具有使用鎳-鎢浴，對前述金屬製芯線進行電鑛之金 鋼石硏磨粒電沈積步驟，其中該鎳-鎢浴係使金鋼石硏磨粒 分散在溶有鎳與鎢的溶液中而成之構成，因此藉由金鋼石 硏磨粒電沈積步驟，能夠在金屬製芯線之外表面形成含有 鎢之鎳合金所構成之鍍敷層，並且能夠藉由該鍍敷層將金 鋼石硏磨粒確實地分散保持於金屬製芯線之外表面。藉 此，能夠使金鋼石線鋸具有充分硬度。因而，能夠製造使 用時鋒利度良好並且不易斷線之金鋼石線鋸。 又，本發明之金鋼石線鋸之製造方法係除了上述本發 明之第8特徴以外，其第9特徴係鎳-鎢浴中之鎳與鎢的比率 以莫耳比計爲1 : 9〜9 : 1。 根據上述本發明之第9特徴，除了上述本發明之第8特 徴的作用效果以外，由於鎳-鎢浴中之鎳與鎢的比率以莫耳 比計爲1 : 9~9 : 1之構成，因此能夠穩定地獲得有充分硬度 之鎳·鎢鑛敷皮膜。 又’本發明之金鋼石線鋸之製造方法係除了上述本發 明之第8或第9特徴以外，其第10特徵係金鋼石硏磨粒電沈 201111106 積步驟爲在50 °C〜75 °C之浴溫下進行。 根據上述本發明之第10特徴，係除了上述本發明之第8 或第9特徴的作用效果以外，由於金鋼石硏磨粒電沈積步驟 係於50°C ~7 5°C之浴溫下進行之構成，因此能夠有效地降低 鍍敷膜中的内部應力，而能夠防止異常析出。藉此成爲製 造效率良好的金鋼石線鋸之製造方法。 又，本發明之金鋼石線鋸之製造方法係除了上述本發 明之第8~第10任一項之特徴以外，其第11特徴係鎳-鎢浴中 之溶液爲使檸檬酸氫二銨、甲酸鈉、硫酸鎳、鎢酸鈉溶解 而成之水溶液。 根據上述本發明之第11特徴，上述本發明之第8~第10 任一項之特徴以外，由於鎳-鎢浴中之溶液係檸檬酸氫二 銨、甲酸鈉、硫酸鎳、鎢酸鈉溶解而成之水溶液之構成， 因此鍍敷浴穩定性高、壽命長，而能夠成爲生產性優異之 金鋼石線鋸之製造方法。 又，第12特徴爲本發明之金鋼石線鋸之製造方法，其 係製造在金屬製芯線的外表面分散地保持有金鋼石硏磨粒 的金鋼石線鋸之方法，其中具有：金鋼石硏磨粒電沈積步 驟，其係使用使金鋼石硏磨粒分散在溶有鎳的溶液中而成 之鎳浴，對前述金屬製芯線進行電鍍；金屬薄膜被覆步驟， 其係對藉由前述金鋼石硏磨粒電沈積步驟使金鋼石硏磨粒 呈分散狀態鍍敷而成之金屬製芯線的外表面全體，進一步 以金屬薄膜被覆;與熱處理步驟，其係在藉由前述金屬薄膜 被覆步驟使金鋼石硏磨粒呈分散狀態鍍敷而成之金屬製芯 線的外表面全體被金屬薄膜被覆之狀態下，進行熱處埋。 201111106 根據上述本發明之第12特徴，由於係金鋼石硏磨粒分 散保持於金屬製芯線之外表面的金鋼石線鋸之製造方法， 其中具有：金鋼石硏磨粒電沈積步驟，其係使用使金鋼石 硏磨粒分散在溶有鎳的溶液中而成之鎳浴，對前述金屬製 芯線進行電鑛；金屬薄膜被覆步驟，其係對藉由前述金鋼石 硏磨粒電沈積步騾使金鋼石硏磨粒呈分散狀態鍍敷而成之 金屬製芯線的外表面全體，進一步以金屬薄膜被覆；與熱處 理步驟’其係在藉由前述金屬薄膜被覆步驟使金鋼石硏磨 粒呈分散狀態鍍敷而成之金屬製芯線的外表面全體被金屬 薄膜被覆之狀態下，進行熱處埋，因此能夠藉由金鋼石硏 磨粒電沈積步驟，使金鋼石硏磨粒確實地分散保持於金屬 製芯線之外表面。又，藉由金屬薄膜被覆步驟，能夠使金 屬薄膜確實地被覆於金鋼石硏磨粒呈分散狀態鍍敷而成之 金屬製芯線的外表面全體。又，藉由熱處理步驟，能夠使 金屬薄膜、金鋼石硏磨粒和鍍敷層之間形成化學性結合。 藉此成爲金鋼石硏磨粒之保持性高的金鋼石線鋸。 根據本發明之金鋼石線鋸及該金鋼石線鋸之製造方 法’能夠成爲具有充分之硬度、使用時鋒利度良好、並且 不易斷線之金鋼石線鋸及該金鋼石線鋸之製造方法。又， 能夠成爲分散保持於金屬製芯線之外表面的金鋼石硏磨粒 之保持性高’並且使用時無損於鋒利度之金鋼石線鋸及該 金鋼石線鋸之製造方法。 【實施方式】 實施發明之最佳形態 參照以下圖式，説明關於本發明之實施形態1及2之金 -10- 201111106 鋼石線鋸及該金鋼石線鋸之製造方法，以供理解本發明。 但是，以下説明爲本發明之實施形態，並非限定申請專利 範圍所記載之内容者。 此外’圖式之説明中，對同一要素賦予同一符號，省 略重複説明。又，圖式之尺寸比率並不一定與説明構件一 致。 (實施形態1 ) 首先參照第1圖、第2圖’説明關於本發明之實施形態1 之金鋼石線鋸。 關於本發明之實施形態1之金鋼石線鋸1，係如第1圖、 第2圖所示，爲使金鋼石硏磨粒30分散保持於被覆金屬製芯 線的外表面全體之鎪敷層20而成之金鋼石線鋸。 前述金屬製芯線1 〇係任何只要能夠電鍍外表面1 1且具 有一定強度之金屬製線即可。例如可使用鋼琴線等鋼線、 鎢線、鉬線等。 金屬製芯線10之直徑可根據被切削材之材質、形狀等 而適當變更，但0.05 mm〜0.30 mm爲佳。 前述鍍敷層20係如第1圖、第2圖所示，其係被覆金屬 製芯線10的外表面11，並且用於使金鋼石硏磨粒30分散保 持於金屬製芯線1〇者。 該鍍敷層20係由含有鎢之鎳合金所構成。藉由這種構 成，比僅由鎳構成鑛敷層20的情形，能夠提高金鋼石線鋸1 的硬度，並且能夠提高耐蝕性。藉此能夠獲得於使用時鋒 利度良好、並且不易斷線之金鋼石線鋸1。 鎳合金中的含鎢濃度爲1 w t % ~ 6 0 w t °/〇較佳。低於1 w t % [S] -11 - 201111106 則無法獲得固溶效果，超過60 wt%則無法獲得良好的皮膜。 此外，更適當爲10wt%~40wt%較佳。 鍍敷層20之厚度係對於金屬製芯線10的直徑方向之金 鋼石硏磨粒30的直徑尺寸爲20%~90%較佳。 此外，更適當爲25%〜80%較佳，再更適當爲30%〜7 0 %較佳。 前述金鋼石硏磨粒30係如第2圖所示，其係經鍍敷層32 被覆外表面31之被覆硏磨粒，以埋入於被覆金屬製芯線10 的外表面之鍍敷層20的方式，分散保持於鍍敷層20。 前述鎪敷層32係由鎳所構成。藉由這種構成，鎳與鋼 琴線等金屬製芯線10具有化學性親和性，因此不僅藉由鍍 敷層20以物理方式保持在金屬製芯線10，亦以化學方式保 持在金屬製芯線10。藉此，能夠使金鋼石硏磨粒3 0堅固地 保持於金屬製芯#10的外表面。因而，可防止使用時金鋼 石硏磨粒30之脫落。又，能夠以少量的鍍敷層20使金鋼石 硏磨粒30分散保持於金屬製芯線10，而能成爲製造效率良 好之金鋼石線鋸1。 金鋼石硏磨粒30之平均粒徑係1 A m〜60以m較佳。藉由 這種構成，硏磨粒徑夠小，因此金鋼石硏磨粒30不易從金 屬製芯線10脫落，而能成爲加工能率良好之金鋼石線鋸1。 此外，平均粒徑低於1 μ m時，硏磨粒過小，因此加工 能率降低，而超過60 μιη時，硏磨粒容易脫落。 此外，更適當爲下限超過2/zm，再更適當爲超過3// m，上限低於5 0 v m較佳。 又，金屬製芯線10之外表面11中的金鋼石硏磨粒30之 -12- 201111106 被覆率，係1%〜35%較佳。藉由這種構成，能夠將被覆率 充分地限制於小範圍，起因於金鋼石硏磨粒30被分散保 持，使得金鋼石線鋸1的彈性率變高，接著能夠抑制剛性變 大。 又，由於確保充分大的切削粉之退避空間，因此即使 如玻璃或水晶般之容易產生堵塞的材料之情形，亦能夠抑 制堵塞而更提高加工能率。 •此外，被覆率更適當爲1%〜2 5%，再更適當爲5%〜25 %較佳。 此外，本實施形態1係以1層形成鍍敷層20之構成，但 並非限於這種構成，亦能以複数層形成鍍敷層20之構成。 例如能以鎳形成内側層、以含鎢之鎳合金形成外側層 之2層。藉由這種構成，能夠成爲具有充分之硬度，並且金 鋼石硏磨粒30之保持性高的金鋼石線鋸。 接著參照第5圖〜第7圖，説明關於本發明之實施形態1 的金鋼石線鋸之製造方法。 關於本發明之實施形態1之金鋼石線鋸1係如第5圖所 示，從金屬製芯線1 0之供給源亦即輥50所供給的金屬製芯 線係以藉由滑輪51，通過脫脂槽60、酸洗槽70、水洗槽 80、鍍敷槽90、水洗槽100，捲繞於輥52的方式所製造。 前述滑輪51係用於使金屬製芯線10的進行方向變更 者’如第5圖所示，在脫脂槽60、酸洗槽70、水洗槽80、鑛 敷槽90、水洗槽1〇〇的上方及槽内設有複數個。 前述脫脂槽60係例如蓄積有氫氧化鈉（NaOH )水溶液 之槽，藉由具備該脫脂槽60之脫脂步驟，去除附著在金屬 -13- 201111106 製芯線ίο的表面之油分等污垢。 此外，蓄積在脫脂槽60之水溶液可使用任何只要是脫 脂槽通常使用者。 前述酸洗槽70係例如蓄積有鹽酸（HC1 )水溶液之槽， 藉由具備該酸洗槽70之酸洗步驟，去除附著在金屬製芯線 10的表面之氧化物層（鏽）。 此外，蓄積在酸洗槽T0之水溶液可使用任何只要是酸 洗槽通常使用者。 前述水洗槽80係蓄積有自來水、井水、純水之槽，藉 由具備該水洗槽80之水洗步驟，附著在金屬製芯線1〇的表 面之藥液被稀釋，可防止藥液混入下一步驟亦即金鋼石硏 磨粒電沈積步驟中的鍍敷層。 前述鍍敷槽90係使用使金鋼石硏磨粒30分散在溶有鎳 和鎢之溶液中而成之鎳-鎢浴，其係負責在金屬製芯線1 〇進 行電鍍之金鋼石硏磨粒電沈積步驟之槽。 以下’參照第6圖詳細地説明金鋼石硏磨粒電沈積步 驟。 金鋼石硏磨粒電沈積步驟係如第6圖所示，藉由後述陽 離子交換膜91c’使用分離成陽極室91和鏟敷室92之雙槽構 造的鍍敷槽90進行。 前述陽極室91係由連接在電源200的陽極之不溶性陽 極91a、溶液91b和陽離子交換膜91c所構成。 前述不溶性陽極91a只要是不銹鋼、鈾等任何作爲不溶 性陽極所通常使用者即可。 前述溶液9 1 b可使用除了鹽酸、硝酸以及其鹽以外的鎳 -14 - 201111106 鹽、硫酸等。鹽酸、硝酸以及其鹽在不溶性陽極上會產生 有害之氯氣、氧化氮氣體，故無法使用。 前述陽離子交換膜91c係選擇性膜，其係用於防止不溶 性陽極91a和後述之鍍敷溶液92c直接接觸，並且用於防止 在鍍敷溶液92c中作爲陰離子存在之檸檬酸等的氧化分解。 如此地，以藉由陽離子交換膜91c，使用分離成陽極室 91和鍍敷室92之雙槽構造的鍍敷槽90進行金鋼石硏磨粒電 沈積步驟之方式，能夠提高鍍敷溶液92c的穩定性，而能長 期連續鍍敷。 此外，由於在不溶性陽極91a產生的氫離子係陽離子， 因此配合通電流量，透過陽離子交換膜91c，運至鍍敷室92。 前述鍍敷室92係由連接在電源200的陽極之鎳陽極92 a 及鎢陽極92b、和鍍敷溶液92c所構成。 前述鎳陽極92a係如第6圖所示，其係形成板狀、用於 將鎳離子補給至鍍敷溶液92c者。作爲鎳陽極92a，可使用 能利用電解鎳、S-鎳等眾所周知之銨鎳之板。 此外，本實施形態1中，鎳陽極92 a係板狀之構成，但 並非限於這種構成者，使用晶片（Chip )狀之構成即可。 使用晶片狀之情形下，放入鈦製之籃中使用。 又，由於鎳陽極92a的溶解狀態爲陽離子，因此鎳陽極 92 a可以是不配置在鍍敷室92而配置在陽極室91之構成。 前述鎢陽極92b係如第6圖所示，其係形成板狀、用於 將鎢成分補給至鍍敷溶液92c者。作爲鎢陽極92b，可使用 金屬鎢。 此外，本實施形態1中，鎢陽極92b係板狀之構成，但 [S 1 -15- 201111106 並非限於這種構成者，亦可使用晶片狀之構成。使用晶片 狀的情形下，放入鈦製之籃中使用。 前述鍍敷溶液92c係使鎳和鎢溶解於硫酸鎳等水溶液 中，並且使未圖示之金鋼石硏磨粒3 0分散而成之鎳-鎢浴。 更具體而言，該鍍敷溶液9 2 c係由檸檬酸氫化銨、甲酸鈉、 硫酸鎳、鎢酸鈉所構成。 藉由這種構成，鍍敷浴之穩定性高、壽命長，因此能 成爲生產性優異之金鋼石線鋸之製造方法。 其中，鎳-鎢浴中的鎳和鎢之比例係莫耳比爲1 : 9〜9 : 1。藉由這種構成，能穩定地獲得有充分硬度之鎳-鎢鍍敷 皮膜。 使用這種鍍敷溶液92c，如第6圖所示，將金屬製芯線 10浸漬於鍍敷溶液92c，將電源200的負極連接至金屬製芯 線10，將電源200的陽極連接至不溶性陽極91a、鎳陽極 92a、鎢陽極92b，適當選擇電流密度及鍍敷時間進行電鍍， 藉此在金屬製芯線10的外表面11形成鍍敷層20，並且分散 地保持有金鋼石硏磨粒30。 前述水洗槽100係蓄積有自來水、井水、純水之槽，藉 由具備該水洗槽100之水洗步驟，將金鋼石硏磨粒30分散保 持於外表面1 1之金屬製芯線1 0係經水洗後，藉由未圖示之 熱處理步驟進行熱處理，製造金鋼石線鋸1。 此外，金鋼石硏磨粒電沈積步驟並非限於本實施形態1 者。 例如亦可在水洗槽8 0和鍍敷槽9 0之間裝設槽，用於使 用將金鋼石硏磨粒30分散於溶有錬之溶液而成之鎳浴，進 -16 - 201111106 行電鍍之構成。此外，於該情形下，不使金鋼石硏磨粒30 分散於鍍敷槽90的鍍敷溶液92c中 藉由這種構成，利用使用鎳浴之電鍍，將金鋼石硏磨 粒30暫時固定於金屬製芯線10之外表面。然後藉由使用鎳. 鎢浴之電鍍，將金鋼石硏磨粒30真正固定於金屬製芯線10 之外表面 因此，使用鎳·鎢浴之鍍敷係電流效率低且適用電流密 度之上限也低，因此相較於使用鎳浴之鍍敷，形成相同厚 度之所需時間較多，因此以藉由鎳浴將金鋼石硏磨粒30暫 時固定於金屬製芯線10之外表面的方式，能縮短鍍敷時 間。因而能製造製造效率良好之金鋼石線鋸。 [實施例1] 以下例舉實施例，進一步詳細説明本發明，但本發明 不受任何該實施例之限定。 藉由第5圖、第6圖所示之步驟，製造金鋼石線鋸1。 將直徑0.14關之長條鋼琴線，以傳送速度10m/m in連續 地浸漬於脫脂槽60、酸洗槽70、水洗槽80進行脫脂處理後， 在藉由陽離子交換膜91c分離成陽極室91和鍍敷室92之雙 槽構造的鍍敷槽90，進行施行電鍍之金鋼石硏磨粒電沈積 步驟" 其中，鍍敷槽90中的鍍敷浴之處方爲：檸檬酸氫二銨 0.4mol、甲酸鈉 0.2mol、硫酸鎳 0.2mol、鎢酸鈉 0.2mol。 又，鍍敷條件爲浴溫65t、電流密度10A/dm2、時間7.5 分、pH6.0、標準電流效率55% 又，分散在鍍敷浴之金鋼石硏磨粒30係使用以錬被覆 -17- 201111106 '外表面之鍍鎳金鋼石硏磨粒。相對於金鋼石硏磨粒之鍍鎳 量爲30 wt %，金鋼石硏磨粒30之平均粒徑爲13.4/z m。將這 種金鋼石硏磨粒30以0.25 g/L投入鍍敷室92。 經進行金鋼石硏磨粒電沈積步驟後，在水洗槽10 0水洗 結束電沈積後之金屬製芯線10，進一步以600度進行熱處 理，獲得硬度1000HV (維氏硬度）之金鋼石線鋸。該金鋼 石線鋸的表面之鎢比例爲40 wt%。 作爲參考資料，將鎢40 wt %之鎳-鎢合金鍍敷之熱處理 的硬化變化顯示於第7圖。 [實施例2] 根據第5圖、第6圖所示之步驟，製造金鋼石線鋸。 將直徑0.14腿之長條鋼琴線，以傳送速度10m/min連續 地浸漬於脫脂槽60、酸洗槽70、水洗槽80進行脂處理後， 於未圖示之鍍敷槽，使用使金鋼石硏磨粒30分散於溶有鎳 之溶液中而成之鎳浴，進行電鍍。 其中，鎳浴之處方爲硫酸鎳6水合物240g/L、氯化鎳6 水合物45g/L、硼酸30g/Le 又，鍍敷條件爲浴溫50°C、電流密度20A/dm2、時間1 分、p Η 4 · 0。 又，分散於鎳浴之金鋼石硏磨粒30係使用以鎳被覆外 表面之鑛鎳金鋼石硏磨粒。相對於金鋼石硏磨粒之鍍鎳量 爲30 wt %，金鋼石硏磨粒30之平均粒徑爲13.4/zm。將這種 金鋼石硏磨粒30以0.25 g/L投入溶有鎳之溶液。 其結果可形成與使用鎳-鎢浴之電鍍3.5分鐘同樣厚度 的鍍鎳。 -18- 201111106 然後，藉由陽離子交換膜91c，以分離成陽極室91和鍍 敷室92之雙槽構造的鍍敷槽90，使用鎳-鎢浴進行電鍍。 其中，鍍敷槽90的鍍敷浴之處方爲檸檬酸氫二銨 0,4mol、甲酸鈉 0.2mol、硫酸鎮 0.2mol、鎢酸鈉 0.2mole 又，鍍敷條件爲浴溫65°C、電流密度l〇A/dm2、時間3.75 分、pH6.0、標準電流效率55%。 然後，在水洗槽1〇〇水洗金屬製芯線10，進一步以600 度進行熱處理。 其結果獲得具有與實施例1所示之金鋼石線鋸相同程 度之硬度9 5 0HV之金鋼石線鋸。 該金鋼石線据的表面之鎢比例爲38wt%。 (實施形態2 ) 首先，參照第3圖、第4圖，説明關於本發明之實施形 態2的金鋼石線鋸。 關於本發明之實施形態2之金鋼石線鋸1係如第3圖、第 4圖所示，其係以鍍敷層2 0被覆金屬製芯線10的外表面11， 並且將金鋼石硏磨粒30分散保持於該鍍敷層20之金鋼石線 鋸，進一步係以金屬薄膜40被覆於鍍敷層20及金鋼石硏磨 粒3 0所構成之金鋼石線鋸的外表面全體之金鋼石線鋸。 前述金屬製芯線10係可電鍍外表面11，只要是任何具 有一定強度的金屬製線皆可。例如可使用鋼琴線等鋼線、 鎢線、鉬線等。 金屬製芯線10的直徑係根據被削材之材質、形狀等而 可適當變更，但以0.05 min〜0.30 mm爲佳。 前述鍍敷層20係如第4圖所示，其係被覆金屬製芯線1 0 201111106 的外表面11，並且將金鋼石硏磨粒3 0散保持於金屬製芯線 10者。 該鍍敷層20係由如鎳（Ni )或鎳-鎢合金之鎳合金所構 成。當然不限定於鎳（Ni)，只要是任何構成金鋼石線鋸的 鑛敷層之金屬或者通常用的合金皆可，但如後述，經由金 屬薄膜40和熱處理步驟構成合金並且形成化學性結合者爲 佳。 鍍敷層20之厚度係相對於金屬製芯線10之直徑方向的 金鋼石硏磨粒30之直徑尺寸爲5%〜9 0%較佳。 此外，更適當係以25%〜80%爲佳，進一步更適當係以 30% 爲佳。 前述金鋼石硏磨粒3 0係如第4圖所示，以被埋入於被覆 金屬製芯線1〇的外表面11之鍍敷層20的方式，分散保持於 鍍敷層2〇。 金鋼石硏磨粒30之平均粒徑係以1 m〜60 μ m爲佳。藉 由這種構成，由於硏磨粒徑夠小，因此金鋼石硏磨粒3 0不 易從金屬製芯線1〇脫落，而能夠成爲加工能率良好之金鋼 石線鋸1。 此外，若平均粒徑爲低於1 μ m，則硏磨粒過小，因此 加工能率降低，若超過60μιη’則硏磨粒容易脫落。 此外，更適當係下限爲2^m以上、再更適當爲3#m以 上、上限爲50/zm以下較佳。 又，金屬製芯線1〇的外表面11的金鋼石硏磨粒30之被 覆率係1%〜35%爲佳。藉由這種構成，能將被覆率限制在 充分小的範圍，起因於金鋼石硏磨粒30被分散保持之金鋼 -20- 201111106 石線鋸1的彈性率變高且剛性變大的情形受至! 又，由於確保充分大的切削粉之退避空 如玻璃或水晶般之容易產生堵塞的材料之情 制堵塞而更提高加工能率。 此外，被覆率更適當爲1%〜2 5%，再更 %較佳。 前述金屬薄膜40係被覆由鑛敷層20及金 所構成之金鋼石線鋸1的外表面全體之金屬薄 言，如第4圖所示，其係被覆由鍍敷層20的外 石硏磨粒30的外表面31所構成之金鋼石線裁 體者。 藉由這種構成，能夠更堅固地保持以鍍 持於金屬製芯線1〇的外表面11之金鋼石硏磨 成爲金鋼石硏磨粒30之保持性高的金鋼石線 金屬薄膜40係由選自鋁（A1)、鉬（Mo 矽（S i )、鈦（Ti )、釩（V )、鎢（W )、釔 之1元素所構成之金屬或2以上之元素所構 成。藉由這種構成，金鋼石線鋸通常在經由 爲最終步驟製造時’由於銘（A1)、組（Mo 矽（S i )、鈦（Ti)、釩（V )、鎢（W)、釔 任一金屬皆以經由熱處理步驟的方式’而能 20的鎳（Ni)形成合金，因此能成爲具有高 線鋸1。因此能防止使用時的斷線。 又，鋁（A1)、鉬（Mo)、鈮（Nb)、矽（ 釩（V ) ' 鎢（W )、釔（Y )、锆（Zr )任一 1抑制。 間，因此即使 形，亦能夠抑 適當爲5%〜25 鋼石硏磨粒30 ，膜。更具體而 表面2 1和金鋼 导1之外表面全 敷層20分散保 粒3 0。因此能 鋸1。 )、鈮（Nb)、 (Y)、锆（Z〇 成之合金所構 熱處理步驟作 )、鈮（Nb)、 (Y)、锆（Zr) 與構成鍍敷層 硬度之金鋼石 Si )、鈦（Ti )、 金屬皆以經由 -21- 201111106 熱處理步驟的方式’與碳所構成的單體亦即金鋼石硏磨粒 30進行反應，成爲碳化金屬。因此’能成爲具有局硬度之 金鋼石線鋸1°因而’能成爲使用時鋒利度良好之金鋼石線 鋸1。 再者，藉由以金屬薄膜40被覆由鍍敷層20及金鋼石硏 磨粒30所構成的金鋼石線鋸1之外表面全體之構成的方 式，再藉由構成金屬薄膜40之鋁（A1)、鉬（Mo)、鈮（Nb)' 矽（Si)、鈦（Ti)、釩（V )、鎢（W)、釔（Y)、鉻（Zr) 任一金屬皆經由熱處理步驟的方式’鎳（Ni)所構成之鑛 敷層20及金鋼石硏磨粒30之間形成化學性結合。因此，能 成爲金鋼石硏磨粒30之保持性高的金鋼石線鋸1。 金屬薄膜40的厚度爲0.001// m~l"m爲佳。若低於 O.OOl/zm，則金鋼石硏磨粒30之保持性不足，若爲超過1 # m者，則使用時無法獲得良好的鋒利度。如此地，以使金 屬薄膜40的厚度爲薄至O.OOlym〜1/zm者的方式，能謀求 金鋼石硏磨粒3 0之高保持性和使用時鋒利度良好之兩者成 立的金鋼石線鋸1。 此外，金屬薄膜40的厚度更適當爲0.01// m〜〇.1/zm較 佳。 接著，參照第8圖説明關於本發明之實施形態2的金鋼 石線鋸之製造方法。 關於本發明之實施形態2的金鋼石線鋸1，係如第8圖簡 潔地顯示，從金屬製芯線1 〇的供給源亦即輥50所丨共，給2纟 屬製芯線10，係藉由滑輪51，通過脫脂槽60、酸洗槽7〇、 水洗糟80、鍍敷槽90、水洗槽100、金屬薄膜形成裝置3〇〇、 [S] -22- 201111106 熱處理裝置400，捲繞在輥52所製造。 前述滑輪51係用於使金屬製芯線1〇的進行方向變更 者’如第8圖所示，在脫脂槽60、酸洗槽70、水洗槽80、鍍 敷槽90、水洗槽100、金屬薄膜形成裝置300、熱處理裝置 400的上方及槽内、裝置内設有複數個。 前述脫脂槽6 0係蓄積例如氫氧化鈉（n a Ο Η )水溶液之 槽，藉由具備該脫脂槽60之脫脂步驟，去除附著於金屬製 芯線10的表面之油分等污垢。 此外，蓄積在脫脂槽60之水溶液只要是任何脫脂槽通 常使用者即可。 前述酸洗槽70係蓄積例如鹽酸（HC1 )水溶液之槽，藉 由具備該酸洗槽70之酸洗步驟，去除附著於金屬製芯線10 的表面之氧化物層（鏽）。 此外，蓄積在酸洗槽70之水溶液只要是任何酸洗槽通 常使用者即可。 前述水洗槽8 0係蓄積自來水、井水、純水之槽，藉由 具備該水洗槽80之水洗步驟，稀釋附著在金屬製芯線10的 表面之藥液，能防止藥液混入下一步驟亦即金鋼石硏磨粒 電沈積步驟中的鍍敷層。 前述鍍敷槽90係負責對金屬製芯線10進行電鍍之金鋼 石硏磨粒電沈積步驟之槽。金鋼石硏磨粒電沈積步驟係如 第8圖簡潔地顯示，其係對通過（具備使金鋼石硏磨粒3 0分 散於溶有鎳之溶液92c而成之鎳浴的）鍍敷槽90的金屬製芯 線10，而連接電源200之負極，且其係對浸漬在鍍敷槽90 的鎳腸極92a連接電源200之正極而進行。此外，雖然未圖 [S] -23- 201111106 示，但本發明之實施形態1的鍍敷槽及電極構成亦可進行如 錬-鶴合金之錬合金鏡敷。 其中，分散於鍍敷槽90之金鋼石硏磨粒30係使用事先 經於陽離子系界面活性劑溶液中處理者。藉由這種構成， 能使金鋼石硏磨粒30帶正電荷。因此，藉由電力（庫倫力） 之吸附效果而能使金鋼石硏磨粒30吸附於連接在負極之金 屬製芯線10。因而，在獲得鍍敷帶來的硏磨粒保持作用之 前，附著於金屬製芯線10的金鋼石硏磨粒30亦不易剝落， 因此鍍提高敷槽90中的金屬製芯線10之傳送速度，而能提 高製造效率。 此外’鍍敷槽90中的金屬製芯線1〇之傳送速度爲 lm/min~100m/min較佳。 又’作爲陽離子系界面活性劑，可使用單乙醇胺、三 乙醇胺等》 藉由該金鋼石硏磨粒電沈積步驟，在金屬製芯線1〇的 外表面11形成鍍敷層20，並且將金鋼石硏磨粒30分散保持 於該鍍敷層20。 前述水洗槽1 0 0係蓄積有自來水、井水、純水之槽，藉 由具備該水洗槽100之水洗步驟，將金鋼石硏磨粒30分散保 持於外表面11之金屬製芯線10進行水洗。 前述金屬薄膜形成裝置3 0 0係負責藉由金鋼石硏磨粒 電沈積步驟’使金鋼石硏磨粒30呈分散狀態鍍敷而成之金 屬製芯線10的外表面全體，進一歩以金屬薄膜4〇被覆之金 屬薄膜被覆步驟之裝置。 該金屬薄膜形成裝置3 00於第8圖中雖未詳細地圖示， -24- 201111106 但其係於金鋼石硏磨粒3 0呈分散狀態鍍敷而成之金屬製芯 線10的外表面全體，藉由濺鍍法形成金屬薄膜40之裝置。 如此地藉由金屬薄膜被覆步驟，在藉由金鋼石硏磨粒 電沈積步驟使金鋼石硏磨粒3 0呈分散狀態鍍敷而成之金屬 製芯線10的外表面全體進一歩以金屬薄膜40被覆之狀態 下，能更堅固地保持以鍍敷層2 0分散保持於金屬製芯線10 的外表面11之金鋼石硏磨粒30。因此，能成爲金鋼石硏磨 粒3 0之保持性高的金鋼石線鋸1。 作爲構成金屬薄膜4 0之金屬，可使用選自鋁（Α1)、鉬 (Mo)、鈮（Nb)、矽（Si)、鈦（Ti)、釩（V)、鎢（W)' 釔（Y )、锆（Zr )之1元素所構成的金屬或2以上之元素所 構成之合金。 金屬薄膜40的厚度爲0.001# m〜1/zm較佳。若低於 0.001/zm，則金鋼石硏磨粒30之保持性不足，若爲超過1 // m者，則使用時無法獲得良好的鋒利度。如此地，以使金 屬薄膜40的厚度爲薄至O.OOlym〜l/zm者的方式，能謀求 金鋼石硏磨粒30之高保持性和使用時鋒利度良好之兩者成 立的金鋼石線鋸1。 此外，金屬薄膜的厚度更適當爲0.01/z m〜o.i# 佳。 又，本實施形態2中，係藉由真空鍍敷亦即截鍵法形成 金屬薄膜40之構成，但並非限於這種構成者，亦可藉自pVD (物理蒸鍍法）或CVD (化學蒸鍍法）等其他真空 無電電鍍形成金屬薄膜40。 .前述熱處理裝置400係負責藉由金屬薄膜被覆步驟，使 -25- 201111106 金鋼石硏磨粒30呈分散狀態鍍敷而成之金屬製芯線10的外 表面全體，再於經金屬薄膜40被覆之狀態下進行熱處理之 熱處理步驟之裝置。 進行該熱處理步驟可獲得以下之效果。 首先，構成金屬薄膜40之鋁（A1)、鉬（Mo)、鈮（Nb)、 矽（Si)、鈦（Ti)、釩（V)、鎢（W)、釔（Y)、銷（Zr) 之任一金屬皆以經由熱處理步驟的方式’形成構成鍍敷層 20的鎳（Ni )和合金。 因此，能成爲具有高硬度之金鋼石線鋸i。因而’能防 止使用時的斷線。 又，構成金屬薄膜40之鋁（A1)、鉬（Mo)、鈮（Nb)、 矽（Si )、鈦（Ti )、fL ( V )、鎢（W )、釔（Y )、銷（Zr ) 之任一金屬皆以經由熱處理步驟的方式’與碳所構成的單 體亦即金鋼石硏磨粒30進行反應’成爲碳化金屬。 因此，能成爲具有高硬度之金鋼石線鋸1。因而’能成 爲使用時鋒利度良好之金鋼石線鋸1° 再者，構成金屬薄膜40之鋁（A1)、鉬（Mo)、鈮（Nb)、 砂（Si)、駄（Ti)、訊（V )、鶴（W)、纪（Y)、銷（Zr) 之任一金屬皆以經由熱處理步驟的方式’在鎳（Ni )所構 成的鍍敷層20及金鋼石硏磨粒30之間形成化學性結合。因 而，能成爲金鋼石硏磨粒30之保持性高的金鋼石線鋸1。 此外，熱處理步驟的溫度、時間等熱處理條件，係根 據構成金屬製芯線1〇的材質及金屬薄膜40之金屬或合金的 種類而適當設定。 經由以上步驟製造金鋼石線鋸1。 -26- 201111106 [實施例3] 以下例舉實施例更詳細地説明本發明，但本發明並不 受該實施例任何限定。 藉由第8圖所示之步驟，製造金鋼石線鋸1。 將直徑0.14腦之長條鋼琴線，以傳送速度l〇m/min連續 地浸漬於脫脂槽70、酸洗槽80、水洗槽90進行脂處理後， 於具備鎳浴之鍍敷槽100,實行進行電鍍之金鋼石硏磨粒電 沈積步驟。 .其中，鍍敷槽100的鎳浴之處方爲硫酸鎳6水合物 240g/L、氯化鎳6水合物45g/L、硼酸30g/L。 該鎳浴中，投入1 g/L濃度之經於陽離子系界面活性劑 溶液中處理之金鋼石硏磨粒。金鋼石硏磨粒30之平均粒徑 爲13.4μπι，作爲陽離子系界面活性劑，可使用單乙醇胺和 三乙醇胺之混合物。 又，鍍敷條件爲浴溫50°C、電流密度20A/dm2、時間90 秒。 藉此，獲得具有6yin之鍍敷厚度的金鋼石線鋸。 且藉由濺鍍法以〇.〇5/zm厚度的鈦（Ti)被覆於該金鋼 石線鋸之外表面全體》 然後，進行500°C、30秒之熱處理，獲得金鋼石線鋸1。 如以上製作而成的本發明之金鋼石線鋸，能夠利用於 作爲切斷矽錠塊等高脆性材料之線鋸工具。 【圖式簡單說明】 第1係顯示關於本發明之實施形態1的金鋼石線鋸的 一部分之立體圖。 -27- 201111106 第2圖係關於本發明之實施形態1的金鋼石線鋸之剖 視圖，（a)爲金鋼石線鋸之軸的直角方向之全體剖視圖，（b) 爲金鋼石線鋸之軸的直角方向之部分放大剖視圖。 第3圖係顯示關於本發明之實施形態2的金鋼石線鋸 之一部分之立體圖。 第4圖係關於本發明之實施形態2的金鋼石線鋸之剖視 圖，（a)爲金鋼石線鋸之軸的直角方向之全體剖視.圖，（b) 爲金鋼石線鋸之軸的直角方向之部分放大剖視圖。 第5圖係顯示關於本發明之實施形態1的金鋼石線鋸之 製造步驟簡略化之圖。 第6圖係關於本發明之實施形態1的金鋼石線鋸製造 步驟中的金鋼石硏磨粒電沈積步驟之簡略圖。 第7圖係顯示本發明之實施形態1中的鎢4〇wt%%之鎳-鎢合金鍍敷的熱處理時之硬化變化圖。 第8圖係顯示關於本發明之實施形態2的金鋼石線鋸製 造步驟之簡略圖。 【主要元件符號說明】 1 金 鋼 石 線 鋸 10 金 屬 製 -44- 心 線 11' 2 1、3 1 外 表 面 20 > 32 鍍 敷 層 30 金 鋼 石 硏 磨粒 40 金 屬 薄 膜 50、 52 輥 5 1 滑 輪 -28- 201111106 60 脫 70 酸 80 水 90 鍍 9 1 陽 9 1a 不 9 1b 溶 9 1c 陽 92 鍍 92a 鎳 92b 鶴 92c 鍍 100 水 200 電 3 00 金 400 熱 脂槽 洗槽 洗槽 敷槽 極室 溶性陽極 液 極交換膜 敷室 陽極 陽極 敷溶液 洗槽 源 屬薄膜形成裝置 處理裝置 -29--4- 201111106 Further, in the wire saw shown in the above Patent Document 1, since the superabrasive grains are fixed to the surface of the wire saw by the shovel layer, the superabrasive grains are physically embedded in the plating. The layer is coated, so there is a problem of low retention. Moreover, in the wire saw shown in the above-mentioned Patent Documents 2 and 3, the coated honing particles coated with the metal on the surface of the honing grain can not only physically hold the plating layer but also have the advantage of being chemically retained. However, honing the grain. The retention is improved, but the metal layer covered with the abrasive grains is thick and thick, and the sharpness is damaged when used. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION Therefore, the present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a diamond wire saw having sufficient hardness, good sharpness in use, and which is not easily broken, and the diamond. The manufacturing method of wire saw. Further, an object of the present invention is to provide a diamond wire saw and a method for producing the diamond wire saw, which are coated with a metal film which improves the retention of the dispersed honing particles of the diamond. The way the outer surface is the whole, the use is not detrimental to the sharpness. According to the first feature of the present invention described above, since the mineral deposit layer contains the composition of the nickel alloy of tungsten, it can be sufficiently hard as a diamond wire saw. Therefore, it can be a gold 201111106 steel wire saw with good sharpness and difficulty in disconnection. Further, the diamond wire saw of the present invention is not limited to the first feature of the present invention described above. The second feature is that the nickel alloy contains 1 wt% to 60 wt% of tungsten. According to the second aspect of the present invention, in addition to the above-described effects of the first aspect of the present invention, since the nickel alloy contains 1 wt% to 60 wt% of tungsten, the plating layer constituting the diamond wire saw can be used as the second layer. Good film. The third special feature is the diamond wire saw of the present invention, which is formed by coating a surface of a metal core wire with a plating layer, and dispersing and retaining the diamond honing abrasive particles in the plating layer. The entire surface of the outer surface of the diamond wire saw composed of the plating layer and the diamond honing abrasive is covered with a metal film. According to the third aspect of the present invention, the outer surface of the metal core is coated with a plating layer, and the diamond honing particles are dispersed and held in the plating layer to form a diamond wire saw. The metal thin film is covered with the entire outer surface of the diamond wire saw formed by the plating layer and the diamond honing abrasive grains. Therefore, the diamond honing abrasive system is held by the metal thin film in addition to the plating layer. Therefore, it can become a diamond wire saw with high retention of diamond honing particles. Further, the diamond wire saw of the present invention has a thickness of the fourth special lanthanum metal film of the present invention in addition to the third feature of the present invention. OOl/zm-l/zm. According to the fourth aspect of the present invention, in addition to the above-described effects of the third aspect of the present invention, the thickness of the metal thin film is 0. With the composition of 001 M m~l /z m, it can be used as a diamond wire saw with the retention of diamond honing particles and without damage to sharpness. Further, in addition to the third or fourth feature of the present invention described above, the fifth special metal film of the present invention is selected from the group consisting of Al, Mo, Nb, Si, Ti, V, W, and the like. An alloy composed of one or two or more elements of Y and Zr. According to the fifth aspect of the present invention, in addition to the effects of the third or fourth feature of the present invention, the metal thin film is selected from the group consisting of A1, Mo, Nb, Si, Ti, V, W, Y, and Zr. Since the composition of the alloy composed of one or two or more elements can be a metal thin film having high hardness, and can be used as a diamond wire saw which does not impair sharpness when used. Further, in addition to the features of the third to fifth aspects of the present invention, the diamond wire saw of the present invention has an average particle diameter of the first aspect of the diamond honing particles of 1 // m to 6 0 // m. According to the sixth aspect of the present invention, in addition to the effects of the features of the third to fifth aspects of the present invention, the average particle diameter of the diamond honing particles is from 1 μm to 60 #m. Therefore, it can be a diamond wire saw with a small diameter and a honing grain which is not easy to fall off. Further, the diamond wire saw of the present invention is characterized in that, in addition to the features of the third to sixth aspects of the present invention, the seventh feature is the coverage of the diamond honing particles on the outer surface of the metal core wire. 1% of the total area of the outer surface of the metal core wire » 任6 The third outer line of the Ming dynasty issued by the genus of the genus is described in the text of the use of the external levy 7# fruit effect According to the roots of the special body, the body is completely replaced by the non-grained and the outer surface of the easy-to-face, and the core stone used in the core steel is made of gold, which is enough for the gold. It is made into a grain structure and grinds it, 硏% Perimeter 35 Fan Steel f Xiaojin ί: In the $ area limited surface rate 201111106 line of diamond wire saw. Further, the eighth feature is a method for producing a diamond wire saw of the present invention, which is a method for producing a diamond wire saw in which a diamond honing abrasive grain is dispersedly held on an outer surface of a metal core wire, which has nickel- a tungsten bath, wherein the metal core wire is subjected to a step of electroplating a diamond granule electrodeposition process, wherein the nickel-tungsten bath system disperses the diamond honing particles in a solution in which nickel and tungsten are dissolved. According to the eighth aspect of the present invention, there is provided a method of manufacturing a diamond wire saw in which a diamond granule is dispersedly held on an outer surface of a metal core wire, which has a nickel-tungsten bath and is made of the above metal. The core wire is subjected to an electroplating step of the diamond honing abrasive grain of the electric ore, wherein the nickel-tungsten bath system is formed by dispersing the diamond honing abrasive particles in a solution in which nickel and tungsten are dissolved, so that the diamond is formed by the diamond In the honing grain electrodeposition step, a plating layer made of a nickel alloy containing tungsten can be formed on the outer surface of the metal core wire, and the diamond honing particles can be reliably dispersed and held in the metal by the plating layer. The outer surface of the core wire. Thereby, the diamond wire saw can be made to have sufficient hardness. Therefore, it is possible to manufacture a diamond wire saw which is sharp in use and is not easily broken. Further, in the method for producing a diamond wire saw according to the present invention, in addition to the eighth aspect of the present invention, the ratio of nickel to tungsten in the ninth special nickel-tungsten bath is 1:9 in a molar ratio. 9 : 1. According to the ninth feature of the present invention, in addition to the effects of the eighth aspect of the present invention, the ratio of nickel to tungsten in the nickel-tungsten bath is constituted by a molar ratio of 1:9 to 9:1. Therefore, a nickel-tungsten deposit film having sufficient hardness can be stably obtained. Further, the manufacturing method of the diamond wire saw of the present invention is the same as the eighth or ninth feature of the present invention described above, and the tenth characteristic of the diamond 硏 粒 粒 2011 201111106 step is 50 ° C to 75 It is carried out at a bath temperature of °C. According to the tenth feature of the present invention described above, in addition to the above-described effects of the eighth or ninth aspect of the present invention, the step of depositing the diamond honing particles is carried out at a bath temperature of 50 ° C to 75 ° C. With this configuration, the internal stress in the plating film can be effectively reduced, and abnormal precipitation can be prevented. This makes it a manufacturing method for a diamond wire saw with good manufacturing efficiency. Further, in the method for producing a diamond wire saw according to the present invention, in addition to the characteristics of the eighth to tenth aspects of the present invention, the solution in the eleventh special nickel-tungsten bath is diammonium hydrogen citrate. An aqueous solution obtained by dissolving sodium formate, nickel sulfate, and sodium tungstate. According to the eleventh aspect of the present invention, in addition to the feature of any one of the eighth to tenth aspects of the present invention, the solution in the nickel-tungsten bath is dissolved in diammonium hydrogen citrate, sodium formate, nickel sulfate, or sodium tungstate. Since the composition of the aqueous solution is high, the plating bath has high stability and long life, and can be used as a method for producing a diamond wire saw which is excellent in productivity. Further, the twelfth feature is a method for producing a diamond wire saw of the present invention, which is a method for producing a diamond wire saw in which a diamond honing abrasive grain is dispersedly held on an outer surface of a metal core wire, wherein: a step of depositing a diamond granule by using a nickel bath formed by dispersing a diamond honing abrasive in a solution in which nickel is dissolved, and plating the metal core wire; a metal film coating step, which is a pair The outer surface of the metal core wire formed by depositing the diamond honing particles in a dispersed state by the above-described diamond granule electrodeposition step, further coated with a metal film; and the heat treatment step is performed by In the metal film coating step, the entire outer surface of the metal core wire in which the diamond honing particles are plated in a dispersed state is covered with a metal thin film, and is thermally buried. According to the twelfth feature of the present invention described above, a method for manufacturing a diamond wire saw having a diamond honing abrasive particle dispersed and held on a surface of a metal core wire, wherein: a diamond granule electrodeposition step, The present invention uses a nickel bath in which a diamond honing abrasive particle is dispersed in a solution in which nickel is dissolved, and the metal core wire is subjected to electro-mineralization; a metal film coating step is performed on the diamond-coated granule by the aforementioned diamond The electrodeposition step causes the entire outer surface of the metal core wire to be plated in a dispersed state, and is further coated with a metal film; and the heat treatment step is performed by the metal film coating step The entire surface of the outer surface of the metal core wire in which the stone core is plated in a dispersed state is covered with a metal film, and is thermally buried. Therefore, the diamond can be formed by the electrodeposition step of the diamond honing grain. The honing particles are surely dispersed and held on the outer surface of the metal core wire. Further, by the metal film coating step, the metal thin film can be surely coated on the entire outer surface of the metal core wire in which the diamond honing particles are plated in a dispersed state. Further, by the heat treatment step, chemical bonding can be formed between the metal thin film, the diamond granules, and the plating layer. In this way, it becomes a diamond wire saw with high retention of diamond granules. The diamond wire saw and the method for manufacturing the diamond wire saw according to the present invention can be a diamond wire saw with sufficient hardness, good sharpness in use, and not easy to break, and the diamond wire saw Manufacturing method. Further, it is possible to form a diamond wire saw which is highly retained in the surface of the outer surface of the metal core wire and which does not impair the sharpness when used, and a method of manufacturing the diamond wire saw. BEST MODE FOR CARRYING OUT THE INVENTION A steel wire saw and a method for manufacturing the diamond wire saw according to Embodiments 1 and 2 of the present invention will be described with reference to the following drawings for understanding the present invention. invention. However, the following description is based on the embodiments of the present invention and is not intended to limit the scope of the claims. In the description of the drawings, the same reference numerals will be given to the same elements, and the description will be omitted. Moreover, the dimensional ratios of the drawings are not necessarily consistent with the illustrative components. (Embodiment 1) First, a diamond wire saw according to Embodiment 1 of the present invention will be described with reference to Figs. 1 and 2'. The diamond wire saw 1 according to the first embodiment of the present invention is formed by dispersing and holding the diamond honing particles 30 on the outer surface of the coated metal core wire as shown in Figs. 1 and 2 . Layer 20 made of diamond wire saw. The above-mentioned metal core wire 1 can be any metal wire which can be plated with the outer surface 1 1 and has a certain strength. For example, a steel wire such as a piano wire, a tungsten wire, a molybdenum wire, or the like can be used. The diameter of the metal core wire 10 can be appropriately changed depending on the material, shape, and the like of the workpiece, but 0. 05 mm~0. 30 mm is preferred. The plating layer 20 is coated with the outer surface 11 of the metal core 10 as shown in Figs. 1 and 2, and is used to disperse and hold the diamond honing particles 30 to the metal core wire. The plating layer 20 is composed of a nickel alloy containing tungsten. With this configuration, the hardness of the diamond wire saw 1 can be improved and the corrosion resistance can be improved as compared with the case where the mineral layer 20 is composed only of nickel. Thereby, it is possible to obtain a diamond wire saw 1 which is excellent in sharpness during use and which is not easily broken. The tungsten-containing concentration in the nickel alloy is preferably 1 w t % ~ 60 w t ° / 〇. Below 1 w t % [S] -11 - 201111106, the solid solution effect cannot be obtained, and if it exceeds 60 wt%, a good film cannot be obtained. Further, it is more preferably from 10% by weight to 40% by weight. The thickness of the plating layer 20 is preferably 20% to 90% of the diameter of the diamond granules 30 in the diameter direction of the metal core wire 10. Further, it is more preferably 25% to 80%, more preferably 30% to 70%. As shown in Fig. 2, the diamond honing abrasive particles 30 are coated with the honing abrasive grains coated on the outer surface 31 by the plating layer 32 to be embedded in the plating layer 20 of the outer surface of the coated metal core wire 10. The manner of dispersion is maintained on the plating layer 20. The ruthenium coating layer 32 is made of nickel. With such a configuration, the metal core wire 10 such as nickel and the steel wire has chemical affinity, and therefore is not only physically held by the metal core 10 by the plating layer 20, but also chemically held on the metal core wire 10. Thereby, the diamond honing particles 30 can be firmly held on the outer surface of the metal core #10. Therefore, the falling off of the diamond granules 30 during use can be prevented. Further, the diamond honing particles 30 can be dispersed and held on the metal core wire 10 with a small amount of the plating layer 20, and the diamond wire saw 1 can be manufactured with good productivity. The average particle diameter of the diamond honing particles 30 is preferably 1 A m to 60 m. According to this configuration, since the honing particle diameter is sufficiently small, the diamond honing abrasive grains 30 are less likely to fall off from the metal core wire 10, and can be a diamond wire saw 1 having a good processing efficiency. Further, when the average particle diameter is less than 1 μm, the honing particles are too small, so the processing energy rate is lowered, and when it exceeds 60 μm, the honing particles are liable to fall off. Further, it is more preferable that the lower limit exceeds 2/zm, more suitably exceeds 3//m, and the upper limit is less than 50%. Further, the coverage of the diamond honing particles 30 in the outer surface 11 of the metal core wire 10 is preferably from 1% to 35%. With this configuration, the coverage ratio can be sufficiently limited to a small range, and the diamond honing particles 30 are dispersed and held, so that the elastic modulus of the diamond wire saw 1 becomes high, and then the rigidity can be suppressed from increasing. Further, since a sufficiently large retreating space for the cutting powder is secured, even in the case of a material which is likely to cause clogging like glass or crystal, the clogging can be suppressed and the processing efficiency can be further improved. • In addition, the coverage ratio is more suitably 1% to 25%, and more preferably 5% to 25%. Further, in the first embodiment, the plating layer 20 is formed in one layer. However, the configuration is not limited to this configuration, and the plating layer 20 may be formed in a plurality of layers. For example, the inner layer can be formed of nickel, and the outer layer of the outer layer can be formed of a nickel alloy containing tungsten. According to this configuration, it is possible to form a diamond wire saw having sufficient hardness and high retention of the diamond honing particles 30. Next, a method of manufacturing a diamond wire saw according to Embodiment 1 of the present invention will be described with reference to Figs. 5 to 7 . According to the diamond wire saw 1 of the first embodiment of the present invention, as shown in Fig. 5, the metal core wire supplied from the roller 50 which is a supply source of the metal core wire 10 is degreased by the pulley 51. The tank 60, the pickling tank 70, the water washing tank 80, the plating tank 90, and the water washing tank 100 are manufactured by being wound around the roll 52. The pulley 51 is used to change the direction in which the metal core wire 10 is changed, as shown in Fig. 5, above the degreasing tank 60, the pickling tank 70, the water washing tank 80, the mineral tank 90, and the water washing tank 1 There are a plurality of slots in the slot. The degreasing tank 60 is, for example, a tank in which an aqueous solution of sodium hydroxide (NaOH) is accumulated, and by the degreasing step including the degreasing tank 60, dirt such as oil adhering to the surface of the metal core 13-201111106 core wire is removed. Further, the aqueous solution accumulated in the degreasing tank 60 can be used as long as it is usually a user of the degreasing tank. The pickling tank 70 is, for example, a tank in which an aqueous solution of hydrochloric acid (HC1) is accumulated, and an acid layer (rust) adhering to the surface of the metal core wire 10 is removed by a pickling step including the pickling tank 70. Further, the aqueous solution accumulated in the pickling tank T0 can be used as long as it is a usual user of the pickling tank. The water washing tank 80 is a tank in which tap water, well water, and pure water are accumulated. By the water washing step including the water washing tank 80, the chemical solution adhering to the surface of the metal core wire 1 is diluted, thereby preventing the chemical liquid from being mixed into the next step. The step is the plating layer in the diamond electrodeposition step of the diamond. The plating tank 90 is a nickel-tungsten bath obtained by dispersing the diamond honing abrasive particles 30 in a solution in which nickel and tungsten are dissolved, and is responsible for honing the diamond in the metal core wire 1 〇. The cell of the electrodeposition step. The diamond electro-deposition step of the diamond granules will be described in detail below with reference to Fig. 6. The diamond granule electrodeposition step is carried out as shown in Fig. 6, by using the cation exchange film 91c' described later using a plating tank 90 which is formed into a double groove structure of the anode chamber 91 and the shovel chamber 92. The anode chamber 91 is composed of an insoluble anode 91a, a solution 91b, and a cation exchange membrane 91c which are connected to the anode of the power source 200. The insoluble anode 91a may be any user generally used as an insoluble anode such as stainless steel or uranium. As the solution 9 1 b, a nickel-14 - 201111106 salt, sulfuric acid or the like other than hydrochloric acid, nitric acid and a salt thereof can be used. Hydrochloric acid, nitric acid, and salts thereof can produce harmful chlorine and nitrous oxide gas on insoluble anodes, so they cannot be used. The cation exchange membrane 91c is a selective membrane for preventing direct contact between the insoluble anode 91a and the plating solution 92c to be described later, and for preventing oxidative decomposition of citric acid or the like which is an anion present in the plating solution 92c. In this manner, the plating solution 92c can be improved by performing the step of depositing the diamond granules by the cation exchange film 91c using the plating tank 90 separated into the double chamber structure of the anode chamber 91 and the plating chamber 92. Stability, and can be continuously plated for a long time. Further, since the hydrogen ions generated in the insoluble anode 91a are cations, they are supplied to the plating chamber 92 through the cation exchange membrane 91c in accordance with the energization flow rate. The plating chamber 92 is composed of a nickel anode 92a, a tungsten anode 92b, and a plating solution 92c connected to the anode of the power source 200. The nickel anode 92a is formed into a plate shape and used for supplying nickel ions to the plating solution 92c as shown in Fig. 6. As the nickel anode 92a, a well-known ammonium nickel plate such as electrolytic nickel or S-nickel can be used. Further, in the first embodiment, the nickel anode 92a is formed in a plate shape, but the configuration is not limited to such a configuration, and a chip-like configuration may be used. In the case of using a wafer, it is placed in a titanium basket. Further, since the dissolved state of the nickel anode 92a is a cation, the nickel anode 92a may be disposed in the anode chamber 91 without being disposed in the plating chamber 92. The tungsten anode 92b is formed into a plate shape and used to supply a tungsten component to the plating solution 92c as shown in Fig. 6. As the tungsten anode 92b, metal tungsten can be used. Further, in the first embodiment, the tungsten anode 92b has a plate-like configuration, but [S 1 -15 - 201111106 is not limited to such a configuration, and a wafer-like configuration may be used. In the case of a wafer, it is placed in a titanium basket. The plating solution 92c is a nickel-tungsten bath obtained by dissolving nickel and tungsten in an aqueous solution such as nickel sulfate and dispersing the diamond honing particles 30 (not shown). More specifically, the plating solution 92 c is composed of ammonium hydrogen citrate, sodium formate, nickel sulfate, and sodium tungstate. According to this configuration, since the plating bath has high stability and long life, it can be used as a method for producing a diamond wire saw which is excellent in productivity. Wherein, the ratio of nickel to tungsten in the nickel-tungsten bath is 1:9 to 9:1. With such a configuration, a nickel-tungsten plating film having sufficient hardness can be stably obtained. Using the plating solution 92c, as shown in Fig. 6, the metal core wire 10 is immersed in the plating solution 92c, the negative electrode of the power source 200 is connected to the metal core wire 10, and the anode of the power source 200 is connected to the insoluble anode 91a. The nickel anode 92a and the tungsten anode 92b are plated by appropriately selecting the current density and the plating time, whereby the plating layer 20 is formed on the outer surface 11 of the metal core wire 10, and the diamond honing particles 30 are dispersedly held. The washing tank 100 is a tank in which tap water, well water, and pure water are accumulated, and the metal core wire 10 is dispersed and held on the outer surface 1 1 by a water washing step including the water washing tank 100. After washing with water, heat treatment is performed by a heat treatment step (not shown) to produce a diamond wire saw 1. Further, the step of depositing the diamond granules is not limited to the first embodiment. For example, a groove may be provided between the water washing tank 80 and the plating tank 90 for using a nickel bath in which the diamond honing abrasive grains 30 are dispersed in a solution in which cerium is dissolved, and the flow is -16 - 201111106 The composition of electroplating. Further, in this case, in the plating solution 92c in which the diamond honing particles 30 are not dispersed in the plating tank 90, the diamond granules 30 are temporarily suspended by electroplating using a nickel bath. It is fixed to the outer surface of the metal core wire 10. Then by using nickel. The tungsten bath is electroplated, and the diamond granules 30 are actually fixed on the outer surface of the metal core wire 10. Therefore, the plating using the nickel-tungsten bath has low current efficiency and the upper limit of the applicable current density is also low, so Since plating using a nickel bath has a large amount of time required to form the same thickness, the plating time can be shortened by temporarily fixing the diamond honing particles 30 to the outer surface of the metal core wire 10 by a nickel bath. Therefore, it is possible to manufacture a diamond wire saw with good manufacturing efficiency. [Embodiment 1] Hereinafter, the present invention will be described in further detail by way of examples, but the present invention is not limited by the examples. The diamond wire saw 1 is manufactured by the steps shown in Figs. 5 and 6. Will have a diameter of 0. The 14-length long piano line is continuously immersed in the degreasing tank 60, the pickling tank 70, and the washing tank 80 at a conveying speed of 10 m/m in for degreasing treatment, and then separated into an anode chamber 91 and plated by a cation exchange membrane 91c. The plating tank 90 of the double-slot structure of the chamber 92 is subjected to the electroplating step of performing the electroplating of the diamond granules. The plating bath in the plating tank 90 is: diammonium hydrogen citrate 0. 4mol, sodium formate 0. 2mol, nickel sulfate 0. 2mol, sodium tungstate 0. 2mol. Further, the plating conditions were a bath temperature of 65 t, a current density of 10 A/dm 2 , and a time of 7. 5 points, pH 6. 0, the standard current efficiency is 55%. The diamond-coated granules dispersed in the plating bath are used to coat the enamel coating. -17- 201111106 'The nickel-plated diamond granules on the outer surface. The nickel plating amount of the diamond granules is 30 wt%, and the average particle diameter of the diamond granules 30 is 13. 4/z m. Put this diamond honing grain 30 to 0. 25 g/L was thrown into the plating chamber 92. After the step of electrodepositing the diamond granules, the metal core wire 10 after electrodeposition in the water washing tank 10 is further subjected to heat treatment at 600 degrees to obtain a diamond wire saw having a hardness of 1000 HV (Vickers hardness). . The surface of the diamond wire saw has a tungsten ratio of 40 wt%. As a reference, the hardening change of the heat treatment of tungsten 40 wt% nickel-tungsten alloy plating is shown in Fig. 7. [Example 2] A diamond wire saw was produced according to the steps shown in Figs. 5 and 6. Will have a diameter of 0. The 14-leg long piano line is continuously immersed in the degreasing tank 60, the pickling tank 70, and the washing tank 80 at a conveying speed of 10 m/min, and is subjected to a grease treatment, and then used in a plating tank (not shown). The abrasive grains 30 are dispersed in a nickel bath in which a solution of nickel is dissolved, and electroplating is performed. Among them, the nickel bath is 240 g/L of nickel sulfate 6 hydrate, 45 g/L of nickel chloride 6 hydrate, 30 g/L of boric acid, and the plating conditions are bath temperature 50 ° C, current density 20 A/dm 2 , time 1 Points, p Η 4 · 0. Further, the diamond honing particles 30 dispersed in the nickel bath are made of ore-nickel diamond granules coated with nickel on the outer surface. The nickel plating amount of the diamond granules is 30 wt%, and the average particle diameter of the diamond granules 30 is 13. 4/zm. Put this diamond honing grain 30 to 0. 25 g/L was charged with a solution in which nickel was dissolved. The result can be formed by electroplating with a nickel-tungsten bath. Nickel plating of the same thickness for 5 minutes. -18- 201111106 Then, by the cation exchange film 91c, the plating tank 90 which is separated into the double-groove structure of the anode chamber 91 and the plating chamber 92 is plated using a nickel-tungsten bath. Wherein, the plating bath of the plating tank 90 is diammonium hydrogen citrate 0,4 mol, sodium formate 0. 2mol, sulfuric acid town 0. 2mol, sodium tungstate 0. 2mole, the plating conditions are bath temperature 65 ° C, current density l 〇 A / dm2, time 3. 75 points, pH 6. 0, the standard current efficiency is 55%. Then, the metal core wire 10 is washed with water in the water washing tank 1 and further heat-treated at 600 degrees. As a result, a diamond wire saw having a hardness of 950 HV which is the same degree as the diamond wire saw shown in Example 1 was obtained. The proportion of tungsten on the surface of the diamond wire was 38% by weight. (Embodiment 2) First, a diamond wire saw according to Embodiment 2 of the present invention will be described with reference to Figs. 3 and 4 . The diamond wire saw 1 according to the second embodiment of the present invention is characterized in that the outer surface 11 of the metal core wire 10 is coated with the plating layer 20 as shown in Figs. 3 and 4, and the diamond steel wire is twisted. The abrasive grain 30 is dispersed and held by the diamond wire saw of the plating layer 20, and further coated with the metal film 40 on the outer surface of the diamond wire saw formed by the plating layer 20 and the diamond granules 30. All the diamond wire saws. The above-mentioned metal core wire 10 is capable of plating the outer surface 11 as long as it is any metal wire having a certain strength. For example, a steel wire such as a piano wire, a tungsten wire, a molybdenum wire, or the like can be used. The diameter of the metal core wire 10 can be appropriately changed depending on the material, shape, and the like of the material to be cut, but is 0. 05 min~0. 30 mm is preferred. The plating layer 20 is as shown in Fig. 4, and is coated with the outer surface 11 of the metal core wire 10201111106, and the diamond honing particles 30 are dispersed and held on the metal core wire 10. The plating layer 20 is composed of a nickel alloy such as nickel (Ni) or a nickel-tungsten alloy. Of course, it is not limited to nickel (Ni), as long as it is any metal or a commonly used alloy constituting a layer of a diamond wire saw, but as will be described later, an alloy is formed via the metal film 40 and a heat treatment step and a chemical bond is formed. It is better. The thickness of the plating layer 20 is preferably 5% to 90% of the diameter of the diamond honing particles 30 in the diameter direction of the metal core wire 10. Further, it is more preferably 25% to 80%, and more preferably 30%. As shown in Fig. 4, the diamond honing particles 30 are dispersed and held in the plating layer 2 so as to be embedded in the plating layer 20 on the outer surface 11 of the coated metal core wire 1 . The average particle size of the diamond granules 30 is preferably 1 m to 60 μm. According to this configuration, since the honing particle diameter is sufficiently small, the diamond honing grain 30 is not easily detached from the metal core wire 1 ,, and the diamond wire saw 1 having a good processing efficiency can be obtained. Further, when the average particle diameter is less than 1 μm, the honing particles are too small, so that the processing energy rate is lowered, and if it exceeds 60 μm, the honing particles are liable to fall off. Further, the lower limit is more preferably 2 μm or more, more preferably 3 #m or more, and the upper limit is 50/zm or less. Further, the coverage of the diamond honing particles 30 on the outer surface 11 of the metal core wire 1 is preferably 1% to 35%. According to this configuration, the coverage ratio can be limited to a sufficiently small range, and the elastic modulus of the gold wire -20-201111106 stone saw 1 which is dispersed and held by the diamond honing abrasive grains 30 becomes high and the rigidity becomes large. The situation is affected! In addition, the machining efficiency is further improved by ensuring that the sufficiently large cutting powder is evacuated, such as glass or crystal, which is liable to cause clogging. Further, the coverage ratio is more suitably from 1% to 25%, and more preferably more. The metal thin film 40 is coated with a metal thinner than the entire outer surface of the diamond wire saw 1 composed of the mineral deposit layer 20 and gold. As shown in Fig. 4, it is coated with the outer stone slab of the plating layer 20. The outer surface 31 of the abrasive grain 30 constitutes a diamond wire cutter. With this configuration, it is possible to more firmly hold the diamond slab which is plated on the outer surface 11 of the metal core wire 1 to be a diamond-like metal film 40 having high retainability of the diamond honing abrasive grains 30. It is composed of a metal selected from the group consisting of aluminum (A1), molybdenum (Mo 矽 (S i ), titanium (Ti), vanadium (V), tungsten (W), and lanthanum or two or more elements. With this configuration, the diamond wire saw is usually manufactured as the final step by 'Ming Ming (A1), Group (Mo 矽 (S i ), Titanium (Ti), Vanadium (V), Tungsten (W), Tantalum Since any of the metals is alloyed with nickel (Ni) capable of passing through the heat treatment step, it can be made to have a high wire saw 1. Therefore, it is possible to prevent disconnection during use. Further, aluminum (A1), molybdenum (Mo) ), yttrium (Nb), yttrium (vanadium (V) 'tungsten (W), yttrium (Y), zirconium (Zr), any one of the inhibitions, so even if the shape, it can be appropriate to 5% ~ 25 steel The granules 30, the film. More specifically, the surface 2 1 and the outer surface of the gold steel guide 1 are fully coated 20 to disperse the granules 30. Therefore, it is possible to saw 1.), bismuth (Nb), (Y), zirconium (Z) The heat of the alloy of Yucheng Steps), niobium (Nb), (Y), zirconium (Zr) and the diamonds forming the hardness of the coating layer Si), titanium (Ti), and metals are all in the form of a heat treatment step of -21-201111106 with carbon The formed monomer, that is, the diamond honing abrasive 30, reacts to become a carbonized metal. Therefore, it can be a diamond saw with a local hardness of 1°, so that it can be used as a diamond wire saw with good sharpness when used. 1. The metal film 40 is further formed by coating the metal foil 40 with the entire outer surface of the diamond wire saw 1 composed of the plating layer 20 and the diamond honing particles 30. Any of the metals of aluminum (A1), molybdenum (Mo), niobium (Nb)' (Si), titanium (Ti), vanadium (V), tungsten (W), niobium (Y), and chromium (Zr) In the manner of the heat treatment step, a chemical bond is formed between the mineral coating layer 20 composed of nickel (Ni) and the diamond honing abrasive particles 30. Therefore, it can become a diamond having high retention of the diamond honing particles 30. Wire saw 1. The thickness of the metal film 40 is 0. 001// m~l"m is better. If it is lower than O. OOl/zm, the retention of the diamond granules 30 is insufficient, and if it is more than 1 #m, good sharpness cannot be obtained when used. Thus, the thickness of the metal film 40 is as thin as O. In the case of OOlym to 1/zm, it is possible to obtain a diamond wire saw 1 which is formed by both the high retainability of the diamond granules and the sharpness of the use. In addition, the thickness of the metal film 40 is more suitably 0. 01// m~〇. 1/zm is better. Next, a method of manufacturing a diamond wire saw according to a second embodiment of the present invention will be described with reference to Fig. 8. The diamond wire saw 1 according to the second embodiment of the present invention is shown in a simplified manner in Fig. 8, and the core wire 10 is supplied from the supply source of the metal core wire 1 亦, that is, the roller core 50. By the pulley 51, the degreasing tank 60, the pickling tank 7〇, the water washing tank 80, the plating tank 90, the water washing tank 100, the metal thin film forming apparatus 3〇〇, the [S]-22-201111106 heat treatment apparatus 400, and the winding Manufactured by roller 52. The pulley 51 is used to change the direction in which the metal core wire 1 is changed. As shown in Fig. 8, the degreasing tank 60, the pickling tank 70, the washing tank 80, the plating tank 90, the washing tank 100, and the metal film are shown. A plurality of the forming device 300, the upper portion of the heat treatment device 400, and the inside of the tank are provided in the device. The degreasing tank 60 is a tank in which an aqueous solution of, for example, sodium hydroxide (n a Ο Η ) is accumulated, and the degreasing step of the degreasing tank 60 is provided to remove dirt such as oil adhering to the surface of the metal core wire 10 . Further, the aqueous solution accumulated in the degreasing tank 60 may be any user as long as it is any degreasing tank. The pickling tank 70 is a tank in which an aqueous solution of hydrochloric acid (HC1) is accumulated, and an acid layer (rust) adhering to the surface of the metal core wire 10 is removed by a pickling step including the pickling tank 70. Further, the aqueous solution accumulated in the pickling tank 70 may be any user as long as it is any pickling tank. The water washing tank 80 is a tank for storing tap water, well water, and pure water, and the chemical liquid adhering to the surface of the metal core wire 10 is diluted by the water washing step including the water washing tank 80, thereby preventing the chemical liquid from being mixed into the next step. That is, the plating layer in the step of electrodeposition of the diamond granules. The plating bath 90 is a groove for the electrodeposition step of the diamond slab abrasive grain for electroplating the metal core wire 10. The step of electroplating of the diamond granules is shown in a simplified manner in Fig. 8 by plating (with a nickel bath in which the diamond honing particles 30 are dispersed in the nickel-dissolved solution 92c). The metal core wire 10 of the groove 90 is connected to the negative electrode of the power source 200, and is connected to the positive electrode of the power source 200 by the nickel sausage pole 92a immersed in the plating tank 90. Further, although not shown in [S] -23-201111106, the plating bath and the electrode structure of the first embodiment of the present invention may be subjected to a ruthenium alloy coating such as a ruthenium-ruthenium alloy. Among them, the diamond granules 30 dispersed in the plating tank 90 are used before being treated in a cationic surfactant solution. With this configuration, the diamond honing particles 30 can be positively charged. Therefore, the diamond honing particles 30 can be adsorbed to the metal core wire 10 connected to the negative electrode by the adsorption effect of electric power (Coulomb force). Therefore, the diamond honing abrasive grains 30 adhering to the metal core wire 10 are not easily peeled off before the honing grain holding action by the plating is obtained, so that the plating speed is increased by the metal core wire 10 in the coating groove 90, It can improve manufacturing efficiency. Further, the transfer speed of the metal core wire 1 in the plating tank 90 is preferably lm/min to 100 m/min. Further, 'as a cationic surfactant, monoethanolamine, triethanolamine or the like can be used. By the diamond granule electrodeposition step, a plating layer 20 is formed on the outer surface 11 of the metal core wire 1 and gold is used. The steel stone honing particles 30 are dispersed and held on the plating layer 20. The water washing tank 100 is a tank in which tap water, well water, and pure water are accumulated, and the steel core 10 is dispersed and held on the outer surface 11 by the water washing step including the water washing tank 100. Washed. The metal thin film forming apparatus 300 is responsible for the entire outer surface of the metal core wire 10 which is formed by depositing the diamond honing abrasive particles 30 in a dispersed state by a diamond granule electrodeposition step. A metal film 4 〇 coated metal film coating step device. The metal thin film forming apparatus 300 is not illustrated in detail in Fig. 8, but it is attached to the outer surface of the metal core 10 which is plated in a state in which the diamond honing particles 30 are dispersed. A device for forming a metal thin film 40 by sputtering. In this way, by the metal film coating step, the outer surface of the metal core wire 10 which is formed by depositing the diamond honing particles 30 in a dispersed state by a diamond granule electrodeposition step is further made of metal. In the state in which the film 40 is covered, the diamond granules 30 which are dispersed and held by the plating layer 20 on the outer surface 11 of the metal core wire 10 can be more firmly held. Therefore, it is possible to become a diamond wire saw 1 having high retention of the diamond honing grain 30. As the metal constituting the metal thin film 40, one selected from the group consisting of aluminum (Α1), molybdenum (Mo), niobium (Nb), bismuth (Si), titanium (Ti), vanadium (V), and tungsten (W)' 钇 ( Y), a metal composed of one element of zirconium (Zr) or an alloy composed of two or more elements. The thickness of the metal film 40 is 0. 001# m~1/zm is preferred. If it is lower than 0. At 001/zm, the retention of the diamond granules 30 is insufficient. If it is more than 1 // m, good sharpness cannot be obtained when used. Thus, the thickness of the metal film 40 is as thin as O. In the case of OOlym~l/zm, it is possible to obtain a diamond wire saw 1 which is formed by both the high retainability of the diamond honing abrasive grain 30 and the good sharpness at the time of use. In addition, the thickness of the metal film is more suitably 0. 01/z m~o. i# good. Further, in the second embodiment, the metal thin film 40 is formed by vacuum plating, that is, the dicing method. However, the present invention is not limited to such a configuration, and may be by pVD (physical vapor deposition method) or CVD (chemical vaporization). Other vacuum electroless plating such as plating) forms a metal thin film 40. . The heat treatment apparatus 400 is responsible for coating the entire outer surface of the metal core wire 10 in which the -25-201111106 diamond honing abrasive particles 30 are dispersed in a state of being coated by the metal thin film, and coating the metal core film 40. A device for performing a heat treatment step of heat treatment in a state. The heat treatment step is carried out to obtain the following effects. First, aluminum (A1), molybdenum (Mo), niobium (Nb), bismuth (Si), titanium (Ti), vanadium (V), tungsten (W), ytterbium (Y), and pin (Zr) constituting the metal thin film 40. Any of the metals is formed by forming a nickel (Ni) and an alloy constituting the plating layer 20 via a heat treatment step. Therefore, it can be a diamond wire saw i having high hardness. Therefore, it can prevent disconnection during use. Further, aluminum (A1), molybdenum (Mo), niobium (Nb), bismuth (Si), titanium (Ti), fL (V), tungsten (W), ytterbium (Y), and pin (Zr) constituting the metal thin film 40. Any of the metals is reacted by means of a heat treatment step to react with a monomer composed of carbon, that is, diamond granules 30, to become a metal carbide. Therefore, it can be a diamond wire saw 1 having high hardness. Therefore, it can be used as a diamond saw with a good sharpness at 1°, and aluminum (A1), molybdenum (Mo), niobium (Nb), sand (Si), niobium (Ti), which constitute the metal thin film 40, Any of the metals (V), crane (W), Ji (Y), and pin (Zr) are coated with a layer of nickel (Ni) and a diamond by a heat treatment step. A chemical bond is formed between the 30s. Therefore, it is possible to become a diamond wire saw 1 having high retention of the diamond honing particles 30. Further, the heat treatment conditions such as the temperature and time of the heat treatment step are appropriately set depending on the material of the metal core wire 1〇 and the type of the metal or alloy of the metal film 40. The diamond wire saw 1 is manufactured through the above steps. -26-201111106 [Embodiment 3] Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited by the examples. The diamond wire saw 1 is manufactured by the steps shown in Fig. 8. Will have a diameter of 0. The 14-brain long piano line is continuously immersed in the degreasing tank 70, the pickling tank 80, and the washing tank 90 at a conveying speed of l〇m/min to perform a grease treatment, and is then plated in a plating bath 100 having a nickel bath. The step of electrodepositing the diamond granules. . Here, the nickel bath of the plating tank 100 is 240 g/L of nickel sulfate hexahydrate, 45 g/L of nickel chloride hexahydrate, and 30 g/L of boric acid. In the nickel bath, a diamond grit granule treated with a concentration of 1 g/L in a cationic surfactant solution was charged. The average particle size of the diamond granules 30 is 13. 4 μm, as a cationic surfactant, a mixture of monoethanolamine and triethanolamine can be used. Further, the plating conditions were a bath temperature of 50 ° C, a current density of 20 A/dm 2 , and a time of 90 seconds. Thereby, a diamond wire saw having a plating thickness of 6 yin was obtained. And by sputtering method. Titanium (Ti) having a thickness of 〇5/zm was applied to the entire outer surface of the diamond wire saw. Then, heat treatment was performed at 500 ° C for 30 seconds to obtain a diamond wire saw 1 . The diamond wire saw of the present invention produced as described above can be used as a wire saw tool for cutting a highly brittle material such as a slab ingot. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a part of a diamond wire saw according to a first embodiment of the present invention. -27-201111106 Fig. 2 is a cross-sectional view of the diamond wire saw according to the first embodiment of the present invention, wherein (a) is a cross-sectional view of the axis of the diamond wire saw in a right angle direction, and (b) is a diamond wire. An enlarged cross-sectional view of a portion of the saw shaft in a right angle direction. Fig. 3 is a perspective view showing a part of a diamond wire saw according to a second embodiment of the present invention. Figure 4 is a cross-sectional view of a diamond wire saw according to a second embodiment of the present invention, and (a) is a cross-sectional view taken in the direction perpendicular to the axis of the diamond wire saw. Fig. (b) is an enlarged cross-sectional view showing a portion of the axis of the diamond wire saw in a right angle direction. Fig. 5 is a view showing the simplification of the manufacturing steps of the diamond wire saw according to the first embodiment of the present invention. Fig. 6 is a schematic view showing the steps of electrodepositing the diamond granules in the step of manufacturing the diamond wire saw according to the first embodiment of the present invention. Fig. 7 is a graph showing the hardening change at the time of heat treatment of the tungsten-tungsten alloy plating of 4 wt% of tungsten in the first embodiment of the present invention. Fig. 8 is a schematic view showing the steps of manufacturing a diamond wire saw according to Embodiment 2 of the present invention. [Main component symbol description] 1 Diamond wire saw 10 Metal-44- Heart line 11' 2 1、3 1 Outer surface 20 > 32 Plating layer 30 Diamond 硏 abrasive grain 40 Metal film 50, 52 Roller 5 1 Pulley-28- 201111106 60 Dehydrated 70 Acid 80 Water 90 Plating 9 1 Yang 9 1a Not 9 1b Dissolving 9 1c Yang 92 Plating 92a Nickel 92b Crane 92c Plating 100 Water 200 Electricity 3 00 Gold 400 Hot grease tank washing tank The coating chamber is dissolved in the anolyte liquid exchange membrane coating chamber anode anode solution solution washing tank source is a film forming device processing device -29-